Camera Module and Array Camera Module with Circuit Board Unit and Photosensitive Unit and Manufacturing Method Thereof

ABSTRACT

A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

CROSS REFERENCE OF RELATED APPLICATION

This application is a Continuation application that claims the benefitof priority under 35 U.S.C. §119 to a non-provisional application,application Ser. No. 15/075,192, filed Mar. 20, 2016, which isincorporated herewith by reference in its entity.

NOTICE OF COPYRIGHT

A portion of the disclosure of this patent document contains materialwhich is subject to copyright protection. The copyright owner has noobjection to any reproduction by anyone of the patent disclosure, as itappears in the United States Patent and Trademark Office patent files orrecords, but otherwise reserves all copyright rights whatsoever.

BACKGROUND OF THE PRESENT INVENTION

Field of Invention

The present invention relates to the field of camera module, and moreparticularly to a single and/or array camera module with circuit boardunit and photosensitive unit and the manufacturing method thereof.

Description of Related Arts

COB (Chip On Board, chip packaging) technique is a very importanttechnical process in the process of assembling and producing cameramodule. A camera module produced by means of the conventional COBtechnique is assembled of a circuit board, a photosensitive sensor, alens holder, a motor drive, and a camera lens.

FIG. 1 refers to a perspective view of a camera module produced by meansof the conventional COB technique. The camera module includes a circuitboard 1P, a sensor 2P such as a photosensitive chip, a lens holder 3P,an optical filter 4P, a motor 5P, and a camera lens 6P. The sensor 2P isinstalled on the circuit board 1P. The optical filter 4P is installed onthe lens holder 3P. The camera lens 6P is installed on the motor 5P. Themotor 5P is installed on the lens holder 3P, so that the camera lens 6Pis positioned along a photosensitive path of the sensor 2P.

It is worth mentioning that there is often a plurality of circuitcomponents 7P, such as resistors, capacitors, and etc., installed on thecircuit board 1P. These circuit components 7P protrude from the surfaceof the circuit board 1P. However, the lens holder 3P has to be mountedon the circuit board 1P with the circuit components 7P. According to theconventional COB technology, there are disadvantages in the assemblingand coordination relationships among the circuit board 1P, the circuitcomponents 7P, and the lens holder 3P, which also restrict thedevelopment for the camera module to become lighter and thinner.

It is also worth mentioning that the sensor 2P is usually electricallyconnected with the circuit board 1P with conductive elements such asgold wires 8P for data transmission between the sensor 2P and thecircuit board 1P. Based on the feature and structure of the gold wires8P, the gold wires 8P are usually curvedly bent and protruded from thesurface of the circuit board 1P. Therefore, the assembling process ofthe sensor 2P, like the circuit components 7P, has the similar adverseeffects to the camera module.

In particular, firstly, the circuit components 7P and the gold wires 8Pare directly exposed on the surface of the circuit board 1P. As aresult, they will inevitably be affected during the subsequentassembling processes, such as adhering the lens holder 3P, soldering themotor 5P, and etc., wherein solder resists, dusts and etc. during thesoldering process may easily stick to the circuit components 7P.Besides, because the circuit components 7P and the sensor 2P areconnected and provided in a common space, those dusts and pollutants caneasily and adversely affect the sensor 2P that can result in undesirableoccurrences such as dark spots of the assembled camera module, whichincreases the defective rate of the camera module.

Secondly, the conventional lens holder 3P is positioned at the outerside around the circuit components 7P. Therefore, to mount the lensholder 3P on the circuit board 1P, a safe distance is required to bereserved between the lens holder 3P and the circuit components 7P inboth horizontal direction and upward direction, that results inincreasing the thickness of the camera module and the difficulty to thethickness reduction of the camera model.

Thirdly, during the COB assembling process, the lens holder 3P or themotor 5P is adhered on the circuit board 1P with adhesive material, suchas glue. During the adhering, an Active Arrangement (AA) technique isusually required to adjust the central axis lines of the sensor 2P andthe camera lens 6P being aligned coincidentally in both horizontal andvertical directions. Therefore, in order to satisfy the practice of theAA technique, it is required to additionally provide more glue betweenthe lens holder 3P and the circuit board 1P as well as between the lensholder and the motor 5P, so as to reserve adjustment space between eachother. Nevertheless, this adjustment space requirement will not onlyfurther increase the thickness of the camera module, rendering itsubstantially being more difficult to reduce the thickness of the cameramodule, but also cause tilt discrepancy of the assembling more easilyduring such multiple adhering process. Moreover, it further requires ahigher evenness for the lens holder 3P, circuit board 1P and motor 5P.

In addition, in the conventional COB technology, the circuit board 1Pforms the basic affixing and supporting body for the camera module, sothat the circuit board 1P is required to have a predetermined structuralstrength. This requirement makes the circuit board 1P having a largerthickness, which also increases the thickness of the camera module fromanother aspect.

Along with the development of all kinds of electronic product and smartdevice, camera modules are also developed to achieve higher performanceand more compact size. Meanwhile, in order to meet the variousrequirements of high performance development, including high resolutionand high image quality, more and more electronic components are providedin the circuit, the size and surface area of the sensor becomes largerand larger, and the passive components, such as driving resistors andcapacitors, are correspondingly increased. As a result, the size of theelectronic device becomes larger and larger, the assemble difficultythereof increases accordingly, and the overall size of the camera modulebecomes bigger and bigger. In view of the above factors, theconventional assembling method of the lens holder, circuit board, andcircuit components becomes a great restriction, to a certain extent, tothe development of a lighter and thinner camera module.

Referring to FIG. 29, a sectional perspective view of an array(twin-lens) camera module assembled by the above conventional COBassembling method is illustrated.

Currently, most electronic products tend to have more functionsintegrated, that creates more and more cross-categorical products. Forexample, cellular phones have been transformed from communicationdevices to highly integrated mobile electronic devices that integrallyachieve the diverse and multi-dimensional functions of communication,photography, internet accessing, navigation, and etc.

However, the camera module installed in the current mobile electronicdevices is usually a single lens camera module that can no longersatisfy the user's multi-functional application demand of the mobileelectronic device in both image quality and effects of photography.

Accordingly, camera module with more than one lens, for example arraycamera module such as twin-lens camera module, is provided to produceshooting modes that imitate the arrangement of the two eyes of a humanbeing. Moreover, such twin-lens camera module provides betterperformances than the single lens camera module in 3D photographing andscanning, gesture position recognition, naturalness of color,auto-focusing, panoramic and deep photography, bokeh photography, andetc. Therefore, it will be an important direction of development in thecamera module industry to have camera module with more than one cameralens. When a twin-lens camera module is capturing images, it utilizestwo imaging modules that are different in spatial positions torespectively capture images from two positions. Then the imagesrespectively captured by these two imaging modules are synthesizedaccording to an image synthesis process, so as to bring a final image ofthe multi-lens camera module. It is understandable that, in thisprocess, the consistency of the image effect of the resolution, theshading, the color, and etc. of each camera module of the multi-lenscamera module and the deviances in the horizontal, vertical andlongitudinal directions are important factors to judge the image qualityof the twin-lens camera module.

However, currently, the structure and technology of manufacturing andassembling the twin-lens camera module are far away from ensuring theimage quality of the twin-lens camera module as demanded. FIG. 29illustrates a twin-lens camera module made by the conventionalassembling method, which includes a circuit board 10P, two lens holders20P, and two imaging modules 30P, wherein each of the imaging modules30P includes a motor-camera lens unit 31P. The lens holder 20P isindependently arranged at the same side of the circuit board 10P andconnected with the other lens holder 20P by means of the circuit board10P. The motor-camera lens units 31P are arranged on the lens holders20P respectively so as to be supported by the lens holders 20Prespectively. It is understandable that, according to the conventionalassembly technology for the twin-lens camera module, since each lensholder 20P is independently adhered on the circuit board 10P, it isreally difficult to control the dimensions, positions and etc. betweenthe lens holders 20P. As a consequence, the consistency of theparameters, such as the dimensions and positions between the frames ofthe twin-lens camera modules, is poor. In view of the structure of theconventional twin-lens camera module, each lens holder 20P isindependent by itself and merely connected to the circuit board 10P.Nonetheless, the circuit board 10P is usually a PCB, printed circuitboard, which is relatively soft and easy to be distorted, that it isdifficult to ensure the overall rigidity of the conventional twin-lenscamera module. In addition, during the usage after the twin-lens cameramodule is assembled, such independent structure can easily cause highpositioning tolerance and instability of the relative dimensions amongthe elements, such as the motor-camera lens units 31P, of the imagingmodule 30P. Moreover, other problems, like the photosensitive axis ofthe imaging module 30P easily deviating from the designated position,may easily happen. Once any of these situation occurs, the image qualityof the twin-lens camera module will be adversely affected. For example,there are uncontrolled factors or bigger adverse impacts to the finalimaging effect of the image synthesis.

Besides, the assembling of the multi-lens camera module is based on theconventional Chip On Board (COB) technology, wherein there are usuallyprotruded circuit components 11P on the circuit board 10P. The circuitboard 10P also comprises a photosensitive element such as a sensor 12Pmounted thereon. The sensor 12P is usually connected to the circuitboard 10P with conductive elements such as gold wires 121P which arenormally curvedly protruded from the circuit board 10P. As a result,these protruding circuit components 11P and gold wires 121P also causecertain disadvantageous factors to the assembling of the camera module.

The circuit components 11P and the gold wires 121P are directly exposedon the surface of the circuit board 10P. Accordingly, they inevitablyaffect the subsequent assembling processes, such as the adhering thelens holders 20P, soldering the motor-camera lens units 31P, and etc.,wherein solder resist, dust and etc. from the soldering process caneasily stick on the circuit components 11P. Besides, because the circuitcomponents 11P and the sensors 12P are disposed in a common space, thedusts and pollutants can easily affect the sensors 12P and suchinfluences can result in undesirable occurrences such as dark spots ofthe assembled camera module that decreases the product yield rate.

In addition, the lens holders 20P are positioned at the outer side ofthe circuit components 11P. Therefore, to adhere the lens holders 20P onthe circuit board 10P, a predetermined safety distance must be reservedamong the lens holders 20P and the circuit components 11P in bothhorizontal direction and upward direction, that substantially increasesthe thickness of the twin-lens camera module and the difficulty toreduce the thickness of the twin-lens camera model.

Besides, comparing to the single-lens camera module, the multi-lenscamera module relates to issues of coordination between multiple cameramodules. The photosensitive axises among all camera lenses are requiredto be consistent. However, the consistency of the photosensitive axes ofmultiple camera lens modules based on the traditional COB technology ishard to be ensured. Furthermore, the overall size of a conventionalmulti-lens camera module is larger, which is more sensitive to thestrength and smoothness of the circuit board and, therefore, the circuitboard is thicker.

SUMMARY OF THE PRESENT INVENTION

An object of the present invention is to provide a camera module andarray camera module with circuit board unit and photosensitive unit andmanufacturing method thereof, wherein the photosensitive unit includesan encapsulation portion and a photosensitive portion. The encapsulationportion is encapsulated to form on the photosensitive portion.

An object of the present invention is to provide a camera module andarray camera module with circuit board unit and photosensitive unit andmanufacturing method thereof, wherein the photosensitive portion of thephotosensitive unit includes a sensor and a main circuit board. Thesensor electrically connects to the main circuit board through at leasta connecting element and the encapsulation portion of the photosensitiveunit wraps up the connecting element to prevent it from being directlyexposed to the outside.

An object of the present invention is to provide a camera module andarray camera module with circuit board unit and photosensitive unit andmanufacturing method thereof, wherein the connecting elements areintegrally enclosed, encapsulated and/or wrapped up in the encapsulationportion through a molding manufacturing process.

An object of the present invention is to provide a camera module andarray camera module with circuit board unit and photosensitive unit, andmanufacturing method thereof, wherein the photosensitive unit includesat least one circuit element. The circuit element is enclosed,encapsulated and/or wrapped up in the encapsulation portion, so as toprevent it from being directly exposed to the outside.

An object of the present invention is to provide a camera module andarray camera module with circuit board unit and photosensitive unit andmanufacturing method thereof, wherein the circuit element is integrallyenclosed, encapsulated and/or wrapped up in the encapsulation portionthrough a molding manufacturing process.

An object of the present invention is to provide a camera module andarray camera module with circuit board unit and photosensitive unit andmanufacturing method thereof, wherein the sensor of the photosensitiveunit has a photosensitive portion and a non-photosensitive portion. Thenon-photosensitive portion of the sensor is molded by the encapsulationportion to reduce the size of the photosensitive unit and the assembledcamera module.

An object of the present invention is to provide a camera module andarray camera module with circuit board unit and photosensitive unit andmanufacturing method thereof, wherein the main circuit board has atleast an inner groove and the sensor of the photosensitive unit isinstalled in the inner groove, so as to reduce a height of theencapsulation portion as demanded.

An object of the present invention is to provide a camera module andarray camera module with circuit board unit and photosensitive unit andmanufacturing method thereof, wherein the encapsulation portion includesan enclosure section and an optical filter installation section, whereinthe installation section is integrally connected with enclosure sectionby molding, wherein the installation section is adapted to install anoptical filter so that no additional optical filter mounting frame isrequired.

An object of the present invention is to provide a camera module andarray camera module with circuit board unit and photosensitive unit andmanufacturing method thereof, wherein the photosensitive unit comprisesat least an optical filter and the optical filter is molded on thesensor of the photosensitive unit so as to protect the sensor throughthe optical filter, wherein the back focal length of the camera moduleafter assembled is reduced that further reduces the height of the cameramodule.

An object of the present invention is to provide a camera module andarray camera module with circuit board unit and photosensitive unit andmanufacturing method thereof, wherein the photosensitive unit comprisesa reinforced layer, wherein the reinforced layer is overlappedlyattached to a bottom side of the main circuit board so as to enhance astructural strength of the main circuit board, that allows the use of athinner main circuit board while enhancing the thermal dissipationability of the main circuit board.

An object of the present invention is to provide a camera module andarray camera module with circuit board unit and photosensitive unit andmanufacturing method thereof, wherein the main circuit board has atleast a reinforced hole therein, wherein the encapsulation portionextends into the reinforced hole so as to enhance the bonding strengthbetween the encapsulation portion and the photosensitive unit andincrease the structural strength of the main circuit board.

An object of the present invention is to provide a camera module andarray camera module with circuit board unit and photosensitive unit andmanufacturing method thereof, wherein the encapsulation portion isadapted for mounting a motor or a camera lens thereon, functioning as aconventional frame that supports the motor or the camera lens inposition. Besides, the encapsulation portion is molded to form andprovide a better smoothness and evenness that substantially reduces thetilt deviation during the assembling of the camera module.

An object of the present invention is to provide a camera module andarray camera module with circuit board unit and photosensitive unit andmanufacturing method thereof, wherein the camera module is assembled andproduced by molding that improves the conventional COB technique of thecamera module.

An object of the present invention is to provide a camera module andarray camera module with circuit board unit and photosensitive unit andmanufacturing method thereof, wherein the photosensitive circuit unit ismanufactured by molding, so that an integral and molded photosensitiveunit is achieved.

An object of the present invention is to provide a camera module andarray camera module with circuit board unit and photosensitive unit andmanufacturing method thereof, wherein the circuit board unit includes aconjoined encapsulation portion and a circuit board portion. Theconjoined encapsulation portion is encapsulated to form on the circuitboard portion. The conjoined encapsulation portion is adapted forinstalling multiple camera lenses.

An object of the present invention is to provide a camera module andarray camera module with circuit board unit and photosensitive unit andmanufacturing method thereof, wherein the circuit board unit includes amain circuit board and at least one circuit element protruded from themain circuit board. The circuit elements are encapsulated and enclosedby the conjoined encapsulation portion so as to prevent them from beingdirectly exposed to the outside.

An object of the present invention is to provide a camera module andarray camera module with circuit unit and photosensitive unit andmanufacturing method thereof, wherein the array camera module includes aplurality of photosensitive sensors and the conjoined encapsulationportion is deployed surrounding the outer edges of each of thephotosensitive sensors.

An object of the present invention is to provide a camera module andarray camera module with circuit unit and photosensitive unit andmanufacturing method thereof, wherein the conjoined encapsulationportion includes an optical filter installing section that is adaptedfor installing a plurality of optical filters without the need of anyextra independent supporting component.

An object of the present invention is to provide a camera module andarray camera module with circuit unit and photosensitive unit andmanufacturing method thereof, wherein the main circuit board has aplurality of inner grooves, wherein each photosensitive sensor isdisposed in of the respective inner groove, that substantially reduces arelative height of the photosensitive sensor and the main circuit board,and thus the height demand to the conjoined encapsulation portion isreduced.

An object of the present invention is to provide a camera module andarray camera module with circuit unit and photosensitive unit andmanufacturing method thereof, wherein the main circuit board has aplurality of passages and a plurality of outer grooves communicatingwith the passages respectively, wherein each of the outer groove isadapted for installing the respective photosensitive sensor in aninversion manner.

An object of the present invention is to provide a camera module andarray camera module with circuit unit and photosensitive unit andmanufacturing method thereof, wherein the circuit board portion includesa reinforced layer overlappedly provided on the bottom of the maincircuit board to enhance the structural strength and heat dissipation ofthe main circuit board.

An object of the present invention is to provide a camera module andarray camera module with circuit unit and photosensitive unit andmanufacturing method thereof, wherein the main circuit board has atleast a reinforced aperture, wherein the conjoined encapsulation portionextends into the reinforced aperture to enhance the structural strengthof the main circuit board.

An object of the present invention is to provide a camera module andarray camera module with circuit unit and photosensitive unit andmanufacturing method thereof, wherein the conjoined encapsulationportion includes an camera lens installing section provided asinstallation site for installing a plurality of camera lenses.

An object of the present invention is to provide a camera module andarray camera module with circuit unit and photosensitive unit andmanufacturing method thereof, wherein the photosensitive unit includes aconjoined encapsulation portion and a photosensitive portion. Thephotosensitive portion includes a main circuit board and aphotosensitive sensor. The photosensitive sensor is molded to connect tothe main circuit board by means of the conjoined encapsulation portion.

An object of the present invention is to provide a camera module andarray camera module with circuit unit and photosensitive unit andmanufacturing method thereof, wherein the photosensitive sensor iselectrically connected to the main circuit board through at least oneconnecting element which is wrapped up and encapsulated by the conjoinedencapsulation portion.

An object of the present invention is to provide an array camera moduleand its molded circuit unit and photosensitive unit and manufacturingmethod thereof, wherein the photosensitive sensor has a photosensitivearea and a non-photosensitive area. The conjoined encapsulation portionis extended to the non-photosensitive area that inwardly extends themolding area of the conjoined encapsulation portion to cover the outeredges of the photosensitive unit.

An object of the present invention is to provide an array camera modulewith circuit unit and photosensitive unit and manufacturing methodthereof, wherein the molded circuit unit includes a main circuit boardand at least one circuit element. The circuit element protruded from themain circuit board is wrapped and encapsulated by the conjoinedencapsulation portion, so as to avoid from being directly exposed tooutside.

An object of the present invention is to provide an array camera modulewith circuit unit and photosensitive unit and manufacturing methodthereof, wherein the conjoined encapsulation portion includes an opticalfilter installing section adapted for installing a plurality of opticalfilters without the need of any extra independent supporting part.

An object of the present invention is to provide an array camera modulewith circuit unit and photosensitive unit and manufacturing methodthereof, wherein the main circuit board has a plurality of innergrooves, wherein each photosensitive sensor is disposed in therespective inner groove to reduce the relative height of thephotosensitive sensor and the main circuit board, so as to meet theheight reduction demand of the conjoined encapsulation portion.

An object of the present invention is to provide an array camera modulewith circuit unit and photosensitive unit and manufacturing methodthereof, wherein the main circuit board has a plurality of passages anda plurality of outer grooves communicating with the passagesrespectively, wherein each of the outer grooves is adapted forinstalling the photosensitive sensor in an inversion manner.

An object of the present invention is to provide an array camera modulewith circuit unit and photosensitive unit and manufacturing methodthereof, wherein the circuit board portion includes a reinforced layeroverlappedly provided on the bottom of the main circuit board to enhancethe structural strength and heat dissipation of the main circuit board.

An object of the present invention is to provide an array camera modulewith circuit unit and photosensitive unit and manufacturing methodthereof, wherein the main circuit board has at least a reinforcedaperture, wherein the conjoined encapsulation portion is extended intothe reinforced aperture to enhance the structural strength of the maincircuit board.

An object of the present invention is to provide an array camera modulewith circuit unit and photosensitive unit and manufacturing methodthereof, wherein the conjoined encapsulation portion includes a cameralens installing section providing one or more installation sites adaptedfor installing a plurality of camera lenses respectively.

In order to achieve the above objects and other objects and advantagesof the present invention, the present invention, from an aspect,provides a camera module which includes a camera lens and aphotosensitive unit, wherein the photosensitive unit includes anencapsulation portion and a photosensitive portion. The photosensitiveportion includes a main circuit board and a photosensitive sensor. Theencapsulation portion is encapsulated to form on the main circuit boardand surround the photosensitive sensor. The camera lens is installedalong a photosensitive path of the photosensitive sensor.

According to a preferred embodiment of the present invention, theencapsulation portion of the camera module has a window corresponding tothe photosensitive sensor so as to provide the photosensitive sensor alight path thereof.

According to a preferred embodiment of the present invention, a topportion of the encapsulation portion is adapted for installing theframe, optical filter, camera lens or motor of the camera module.

According to a preferred embodiment of the present invention, thephotosensitive portion of the camera module comprises at least oneconnecting element. Each connecting element electrically connects thephotosensitive sensor with the main circuit board. The encapsulationportion wraps up and encloses the connecting element to avoid theconnecting element from being directly exposed to outside.

According to a preferred embodiment of the present invention, thephotosensitive sensor of the camera module includes a photosensitivearea and a non-photosensitive area, wherein the non-photosensitive areais positioned around the periphery of the photosensitive area. Theencapsulation portion is molded to extend to the non-photosensitive areaof the photosensitive sensor to inwardly expand the molding area toreduce an overall dimension of the encapsulation portion.

According to a preferred embodiment of the present invention, thephotosensitive portion in the camera module comprises at least onecircuit element protruded from the main circuit board. The encapsulationportion encapsulates and wraps up the circuit element to prevent thecircuit element from being directly exposed to outside.

According to a preferred embodiment of the present invention, thephotosensitive portion in the camera module comprises an optical filtercovering the photosensitive sensor. The encapsulation portion isencapsulated to form on the main circuit board and surround thephotosensitive sensor and the optical filter, so as to protect thephotosensitive sensor with the optical filter and reduce a back focallength and a height of the camera module.

Another aspect of the present invention provides an array camera module,which comprises at least two camera lenses and a circuit unit, whereinthe circuit unit comprises a circuit board portion for electricallyconnecting at least two photosensitive sensors of the array cameramodule and a conjoined encapsulation portion integrally encapsulated atthe circuit board portion, wherein the camera lenses are respectivelyarranged along photosensitive paths of the photosensitive sensors.

According to a preferred embodiment of the present invention, theencapsulation portion of the array camera module has at least twowindows formed corresponding to the at least two photosensitive sensorsrespectively, so as to provide light paths for the photosensitivesensors.

According to a preferred embodiment of the present invention, thecircuit board portion in the array camera module comprises at least onecircuit element protruded from the main circuit board. The conjoinedencapsulation portion encapsulates and wraps up the circuit element toprevent the circuit element from being directly exposed to outside.

According to a preferred embodiment of the present invention, thecircuit unit of the array camera module comprises at least two motorconnecting structures, each of which comprises a lead wire. The leadwire is disposed in the conjoined encapsulation portion and electricallyconnected with the main circuit board. The lead wire comprises a motorcoupling end revealed on the conjoined encapsulation portion forconnecting a motor terminal.

According to a preferred embodiment of the present invention, thecircuit unit of the array camera module comprises at least two motorconnecting structures, each of which comprises a lead wire and aterminal slot. The lead wire is arranged on the conjoined encapsulationportion and electrically connected with the main circuit board. Theterminal slot is provided in a top portion of the conjoinedencapsulation portion. The lead wire comprises a motor coupling endwiring on a bottom wall of the terminal slot, so as to allow a motorterminal to electrically connect with the motor coupling end when themotor terminal is inserted in the terminal slot.

According to a preferred embodiment of the present invention, thecircuit unit of the array camera module comprises at least two motorconnecting structures, each of which comprises a terminal slot and acircuit junction. The circuit junction is electrically connected withthe main circuit board. The terminal slot is provided in the conjoinedencapsulation portion and extended from the main circuit board to thetop of the conjoined encapsulation portion. The circuit junction isrevealed at the terminal slot so as to allow a motor terminal toelectrically connect with the circuit junction when the motor terminalis inserted in the terminal slot.

According to a preferred embodiment of the present invention, thecircuit unit of the array camera module comprises at least two motorconnecting structures, each of which comprises a carving line. Thecarving line is provided on the conjoined encapsulation portion andelectrically connected with the main circuit board for electricallyconnecting a motor terminal.

Another aspect of the present invention provides an array camera modulewhich includes at least two camera lenses and a photosensitive unit,wherein the photosensitive unit includes a conjoined encapsulationportion and a photosensitive portion. The photosensitive portionincludes a main circuit board and at least two photosensitive sensors.The conjoined encapsulation portion integrally encapsulates the maincircuit board and surrounds each photosensitive sensor. The cameralenses are respectively deployed along photosensitive paths of thephotosensitive sensors.

According to a preferred embodiment of the present invention, theencapsulation portion of the array camera module has at least twowindows provided corresponding to the at least two photosensitivesensors, so as to provide light paths for the photosensitive sensors.

According to a preferred embodiment of the present invention, thephotosensitive portion comprises at least one connecting element in thearray camera module. Each of the connecting elements electricallyconnects the photosensitive sensor with the main circuit board. Theconjoined encapsulation portion encapsulates and wraps up the connectingelement to avoid it from being directly exposed to outside.

According to a preferred embodiment of the present invention, thephotosensitive sensor of the camera module includes a photosensitivearea and a non-photosensitive area, wherein the non-photosensitive areais positioned around the periphery of the photosensitive area. Theconjoined encapsulation portion is molded to extend to thenon-photosensitive area of the photosensitive sensor so as to expand themolding area of the conjoined encapsulation portion inwardly to reducethe overall dimension of the conjoined encapsulation portion.

According to a preferred embodiment of the present invention, thephotosensitive portion in the array camera module comprises at least onecircuit element protruded from the main circuit board. The conjoinedencapsulation portion encapsulates and wraps up the circuit element toprevent the circuit element from being directly exposed to outside.

According to a preferred embodiment of the present invention, thephotosensitive unit of the array camera module includes at least twooptical filters, wherein the optical filters are integrally encapsulatedwith the photosensitive sensors respectively.

Still further objects and advantages will become apparent from aconsideration of the ensuing description and drawings.

These and other objectives, features, and advantages of the presentinvention will become apparent from the following detailed description,the accompanying drawings, and the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view illustrates the conventional COB technique ofcamera module.

FIG. 2 is a perspective view of a photosensitive unit according to afirst preferred embodiment of the present invention.

FIG. 3 is a sectional view of a photosensitive unit according to theabove first preferred embodiment of the present invention.

FIG. 4 is a manufacturing process diagram of a photosensitive unitaccording to the above first preferred embodiment of the presentinvention.

FIG. 5 is a block diagram of a photosensitive unit according to theabove first preferred embodiment of the present invention.

FIG. 6 is a sectional view of the camera module according to the abovefirst preferred embodiment of the present invention.

FIG. 7 is an exploded perspective view of the camera module according tothe above first preferred embodiment of the present invention.

FIG. 8 is a sectional view of the camera module according to a firstalternative mode of the above first preferred embodiment of the presentinvention.

FIG. 9 is an exploded perspective view of the camera module according tothe above alternative mode of the first preferred embodiment of thepresent invention.

FIG. 10 is a sectional view of a camera module according to a secondpreferred embodiment of the present invention.

FIGS. 11A and 11B are sectional views of different alternative modes ofthe connecting structure of the photosensitive unit according to theabove second preferred embodiment of the present invention.

FIG. 11C is perspective view illustrates the motor connecting structureof the photosensitive unit according to the above second preferredembodiment of the present invention.

FIG. 12 is a sectional view of a photosensitive unit according to athird preferred embodiment of the present invention.

FIG. 13 is a sectional view of the camera module according to the abovethird preferred embodiment of the present invention.

FIG. 14 is a sectional view of a photosensitive unit according to afourth preferred embodiment of the present invention.

FIG. 15 is a sectional view of the camera module according to the abovefourth preferred embodiment of the present invention.

FIG. 16 is sectional view of the camera module according to analternative of the above fourth preferred embodiment of the presentinvention.

FIG. 17 is a sectional view of a photosensitive unit according to afifth preferred embodiment of the present invention.

FIG. 18 is a block diagram of the photosensitive unit according to theabove fifth preferred embodiment of the present invention.

FIG. 19 is a sectional view of the camera module according to the abovefifth preferred embodiment of the present invention.

FIG. 20 is a sectional view of the camera module according to analternative mode of the above fifth preferred embodiment of the presentinvention.

FIG. 21 is a sectional view of a photosensitive unit according to asixth preferred embodiment of the present invention.

FIG. 22 is a sectional view of the camera module according to analternative mode of the above sixth preferred embodiment of the presentinvention.

FIG. 23 is a sectional view of a photosensitive unit according to aseventh preferred embodiment of the present invention.

FIG. 24 is an exploded perspective view of a photosensitive unitaccording to the above seventh preferred embodiment of the presentinvention.

FIG. 25 is a sectional view of a photosensitive unit of the cameramodule according to an eighth preferred embodiment of the presentinvention.

FIG. 26 is a sectional view of the camera module according to a ninthpreferred embodiment of the present invention.

FIG. 27 is a sectional view of the camera module according to a tenthpreferred embodiment of the present invention.

FIGS. 28A and 28B are beneficial effect comparison diagrams of thecamera module according to the above preferred embodiments of thepresent invention.

FIG. 29 is a sectional view of a conventional twin-lens camera module.

FIG. 30A is a sectional view of an array camera module with circuit unitaccording to an eleventh preferred embodiment of the present invention.

FIG. 30B is a sectional view of the array camera module according to analternative mode of the above eleventh preferred embodiment of thepresent invention.

FIG. 31 is a manufacturing process diagram of a circuit unit accordingto the above eleventh preferred embodiment of the present invention.

FIG. 32 is a block diagram of the circuit unit according to the aboveeleventh preferred embodiment of the present invention.

FIGS. 33A, 33B, and 33C illustrate different alternative modes of themotor connecting structure of the molded circuit unit according to theabove eleventh preferred embodiment of the present invention.

FIG. 34 is a sectional view of an array camera module according to theabove eleventh preferred embodiment of the present invention.

FIG. 35 is a sectional view of an array camera module with circuit unitaccording to a twelfth preferred embodiment of the present invention.

FIG. 36 is a sectional view of an array camera module with circuit unitaccording to a thirteenth preferred embodiment of the present invention.

FIG. 37 is a sectional view of an array camera module with circuit unitaccording to a fourteenth preferred embodiment of the present invention.

FIG. 38 is a sectional view of an array camera module with circuit unitaccording to a fifteenth preferred embodiment of the present invention.

FIG. 39 is a sectional view of an array camera module with circuit unitaccording to a sixteenth preferred embodiment of the present invention.

FIG. 40 is a sectional view of a circuit unit according to a seventeenthpreferred embodiment of the present invention.

FIG. 41 is a sectional view of the array camera module according to theabove seventeenth preferred embodiment of the present invention.

FIG. 42 is a sectional view of an array camera module with circuit unitaccording to an eighteenth preferred embodiment of the presentinvention.

FIG. 43 is a sectional view of the array camera module with circuit unitaccording to a nineteenth preferred embodiment of the present invention.

FIG. 44 is an exploded perspective view of a photosensitive unitaccording to a 20th preferred embodiment of the present invention.

FIG. 45 is a sectional view of a photosensitive unit according to theabove 20th preferred embodiment of the present invention.

FIG. 46 is a manufacturing process diagram illustrating thephotosensitive unit according to the above 20th preferred embodiment ofthe present invention.

FIG. 47 is a block diagram illustrating the photosensitive unitaccording to the above 20th preferred embodiment of the presentinvention.

FIGS. 48A and 48B are sectional views illustrate the alternative modesof the camera module according to the above 20th preferred embodiment ofthe present invention.

FIGS. 49A, 49B, and 49C illustrate different alternative embodiments ofthe motor connecting structure of the photosensitive unit according tothe above 20th preferred embodiment of the present invention.

FIG. 50 is a sectional view of an alternative mode of the camera moduleaccording to the above 20th preferred embodiment of the presentinvention.

FIG. 51 is a sectional view of an array camera module with moldedcircuit unit according to a 21th preferred embodiment of the presentinvention.

FIG. 52 is a sectional view of an array camera module withphotosensitive unit according to a 22th preferred embodiment of thepresent invention.

FIG. 53 is a sectional view of an array camera module withphotosensitive unit according to a 23th preferred embodiment of thepresent invention.

FIG. 54 is a sectional view of an array camera module withphotosensitive unit according to a 24th preferred embodiment of thepresent invention.

FIG. 55 is a sectional view of an array camera module withphotosensitive unit according to a 25th preferred embodiment of thepresent invention.

FIG. 56 is a sectional view of an array camera module withphotosensitive unit according to a 26th preferred embodiment of thepresent invention.

FIG. 57 is a sectional view of an array camera module withphotosensitive unit according to a 27th preferred embodiment of thepresent invention.

FIG. 58 is a sectional view of an array camera module withphotosensitive unit according to a 28th preferred embodiment of thepresent invention.

FIG. 59 is a block diagram illustrating the photosensitive unitaccording to the above preferred embodiment of the present invention.

FIGS. 60A and 60B are comparison perspective diagrams of the arraycamera module according to the above preferred embodiments of thepresent invention and a conventional multi-lens camera module cameramodule.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The following description is disclosed to enable any person skilled inthe art to make and use the present invention. Preferred embodiments areprovided in the following description only as examples and modificationswill be apparent to those skilled in the art. The general principlesdefined in the following description would be applied to otherembodiments, alternatives, modifications, equivalents, and applicationswithout departing from the spirit and scope of the present invention.

Those skilled in the art should understand that in the disclosure of thepresent invention, terms such as “longitudinal,” “lateral,” “upper,”“lower,” “front,” “back,” “left,” “right,” “perpendicular,”“horizontal,” “top,” “bottom,” “inner,” “outer,” etc., which indicatedirections or positional relations are based on the directions orpositional relations demonstrated in the figures and only to betterdescribe the present invention and simplify the description, rather thanto indicate or imply that the indicated device or element must beapplied to a specific direction or be operated or constructed in aspecific direction. Therefore, these terms shall not be consideredlimits of the present invention.

Referring to FIGS. 2 to 7, a camera module and its photosensitive unitare illustrated according to a first preferred embodiment of the presentinvention. The photosensitive unit 10 is for assembling and producingthe camera module. The photosensitive unit 10 includes an encapsulationportion 11 and a photosensitive portion 12, wherein the encapsulationportion 11 is integrally encapsulated and connected to thephotosensitive portion 12, such as being molded to connect to thephotosensitive portion 12.

The photosensitive portion 12 includes at least a main circuit board 122and a photosensitive sensor 121, wherein the photosensitive sensor 121is disposed on the main circuit board 122. Particularly, according tothe present preferred embodiment of the present invention, theencapsulation portion 11 is molded on the photosensitive portion 12 witha technique like, but not limited to, the Molding on Chip (MOC)technique for molding a chip.

According to the present embodiment of the present invention, thephotosensitive portion 12 includes a connecting circuit (not shown inthe figures) and at least a circuit element 123. The connecting circuitis prearranged in the main circuit board 122 and the circuit element 123is electrically connected to the connecting circuit and thephotosensitive sensor 121 to process the photosensing function for thephotosensitive sensor 121. The circuit element 123 is protrudedlydeployed on the main circuit board 122. The circuit element 123 can be,for example but not limited to, resistors, capacitors, diodes, triodes,potentiometers, electric relays, or actuators.

It is worth mentioning that the encapsulation portion 11 encapsulatesand wraps up the circuit element 123 therein, so that the circuitelement 123 will not be directly exposed in any space, and morespecifically, not be exposed in the environment that communicates withthe photosensitive sensor 121. Therefore, during the assembling of thecamera module, the circuit element 123 will not be contaminated withcontaminants, such as dusts, and influence the photosensitive sensor121, that is different from the arrangement of conventional cameramodule that the circuit components, such as resistance-capacitancecomponents, are exposed to outside. So that by means of such moldingencapsulation, sundries and dusts are prevented from staying on thesurface of the circuit element 123 to avoid the photosensitive sensor121 from being contaminated thereby that would result in dark spots andother defectives of the camera module.

It is worth mentioning that, in the present embodiment of the presentinvention, the circuit element 123 is recited as protruded on the maincircuit board 122 as an example for the description, whereas in otherembodiments of the present invention, the circuit element 123 can alsobe embedded in the main circuit board 123 without protruding from themain circuit board. Person skilled in the art should understand that theshape, type, and mounting position of the circuit element 123 should notlimit the present invention.

The encapsulation portion 11 has a through hole window 1100 formedtherein to provide a photosensitive path for the photosensitive sensor121.

According to the present preferred embodiment of the present invention,the photosensitive portion 12 includes at least one connecting element124 for electrically connecting the photosensitive sensor 121 with themain circuit board 122. Further, each of the connecting elements 124 canbe embodied to be, specifically but not limited to, gold wire, copperwire, aluminum wire, and/or silver wire. In addition, the connectingelements 124 can curvingly connect the photosensitive sensor 121 withthe main circuit board 122.

It is worth mentioning that each connecting element 124 is molded insidethe encapsulation portion 11, so as to enclose, encapsulate and/or wrapup each of the connecting elements 124 by the encapsulation portion 11to keep them from direct exposure to outside. Therefore, during theassembling of the camera module, the connecting element(s) 124 will notreceive any collision and damage, and, at the same time, it reduces theadverse effect of the connecting element(s) 124 due to the environmentalfactors, such as temperature, so as to ensure a stable communication andconnection between the photosensitive sensor 121 and the main circuitboard 122. This is completely different from the conventional art.

Preferably, the window 1100 of the encapsulation portion 11 enlarges itssize from a bottom thereof upwardly and gradually, having a smallerbottom size and a larger top size, to form an inclined shape slope side.Nonetheless, such inclined shape shall not be considered as a limitationto the present invention.

It is worth mentioning that the encapsulation portion 11 substantiallycovers and encloses, encapsulates and/or wraps up the circuit element123 and the connecting element 124 that advantages in protecting thecircuit element 123 and the connecting element 124 as well as inachieving a higher performance camera module. However, those skilled inthe art should understand that the encapsulation portion 11 shall not belimited in wrapping up the circuit element 123 and/or the connectingelement 124. In other words, in other embodiments of the presentinvention, the encapsulation portion 11 can be directly molded on themain circuit board 122 without circuit element 123 protruded thereon orbe molded on various positions, such as the outer side portion and theperiphery, of the circuit element 123.

In addition, the photosensitive sensor 121 has a photosensitive area1211 and a non-photosensitive area 1212, wherein the non-photosensitivearea 1212 is positioned around the periphery of the photosensitive area1211. The photosensitive area 1211 is for conducting photosensitivefunction and process. The connecting element 124 is connected to thenon-photosensitive area 1212.

According to this preferred embodiment of the present invention, theencapsulation portion 11 is extended to the non-photosensitive area 1212of the photosensitive sensor 121, so as to overlappedly affix thephotosensitive sensor 121 on the main circuit board 122 by means ofmolding. In this manner, such as the method of Molding on Chip (MOC),the molding area of the encapsulation portion 11 can be extendedinwardly, so that the outer structural portions of the encapsulationportion 11 and the main circuit board 122 can be reduced, which furtherreduces the size in length and width of the photosensitive unit 10 aswell as the size in length and width of the camera module assembledthereby.

In the present embodiment of the present invention, the encapsulationportion 11 is protrudingly formed to surround the outer portion of thephotosensitive area 1211 of the photosensitive sensor 121. Particularly,the encapsulation portion 11 has an integral enclosure connection,providing good sealing ability and tightness, so that, when thephotosensitive unit 10 is used to assemble the camera module, thephotosensitive sensor 121 can be sealed inside the encapsulation portion11 that forms a sealed interior space.

Practically, to produce the photosensitive unit 10, a conventionalcircuit board can be used to produce the main circuit board 122, whereina photosensitive sensor 121 is provided on the main circuit board 122and electrically connected by the connecting elements 124. And then, theassembled main circuit board 122 with photosensitive sensor 121 affixedthereon are molded by means of, for example, the compression moldingtechnique that is commonly applied in semiconductor packaging industry,to form the encapsulation portion 11. Alternatively, the main circuitboard 122 can be molded by means of insert molding technique by aninjection molding machine to mold the main circuit board 122 which hasbeen processed by a surface mount technology (SMT) to form theencapsulation portion 11. The main circuit board 122 can selectively be,for example but not limited to, rigid-flex circuit board, ceramicsubstrate circuit board (without flexible board), rigid PCB (withoutflexible board), and etc. The methods of forming the encapsulationportion 11 can be selected from, for example but not limited to,injection molding technique, pressing molding technique, and etc. Thematerial of the encapsulation portion 11 can be, for example but notlimited to, nylon, liquid crystal polymer (LCP), polypropylene (PP), andetc., for injection molding technique, and resin for pressing moldingtechnique. Those skilled in the art should understand that the aboveavailable production methods and available materials are examples todescribe available implementations of the present invention, rather thanlimitations of the present invention.

It is worth mentioning that according to the molding formation method ofthe photosensitive unit 10 of the present invention, the moldedphotosensitive unit 10 is suitable for making in form of combined boardthat can produce photosensitive units 10 as many as 90 pieces, forexample, at the same time, while the conventional circuit boardstructure can merely be produced 8 pieces at one time.

Furthermore, the encapsulation portion 11 includes a covering section111 and an optical filter installing section 112. The optical filterinstalling section 112 is integrally molded to connect with the coveringsection 111. The covering section 111 is molded to mount on the maincircuit board 122 to encapsulate, wrap up and/or enclose the circuitelement(s) 123 and the connecting element(s) 124. The optical filterinstalling section 112 is configured for installing the optical filter40. In other words, when the photosensitive unit 10 is used forassembling the camera module, the optical filter 40 of the camera moduleis mounted at the optical filter installing section 112 to ensure theoptical filter 40 be deployed along a photosensitive path of thephotosensitive sensor 121 and does not require any additional mountingframe for installing the optical filter. In other words, theencapsulation portion 11 itself also provides the function as aconventional mounting frame and, in addition, according to the advantageof molding technique, the top of the optical filter installing section112 would have good evenness and smoothness due to the moldingtechnique, so as to allow the optical filter 40 to be installed in aneven and flat manner that is more superior to the conventional cameramodules. Particularly, the optical filter 40 can be an Infra-Red-CutFilter (IRCF).

In addition, the optical filter installing section 112 has an installinggroove 1121. The installing groove 1211 is communicated with the window1100 to provide an adequate installation space for the optical filter 40such that the optical filter 40 will not protrude from the top surfaceof the camera lens installing section 112. In other words, theinstalling groove 1121 is provided on top of the encapsulation portion11 for the optical filter 40 to be installed therein.

It is worth mentioning that, in the present embodiment of the presentinvention, the installing groove 1121 can be used for the installationof the optical filter, whereas in other embodiments of the presentinvention, the installing groove 1121 can be used for the installationof other component, such as the camera lens, motor of the camera module,or etc. Person skilled in the art should understand that the use of theinstalling groove shall not consider as a limitation of the presentinvention.

It is worth mentioning that the inner wall of the encapsulation portion11 is designed according to the shape to be mounted thereon. Forexample, it can be in sloped or inclined shape, so that while itencapsulates and wraps up the connecting element(s) 124, thephotosensitive sensor 121 is capable of receiving as much light aspossible. Person skilled in the art should understand that a specificshape of the encapsulation portion 11 will not limit the scope of thepresent invention.

Referring to FIGS. 2 to 7, according to a first preferred embodiment ofthe present invention, the camera module can be a fixed focus module(FFM). Such camera module includes one the photosensitive unit 10, onethe optical filter 20, and one the camera lens 30.

The optical filter 20 and the camera lens 30 are mounted at thephotosensitive unit 10.

More specifically, the optical filter 20 is mounted in the installinggroove 1121 of the optical filter installing section 112 of theencapsulation portion 11 of the photosensitive unit 10. The camera lens40 is mounted at a top portion of the optical filter installing section112 of the encapsulation portion 11 of the photosensitive unit 10. Inother words, the optical filter 20 is mounted in the installing groove,while the camera lens 40 is mounted on top of the encapsulation portion11.

It is also worth mentioning that the camera lens 30 is supported on topof the optical filter installing section 112 of the encapsulationportion 11 of the photosensitive unit 10. Therefore, the encapsulationportion 11 functions as the frame of a conventional camera module toprovide a supportive and holding site for the camera lens 30, but it isassembled by a different process from the process of the conventionalCOB technology.

The conventional frame of a conventional camera module assembled basedon the conventional COB technique is glued to affix on the circuit boardby adhesive, but the encapsulation portion 11 is molded to encapsulateand wrap up the main circuit board 122 by means of the molding techniquewithout the requirement of any adhering and affixing process. Withrespect to the process of adhering and affixing, the molding processprovides better connection stability and controllability thereof.Besides, it does not have to reserve adhering space for AA adjustmentbetween the encapsulation portion 11 and the main circuit board 122according to the present invention, and thus it saves the adhering spacefor AA adjustment of the conventional camera module. Accordingly, underthe same achievement in structural strength with respect to theconventional camera module, the molded main circuit board 122 accordingto the molding technology of the present invention has a thinnerthickness. The thickness of the molded main circuit 122 can be furtherreduced when the optical filter 20 is directly attached on the moldedsurface that enables a shorter back focal length of the camera lens 30,so as to further reduce the thickness of the camera module. On the otherhand, the encapsulation and enclosure of the circuit elements 123 andthe connecting elements 124 by the encapsulation portion 11 allows thesupporting feature of conventional frame being provided overlappedlywith the circuit elements 123 and the connecting element 124 spatiallyto save space, without the need of the conventional camera module thatrequires to reserve a safe distance around the circuit components. As aresult, the height of the encapsulation portion 11 can be configured ina smaller range while providing its supporting function and feature, soas to provide a room of further reduction of the thickness of the cameramodule. Besides, the encapsulation portion 11 substitutes theconventional frame that prevents any tilt deviation occurred in adheringand assembling such conventional frame that reduces the accumulatedtolerance of the assemble of the camera module. In addition, theencapsulation and wrapping up of the connecting element(s) 124 by theencapsulation portion 11 and the inner extension of the encapsulationportion 11 towards the non-photosensitive area 1212 of thephotosensitive sensor 121 enables the size of the encapsulation portion11 can be shrunk inwardly, so as to further decrease the lateral sizesin length and width of the camera module.

Referring to FIGS. 2, 3, 5, 8, and 9, another camera module according tothe above first preferred embodiment of the present invention isillustrated. The camera module can be an Automatic Focus Camera Module(AFCM). Such camera module includes one the photosensitive unit 10, onethe optical filter 20, one motor unit 40, and one the camera lens 30.

The optical filter 20 is installed at the photosensitive unit 10, whilethe camera lens 30 is installed at the motor unit 40 and the motor 60 isinstalled at the photosensitive unit (molded circuit unit) 10.

Furthermore, the optical filter 20 is mounted in the installing groove1121 of the optical filter installing section 112 of the encapsulationportion 11 of the photosensitive unit 10. The motor unit 40 is mountedon top of the optical filter installing section 112 of the encapsulationportion 11 of the photosensitive unit 10. In other words, the opticalfilter 20 is mounted in the installing groove of the encapsulationportion 11, while the camera lens 30 is installed in the motor unit 40.The motor unit 40 is mounted on top of the encapsulation portion 11.

Those skilled in the art should understand that the structures and formsof the camera module mentioned above are just examples to describe waysof implementing the camera module, rather than limitations of thepresent invention.

FIG. 10 illustrates a photosensitive unit and camera module according toa second preferred embodiment of the present invention.

According to the present second preferred embodiment of the presentinvention, the photosensitive unit 10 includes a motor connectingstructure 13 for connecting to a motor unit 40 of the camera module. Themotor unit 40 has at least one motor terminal 41. The motor connectingstructure 13 includes at least one lead element 131, wherein each thelead element 131 is connected to the motor unit 40 and the main circuitboard 122. Each of the lead elements 131 is electrically connected tothe main circuit board 122. Further, the lead element 131 iselectrically connected to the connecting circuit of the main circuitboard 122. The lead element 131 is deployed in the encapsulation portion11 and extended to the top of the encapsulation portion 11. The leadelement 131 includes at least a motor coupling terminal 1311 exposed ontop of the encapsulation portion 11 for being electrically connected tothe motor terminal 41 of the motor unit 40. It is worth mentioning thatthe lead element 131 can be deployed by embedding during the moldingformation of the encapsulation portion 11. In the conventional way ofconnection, component like driving motor is connected to the circuitboard through individually arranged lead wires, which involve relativelycomplicated manufacture technique. However, according to the presentinvention, the embedding of the lead element 114 in the molding processnot only can substitute the conventional motor soldering process, butalso can provide a more stable electrical circuit connection.Particularly, in one preferred embodiment of the present invention, thelead element 131 is a conductor being embedded inside the encapsulationportion 11. For example, the motor terminal 41 can be connected to themotor coupling terminal 1311 with anisotropic conductive film or bywelding and soldering.

It is worth mentioning that the embedding position of the lead element131 and the revealing position of the motor coupling terminal 1311 ofthe lead element 131 in the encapsulation portion 11 may be arrangedbased on the needs. For instance, in one preferred embodiment of thepresent invention, the motor coupling terminal 1311 of the lead element131 can be deployed on the periphery of the encapsulation portion 11,that is the top surface of the encapsulation portion 11 and the topsurface of the optical filter installing section 112. However, in analternative mode of the embodiment of the present invention, the motorcoupling terminal 1311 can be deployed on the inner side of theencapsulation portion 11, that is the bottom side of the installinggroove 121 of the encapsulation portion 11. Therefore, there may bevarious installation sites provided for the motor unit 40. In otherwords, when the motor unit 40 has to be installed on top of theencapsulation portion 11, the motor coupling terminal 1311 will beprovided on the top surface of the outer side of the encapsulationportion. When the motor unit 40 has to be installed in the installinggroove 121, the motor coupling terminal 1311 can be provided on theinner side of the encapsulation portion 11, that is the bottom of theinstalling groove 121.

In other words, when producing the photosensitive unit 10, firstly thephotosensitive sensor 121 is attached in position, and then theencapsulation portion 11 is molded on the main circuit board 122 withthe photosensitive sensor 121 attached thereon by means of such as theMOC technology. At the same time, the lead element(s) 131 can beembedded inside the encapsulation portion 11 during the molding whileelectrically connecting the lead element(s) 131 with the main circuitboard 122 and revealing the motor coupling terminal(s) 1311 of the leadelement(s) 131 on top of the encapsulation portion 11 for connectingwith the motor terminal(s) 41 of the motor unit 40. For example, whenthe photosensitive unit 10 is used to assemble the camera module, eachmotor terminal 41 of the motor unit 40 is connected to the motorcoupling terminal 1311 of the lead element 131 by welding or solderingso as to electrically connect the motor unit 40 with the main circuitboard 122. An independent lead element can be deployed to connect themotor unit 40 with the main circuit board 122 to allow a length of themotor terminal 41 of the motor unit 40 to be shortened.

It is worth mentioning that the embedding position of the leadelement(s) 131 can be configured based on the needs. For example, in onepreferred embodiment of the present invention, the embedding positioncan be configured inside the encapsulation portion 11 to hide the leadelement 131(s). In an alternative mode, the embedding position can beconfigured on the surface of the encapsulation portion 11. Personskilled in the art should understand that position of the lead element131 shall not limit the scope of the present invention.

Especially, when the motor terminal 41 is affixed on the circuitjunction by attaching with conducting adhesive, it does not require tosolder any lead wire for connecting the motor unit 40 with the maincircuit board 122 of the photosensitive portion 12, and thus it reducesthe motor soldering process.

FIG. 11A illustrates an equivalent embodiment of the motor connectingstructure of the above preferred embodiment of the present invention.The motor connecting structure 13 includes at least one terminal slot133. The terminal slot 133 is for accommodating the motor terminal 41 ofthe motor unit 40 of the camera module. The terminal slot 133 isdeployed on top of the encapsulation portion 11. The motor connectingstructure 13 includes at least one lead element 134, wherein each thelead element 134 is to electrically connect the motor unit 40 with themain circuit board 122. The lead element 134 is arranged in theencapsulation portion 11 and upwardly extended to the bottom wall of theterminal slot 133 of the encapsulation portion 11. The lead element 134includes a motor coupling terminal 1341 exposed on the bottom wall ofthe terminal slot 133 of the encapsulation portion 11 for beingelectrically connected to the motor terminal 41 of the motor unit 40.Particularly, in an implementation, the motor coupling terminal 1341 canbe embodied as a pad. The lead element 134 can be embodied as aconductor embedded inside the encapsulation portion 11.

In other words, when producing the photosensitive unit 10, in oneembodiment, the photosensitive sensor 121 is firstly adhered to the maincircuit board 122, and then the encapsulation portion 11 is molded onthe main circuit board 122 and the photosensitive sensor 121 by means ofthe MOC technology, wherein the terminal slot 133 with predeterminedlength is provided in the encapsulation portion 11 to embed the leadelement 134 therein during the molding process, while the lead element134 is electrically connected with the main circuit board 122 and themotor coupling terminal 1341 of the lead element 134 is revealed on thebottom wall of the terminal slot 133 of the encapsulation portion 11 forconnecting with the motor terminal 41 of the motor unit 40. For example,when the photosensitive unit 10 is used to assemble the camera module,each motor terminal 41 of the motor unit 40 is inserted into theterminal slot 133 and connected to the motor coupling terminal 1341 ofthe lead element 134 by welding or soldering so as to electricallyconnect the motor unit 40 with the main circuit board 122. Anindependent lead element is required to connect the motor unit 40 withthe main circuit board 122 to ensure stable connection for the motorterminal 41 of the motor unit 40 and to avoid unnecessary contact fromthe motor terminal 41. Particularly, the lead element 134 can beembodied as a conductor embedded inside the encapsulation portion 11.

It is worth mentioning that the embedding position of the lead element134 can be arranged according to the needs. For example, in thispreferred embodiment of the present invention, the embedding positioncan be provided inside the encapsulation portion 11 to hire the leadelement 134. In an alternative mode, the embedding position can also beprovided on the surface of the encapsulation portion 11. Person skilledin the art should understand that position of the lead element 134 shallnot limit the present invention.

Referring to FIG. 11B, an alternative mode of the motor connectingstructure of the above preferred embodiment of the present invention isillustrated. The motor connecting structure 13 includes a terminal slot135 for accommodating the motor terminal 41 of the motor unit 40 of thecamera module. The terminal slot 135 is provided inside theencapsulation portion 11. The motor connecting structure 13 includes atleast one circuit connection junction 132, wherein the circuitconnection junction 132 is arranged to be provided on the main circuitboard 122 and electrically connected to the connecting circuit in themain circuit board 122. Furthermore, each the terminal slot 135 isextended from the top of the encapsulation portion 11 to the maincircuit board 122 to present the circuit connection junction 132. In onepreferred embodiment, the motor terminal 41 is adapted to insert intothe terminal slot 135 and connected to the circuit connection junction132 by soldering or welding.

In other words, when producing the photosensitive unit 10, each thecircuit connection junction 132 is provided on the main circuit board122 and the photosensitive sensor 121 is attached to the main circuitboard 122. Then, the encapsulation portion 11 is molded on the maincircuit board 122 and the photosensitive sensor 121 by means of the MOCtechnology, while the terminal slot 135 with predetermined length isprovided and the circuit connection junction 132 is revealed through theterminal slot 135 for connecting with the motor terminal 41 of the motorunit 40. For example, when the photosensitive unit 10 is to be assembledto form the camera module, each motor terminal 41 of the motor unit 40is inserted into the terminal slot 135 and connected to the circuitconnection junction 132 of the main circuit board 122 by welding andsoldering so as to electrically connect the motor unit 40 with the maincircuit board 122 to ensure stable connection for the motor terminal 41of the motor unit 40 and to avoid unnecessary contact of the motorterminal 41.

Referring to FIG. 11C, another alternative mode of the motor connectingstructure of the above preferred embodiment of the present invention.The motor connecting structure 13 includes at least one carving line136. The carving line 136 is adapted to electrically connect theconnecting elements, the photosensitive sensor 121, and the motor uniton the main circuit board 122. For example, but not limited to that thecarving line 136 can be provided by Laser Direct Structuring (LDS)during the forming of the encapsulation portion 11. For example, in onepreferred embodiment of the present invention, the carving line 136 isdirectly formed on the surface of the encapsulation portion 11 by laser.However, in the conventional way of connection, components like drivingmotor are connected to the circuit board by independent lead wires, thatinvolves relatively complicated manufacture procedures. In view of thepresent invention the carving line 136 is provided directly in themolding process that can not only substitute the conventional way likemotor soldering, but also provide a more stable electrical circuitconnection. More specifically, the formation process of the carving line136 can be formed by first providing a carving slot in the encapsulationportion 11 and then electroplating carving slot form the electricalcircuit.

It is worth mentioning that the electrical connection of the motor unit40 is described as electrical connecting the motor unit 40 by the leadelement 131 according to the above second embodiment of the presentinvention, but in other embodiments of the present invention, it ispossible to apply different motor connecting structures 13 to connectthe motor unit 40. For example, the various methods as shown in FIGS.11A, 11B, and 11C. In other words, the various motor connectingstructures as illustrated in FIGS. 11A, 11B, and 11C can be coupled withdifferent photosensitive units respectively to provide different ways toelectrically connect the motor unit. Therefore, person skilled in theart should understand that what are shown in the appended drawings shallnot limit the scope of the present invention.

Referring to FIGS. 12 and 13, a photosensitive unit and a camera modulethereof according to a third preferred embodiment of the presentinvention are illustrated. The photosensitive unit 10A, which is usedfor assembling and producing the molded camera module, includes anencapsulation portion 11A and a photosensitive portion 12A, wherein theencapsulation portion 11A is molded to connect to the photosensitiveportion 12A.

The photosensitive portion 12A includes a main circuit board 122A and aphotosensitive sensor 121A, wherein the photosensitive sensor 121A isdisposed on the main circuit board 122A. According to the presentembodiment of the present invention, the photosensitive sensor 121A ismolded to connect to the main circuit board.

According to the third preferred embodiment of the present invention,the photosensitive portion 12A includes a connecting circuit (not shownin the figures) and at least a circuit element 123A. The connectingcircuit is preinstalled in the main circuit board 122A. The circuitelement 123A is electrically connected to the connecting circuit and thephotosensitive sensor 121A, adapted for the photosensitive sensor 121Ato perform its photosensing process function. The circuit element 123Ais protrudingly deployed on the main circuit board 122A. The circuitelement 123A can be, for example but not limited to, resistors,capacitors, diodes, triodes, potentiometers, electric relays, actuators,or etc.

It is worth mentioning that the encapsulation portion 11A encapsulatesand wraps up the circuit element 123A therein, so that the circuitelement 123A will not be directly exposed in any space, and morespecifically, not be exposed in the environment that communicates withthe photosensitive sensor 121A. Therefore, during the assembling of thecamera module, the circuit element 123A will not contaminate pollutions,such as dusts, or adversely influence the photosensitive sensor 121A. Itis different from the conventional camera module that the circuitelement 123A, such as resistance-capacitance components, is exposedoutside. The enclosure and encapsulation of the photosensitive sensor121A by molding, sundries and dusts are prevented from staying on thesurface of the circuit element 123A that avoids the photosensitivesensor 121A from being contaminated and causes dark spots and otherdefectives of the camera module.

The encapsulation portion 11A forms a window 1100A to provide aphotosensitive path for the photosensitive sensor 121A.

According to the third preferred embodiment of the present invention,the photosensitive portion 12A includes at least one connecting element124A for electrically connecting the photosensitive sensor 121A with themain circuit board 122A. Further, each of the connecting elements 124Acan be embodied as, specifically but not limited to, gold wire, copperwire, aluminum wire, and/or silver wire.

It is worth mentioning that each the connecting element 124A is moldedinside the encapsulation portion 11A, so that the connecting element(s)124A are enclosed, encapsulated and/or wrapped up by the moldedencapsulation portion 11A that keep them from direct exposure to theoutside. Therefore, during the assembling of the camera module, theconnecting element(s) 124A will not suffer any collision or damage, and,at the same time, the influence by the environmental factors, such astemperature, on the connecting element 124A is reduced that results instabilization of the communication and connection between thephotosensitive sensor 121A and the main circuit board 122A. This iscompletely different from the prior art.

It is worth mentioning that the encapsulation portion 11A encapsulatesand wraps up the circuit element 123A and the connecting element 124A,which advantages in protecting the circuit element 123A and theconnecting element 124A as well as obtaining a higher performance cameramodule. However, those skilled in the art should understand that theencapsulation portion 11A shall not be limited in wrapping up thecircuit element 123A and/or the connecting element 124A. In other words,in other embodiments of the present invention, the encapsulation portion11A can be directly molded on main circuit board 122A without protrudedcircuit element 123A or be molded on various positions, such as theouter sides, the periphery, and etc., of the circuit element 123A.

This embodiment is an alternative mode of the above preferred embodimentthat, the main circuit board 122A has an inner groove 1222A and thephotosensitive sensor 121A is installed in the inner groove 1222A, so asto reduce the relative height of the photosensitive sensor 121A and themain circuit board 122A. Therefore, when the encapsulation portion 11Acovers and wraps up the photosensitive sensor 121A, the height of theencapsulation portion 11A can be reduced that results in reducing theheight of the camera module assembled with the photosensitive unit 10A.

In addition, the photosensitive sensor 121A has a photosensitive area1211A and a non-photosensitive area 1212A, wherein thenon-photosensitive area 1212A is positioned to surround the periphery ofthe photosensitive area 1211A. The photosensitive area 1211A is adaptedfor processing photosensitization. The connecting element 124A isconnected to the non-photosensitive area 1212A.

According to the preferred embodiment of the present invention, theencapsulation portion 11A is extended on the non-photosensitive area1212A of the photosensitive sensor 121A to overlappedly affix thephotosensitive sensor 121A on the main circuit board 122A by moldingtechnology. Such that, for example, by using the process of Molding onChip (MOC) or other molding technologies, the moldable area of theencapsulation portion 11A can be increased inwardly, so that thestructural portion of the outer portions of the encapsulation portion11A and the main circuit board 122A can be reduced, which furtherreduces the size in length and width of the photosensitive unit 12A andreduces the size in length and width of the molded camera moduleassembled thereby.

In the present embodiment of the present invention, the encapsulationportion 11A is protruded to surround the outer sides of thephotosensitive area 1211A of the photosensitive sensor 121A.Particularly, the encapsulation portion 11A is connected in an integraland sealed manner to achieve a good sealingness and tightness, so thatwhen the photosensitive unit 10A is used to assemble the camera module,the photosensitive sensor 121A will be sealed inside the camera moduleto define a sealed inner space.

Furthermore, the encapsulation portion 11A includes a covering section111A and an optical filter installing section 112A. The optical filterinstalling section 112A is molded integrally to connect with thecovering section 111A. The covering section 111A is molded to attach onthe main circuit board 122A for encapsulating and wrapping up thecircuit element 123A and the connecting element 124A. The optical filterinstalling section 112A is arranged for installing an optical filter20A. In other words, when the photosensitive unit 10A is used toassemble the camera module, the optical filter 20A of the camera modulewill be mounted at the optical filter installing section 112A, whichmakes the optical filter 20A be positioned along the photosensitive pathof the photosensitive sensor 121A without the need of any additionalmounting frame of the optical filter 20A. In other words, theencapsulation portion 11A of the present embodiment has a function as aconventional optical filter frame while the top portion of the opticalfilter installing section 112A has a good evenness and smoothness bymeans of the molding technique, that enables the optical filter 20A tobe installed evenly, that is superior to conventional camera modules.

In addition, the optical filter installing section 112A has aninstalling groove 1121A. The installing groove 1121A is communicatedwith the window 1100A to provide sufficient installation space for theoptical filter 20A to install and prevent the optical filter 20A beingprotruded from the top surface of the optical filter installing section112A. In other words, the top of the encapsulation portion 11A has theinstalling groove provided therein for the optical filter 20A to bestably installed at the encapsulation portion 11A without protrudingfrom the top of the encapsulation portion 11A.

It is worth mentioning that the molded inner wall defines the window1100A and can be provided according to the shape of the object to beinstalled thereat. For example, it can be in inclined or slope shape, sothat while the connecting element 124A is encapsulated and wrapped up bythe encapsulation portion 11A, the photosensitive sensor 121A mayreceive as much light as possible. Person skilled in the art shouldunderstand that the shape of the encapsulation portion 11A shall not bea limitation of the present invention.

Referring to FIGS. 12 and 13, the camera module according to a thirdpreferred embodiment of the present invention can be embodied as a fixedfocus module. The camera module includes one the photosensitive unit10A, one the optical filter 20A, and one the camera lens 30A.

The optical filter 20A is installed at the photosensitive unit 10A,while the camera lens 30A is mounted on the photosensitive unit 10A.

More specifically, the optical filter 20A is installed at the installinggroove 1111A of the optical filter installing section 111A of theencapsulation portion 11A of the photosensitive unit 10A. The cameralens 30A is mounted on top of the optical filter installing section 111Aof the encapsulation portion 11A of the photosensitive unit 10A. Inother words, the optical filter 20A is mounted in the IR installinggroove 1111A. The camera lens 30A is mounted on top of the encapsulationportion 11A.

In other embodiments of the present invention, the photosensitive unit10A can also be assembled in an automatic focus camera module. Personskilled in the art should understand that the fixed focus module is onlyan example for describing the present invention, which shall not limitthe present invention.

Referring to FIGS. 14 and 15, a photosensitive unit 10B of a cameramodule according to a fourth preferred embodiment of the presentinvention is illustrated. The photosensitive unit 10B is used forassembling and producing of camera module, so as to obtain a moldedcamera module. The photosensitive unit 10B includes an encapsulationportion 11B and a photosensitive portion 12B, wherein the encapsulationportion 11B is molded to connect with the photosensitive portion 12B.

The photosensitive portion 12B includes a main circuit board 122B and aphotosensitive sensor 121B, wherein the photosensitive sensor 121B isdisposed on the main circuit board 122B. According to the presentembodiment of the present invention, the photosensitive sensor 121B ismolded to connect to the main circuit board.

According to the present embodiment of the present invention, thephotosensitive portion 12B includes a connecting circuit (not shown inthe figures) and at least a circuit element 123B. The connecting circuitis preinstalled in the main circuit board 122B. The circuit element 123Bis electrically connected to the connecting circuit and thephotosensitive sensor 121B so as to enable the photosensitive sensor121B to conduct the photosensing process. The circuit element 123B isprotrudingly deployed on the main circuit board 122B. The circuitelement 123B can be, for example but not limited to, resistors,capacitors, diodes, triodes, potentiometers, electric relays, oractuators.

It is worth mentioning that the encapsulation portion 11B encapsulatesand wraps up the circuit element 123B therein, so that the circuitelement 123B will not be directly exposed in an open space, and morespecifically, not be exposed in the environment that communicates withthe photosensitive sensor 121B. Therefore, during the assembling of thecamera module, the circuit element 123B will not be contaminated bypollutants, such as dusts, or influence the photosensitive sensor 121B,that is different from the arrangement of conventional camera modulethat its circuit elements, such as resistance-capacitance components,are remained in exposed manner. The use of the molding and encapsulatingmethod prevents sundries and dusts from staying on the surface of thecircuit element 123B and avoids the photosensitive sensor 121B frombeing contaminated that causes dark spots and other defectives of thecamera module.

The encapsulation portion 11B forms a window 1100B for providing aphotosensitive path for the photosensitive sensor 121B.

According to the present fourth preferred embodiment of the presentinvention, the photosensitive portion 12B includes at least oneconnecting element 124B for electrically connecting the photosensitivesensor 121B with the main circuit board 122B. Further, each of theconnecting elements 124B can be embodied as, specifically but notlimited to, gold wire, copper wire, aluminum wire, and/or silver wire.

It is worth mentioning that each connecting element 124B is moldedwithin the encapsulation portion 11B, so that the encapsulation portion11B, encloses, encapsulates and/or wraps up each of the connectingelement(s) 124B and keep them from direct exposure to the outside.Therefore, during the assembling of the camera module, the connectingelement(s) 124B will not suffer any collision or damage, and, at thesame time, it reduces the impact due to the environmental factors, suchas temperature, on the connecting element 124B and stabilizes thecommunication and connection between the photosensitive sensor 121B andthe main circuit board 122B. This is completely absent in thetraditional art.

It is worth mentioning that the encapsulation portion 11B encapsulatesand wraps up the circuit element 123B and the connecting element 124B,which advantages in protecting the circuit element 123B and theconnecting element 124B as well as obtaining a higher performance cameramodule. However, those skilled in the art should understand that theencapsulation portion 11B shall not be limited in wrapping up thecircuit element 123B and/or the connecting element 124B. In other words,in other embodiments of the present invention, the encapsulation portion11B can be directly molded on the main circuit board 122B withoutprotruded circuit element 123B or be molded on various positions, suchas the outer sides, the periphery, and etc., of the circuit element123B.

In addition, the photosensitive sensor 121B has a photosensitive area1211B and a non-photosensitive area 1212B, wherein thenon-photosensitive area 1212B is positioned surrounding the periphery ofthe photosensitive area 1211B. The photosensitive area 1211B is adaptedfor conducting photosensitization. The connecting element 124B isconnected to the non-photosensitive area 1212B.

According to the fourth preferred embodiment of the present invention,the encapsulation portion 11B is extended on the non-photosensitive area1212B of the photosensitive sensor 121B, so as to overlappedly mount thephotosensitive sensor 121B on the main circuit board 122B by means ofmolding. In this manner, such as the method of Molding on Chip (MOC),the moldable area of the encapsulation portion 11B can be extendedinwardly, such that the structural portion outside of the encapsulationportion 11B and the main circuit board 122B can be reduced, that furtherreduces the size in length and width of the molded photosensitiveportion 12B and reduces the size in length and width of the cameramodule assembled thereby.

In the present fourth embodiment of the present invention, theencapsulation portion 11B is protruded to surround the outside of thephotosensitive area 1211B of the photosensitive sensor 121B.Particularly, the encapsulation portion 11B integrally seal itsconnection, so as to provide a great sealingness and tightness.Therefore, when the photosensitive unit 10B is used to assemble thecamera module, the photosensitive sensor 121B will be sealed inside thecamera module to forms a sealed inner space.

In particular, the production of the photosensitive unit 10B may utilizea conventional circuit board as the main circuit board 122B. Thephotosensitive sensor 121B is deployed on the main circuit board 122Band electrically connected by the connecting element 124B. Then, theinitially assembled main circuit board 122B and photosensitive sensor121B are molded by, for example, injection molding machine. By means ofthe insert molding technique, the circuit board that has been processedby Surface Mount Technology (SMT) will be molded to form theencapsulation portion 11B. Alternatively, the encapsulation portion 11Bcan be formed by applying the pressing molding technique, which iscommonly seen in semiconductor packaging The main circuit board 122B canselectively be, for example but not limited to, a rigid-flex board, aceramic substrate (without flexible board), or a rigid PCB (withoutflexible board). The way to form the encapsulation portion 11B can beselected from, for example but not limited to, injection moldingtechnique and pressing molding technique. The material of theencapsulation portion 11B can be, for example but not limited to, nylon,liquid crystal polymer (LCP), or polypropylene (PP) for injectionmolding technique, or resin for pressing molding technique. Thoseskilled in the art should understand that the above availablemanufacture methods and available materials are examples to describeavailable implementations of the present invention, rather than to limitthe scope of the present invention.

Furthermore, the top surface of the encapsulation portion 11B is flatand smooth, and is adapted for mounting an optical filter 20B thereon.In other words, when the photosensitive unit 10B is used in assemblingthe camera module, the optical filter 20B of the camera module ismounted on the top surface of the encapsulation portion 11B, enablingthe optical filter 20B to be arranged along the photosensitive path ofthe photosensitive sensor 121B without the need of any additionalmounting frame for the optical filter 20B. In other words, theencapsulation portion 11B also functions as a conventional independentmounting frame. In addition, due to the advantage of molding technique,the molded top portion of the encapsulation portion 11B can takeadvantage of the mold to achieve good evenness and smoothness, so thatthe optical filter 20B can be evenly installed, that is superior toconventional camera module.

The different between the above preferred embodiments and the presentfourth embodiment of the present invention, the photosensitive portion12B of the photosensitive unit 10B further includes a reinforced layer125B overlappedly attached to the bottom of the main circuit board 122B,so as to reinforce the structural strength of the main circuit board122B. In other words, the reinforced layer 125B is adhered on a positionof the bottom layer of the main circuit board 122B corresponding to thepositions of the encapsulation portion 11B and the photosensitive sensor121B, so that the main circuit board 122B can also stably and reliablysupport the encapsulation portion 11B and the photosensitive sensor121B.

Furthermore, the reinforced layer 125B is a metal plate attaching on thebottom layer of the main circuit board 122B to increase the structuralstrength of the main circuit board 122B as well as to enhance the heatdissipation of the photosensitive unit 10B by effectively dissipatingheat generated by the photosensitive sensor 121B.

It is worth mentioning that the main circuit board 122B can be FlexPrint Circuit (FPC). By enhancing the rigidity of the FPC with thereinforced layer 125B, the FPC having excellent flexural property canstill fulfill the loading and supporting requirement for thephotosensitive unit 10B. In other words, more options of differentcircuit boards can be used as the main circuit board 122B, such as PCB(Printed Circuit Board), FPC

(Flexible Printed Circuit), and RF (Rigid Flex). By using the reinforcedlayer 125B to enhance the structural strength and heat dissipation ofthe main circuit board 122B, the thickness of the main circuit board122B can thus be reduced, that enables the height of the photosensitiveunit 10B to be further reduced. Hence, the height of the camera moduleassembled thereby can be reduced too.

It is worth mentioning that, according to the present fourth embodimentof the present invention, the reinforced layer 125 is overlapped on themain circuit board 122B in a plane manner. In other embodiments of thepresent invention, the reinforced layer 125 can be extended to cover theside walls of the encapsulation portion 11B, so as to not only reinforcethe structural strength of the photosensitive unit 10B, but also enhancean anti-electromagnetic ability thereof.

It is worth mentioning that the inner wall of the encapsulation portion11B can be shaped according to the connection shape thereof. Forexample, it can be an inclined and slope shape, so that thephotosensitive sensor 121B can receive more light while the connectingelement 124B is encapsulated and wrapped by the encapsulation portion11B.

Those skilled in the art should understand that specific shape of theencapsulation portion 11B shall not limit the present invention.

Referring to FIGS. 14 and 15, the camera module according to the fourthpreferred embodiment of the present invention can be a fixed focusmodule (FFM), which includes one the photosensitive unit 10B, one theoptical filter 20B, and one the camera lens 30B.

The optical filter 20B is installed at the photosensitive unit 10B,while the camera lens 30B is mounted on the photosensitive unit 10B.

More specifically, the optical filter 20B is mounted on top ofencapsulation portion 11B of the photosensitive unit 10B. The cameralens 30B is mounted on top of encapsulation portion 11B of thephotosensitive unit 10B. Particularly, the specific installationpositions of the optical filter 20B and the camera lens 30B in theencapsulation portion 11B can be coordinated and arranged based onpractical needs.

It is also worth mentioning that the camera lens 30B is supported on topportion of the encapsulation portion 11B of the photosensitive unit 10B.Therefore, the encapsulation portion 11B can also function as theindependent mounting frame of a conventional camera module to provide asupportive and holding site, but it is assembled by technical processdifferent from the conventional COB technology. The mounting frame of aconventional camera module based on the conventional COB technique isadhered on the circuit board by adhesive. However, the encapsulationportion 11B is molded on the main circuit board 122B by means of themolding technique that does not require any adhering and affixingprocedures. Contrasting to the process of adhering and affixing, theprocess of molding has better stability in connection and providesbetter controllability in technological process. Besides, it does nothave to reserve any adhering space between the encapsulation portion 11Band the main circuit board 122B for AA adjustment. Therefore, it savesthe adhering space of AA adjustment of conventional camera module, andallows the thickness of the camera module to be further reduced.Meanwhile, the encapsulation portion 11B which encapsulates and wrapsthe circuit elements 123B and the connecting elements 124B thereinprovides the function of conventional independent mounting frame, sothat the circuit elements 123B and the connecting element 124B can bespatially overlapped. It is different from the conventional cameramodule that requires to reserve a safety distance around the circuitcomponents. As a result, the height of the encapsulation portion 11B,which functions as the independent mounting frame, can be arranged in asmaller scale, so as to further provide room for reducing the thicknessof the camera module. Besides, the encapsulation portion 11B thatsubstitutes the conventional mounting frame avoids any tilt deviationoccurred in attaching and assembling the mounting frame as in theconventional camera module and to reduce the accumulated tolerance of inassembling the camera module. In addition, the encapsulation portion 11Bencapsulates and wraps up the connecting element 124B and extends to thenon-photosensitive area 1212B of the photosensitive sensor 121B, whichallows the encapsulation portion 11B to shrink inwardly, so as tofurther decrease the lateral sizes in length and width of the cameramodule.

Referring to FIGS. 14 and 16, an alternative mode of the camera moduleaccording to the above fourth preferred embodiment of the presentinvention is illustrated. The camera module can be an automatic focuscamera module. The camera module includes one the photosensitive unit10B, one the optical filter 20B, a motor unit 40B, and a camera lens30B.

The optical filter 20B is mounted on the photosensitive unit 10B, whilethe camera lens 30B is mounted on the motor unit 40B and the motor unit40B is mounted on the molded circuit unit.

Furthermore, the optical filter 20B is mounted on the top portion ofencapsulation portion 11B of the photosensitive unit 10B. The motor unit40B is mounted on the top portion of the encapsulation portion 11B ofthe photosensitive unit 10B. Particularly, the specific installationpositions of the optical filter 20B and the motor unit 40B at theencapsulation portion 11B can be coordinated and arranged based onpractical needs.

Especially, carving line(s) 114B would be provided to electricallyconnect the motor unit 40B with the main circuit board 122B of thephotosensitive portion 12B, so that it does not require to solder aconnecting element such as lead wire for connecting the motor unit 40Bwith the main circuit board 122B of the photosensitive portion 12B,which eliminates the technological process of motor soldering.

Those skilled in the art should understand that the structures and formsof the camera module mentioned above are just examples to describe waysof implementing the camera module, rather than limitations of thepresent invention.

Referring to FIGS. 17 to 20, a camera module with its photosensitiveunit according to a fifth preferred embodiment of the present inventionis illustrated. The photosensitive unit 10C is for assembling andproducing camera module, so as to achieve the molded camera module ofthe present invention. The photosensitive unit 10C includes anencapsulation portion 11C and a photosensitive portion 12C, wherein theencapsulation portion 11C is molded to connect with the photosensitiveportion 12C.

The photosensitive portion 12C includes a main circuit board 122C and aphotosensitive sensor 121C, wherein the photosensitive sensor 121C isdisposed on the main circuit board 122C. According to the present fifthembodiment of the present invention, the photosensitive sensor 121C ismolded to connect to the main circuit board 122C.

According to the present fifth embodiment of the present invention, thephotosensitive portion 12C includes a connecting circuit (not shown inthe figures) and at least a circuit element 123C. The connecting circuitis preinstalled in the main circuit board 122C. The circuit element 123Cis electrically connected to the connecting circuit and thephotosensitive sensor 121C, wherein the photosensitive sensor 121C isarranged to perform the photosensing process thereof. The circuitelement 123C is protrudingly deployed on the main circuit board 122C.The circuit element 123C can be, for example but not limited to,resistors, capacitors, diodes, triodes, potentiometers, electric relays,or actuators.

It is worth mentioning that the encapsulation portion 11C encapsulatesand wraps up the circuit element 123C therein, so that the circuitelement 123C will not be directly exposed in the space outside the maincircuit board 122C, and more specifically, not be exposed in theenvironment that communicates with the photosensitive sensor 121C.Therefore, during the assembling of the camera module, the circuitelement 123C will not be contaminated by pollutants, such as dusts, orinfluence the photosensitive sensor 121C, which is different from thearrangement of conventional camera module that the circuit element(s)123C, such as resistance-capacitance components, will not be exposedoutside. The use of the molding and encapsulation method in the presentinvention prevents sundries and dusts from staying on the surface of thecircuit element(s) 123C and avoids the photosensitive sensor 121C frombeing contaminated and causing dark spots and other defectives of thecamera module.

The encapsulation portion 11C forms a window 1100C providing aphotosensitive path for the photosensitive sensor 121C.

According to the present fifth preferred embodiment of the presentinvention, the photosensitive portion 12C includes at least oneconnecting element 124C for electrically connecting the photosensitivesensor 121C with the main circuit board 122C. Further, each of theconnecting elements 124C can be embodied to be, specifically but notlimited to, gold wire, copper wire, aluminum wire, and/or silver wire.

It is worth mentioning that each connecting element 124C is moldedwithin the encapsulation portion 11C, so as to use the encapsulationportion 11C to enclose, capsulate and/or wrap up the connectingelement(s) 124C and keep them from direct exposure to the outside.Therefore, during the assembling of the camera module, the connectingelement(s) 124C will not suffer any collision or damage, which, at thesame time, reduces the impact due to the environmental factors, such astemperature, on the connecting element(s) 124C and stabilizes thecommunication and connection between the photosensitive sensor 121C andthe main circuit board 122C. This is basically not provided in thetraditional art.

It is worth mentioning that the encapsulation portion 11C encapsulatesand wraps up the circuit element(s) 123C and the connecting element(s)124C, which advantages in protecting the circuit element(s) 123C and theconnecting element(s) 124C as well as achieving a higher performancecamera module. However, person skilled in the art should understand thatthe encapsulation portion 11C shall not be limited in encapsulating andwrapping up the circuit element 123C and/or the connecting element 124C.In other words, in other embodiments of the present invention, theencapsulation portion 11C can be directly molded on the main circuitboard 122C without protruded circuit element 123C or be molded onvarious positions, such as the outer side, periphery, etc., of thecircuit element 123C.

In addition, the photosensitive sensor 121C has a photosensitive area1211C and a non-photosensitive area 1212C, wherein thenon-photosensitive area 1212C is positioned surrounding the periphery ofthe photosensitive area 1211C. The photosensitive area 1211C is adaptedfor conducting photosensitization. The connecting element 124C isconnected to the non-photosensitive area 1212C.

According to the fifth preferred embodiment of the present invention,the encapsulation portion 11C is extended on the non-photosensitive area1212C of the photosensitive sensor 121C to overlappedly mount thephotosensitive sensor 121C on the main circuit board 122C by means ofmolding. In this manner, such as using the method of Molding on theChip, the moldable area of the encapsulation portion 11C can be extendedinwardly, such that the structural portion of the outer portion of theencapsulation portion 11C and the main circuit board 122C can bereduced, that further reduces the size in length and width of thephotosensitive unit and reduces the size in length and width of thecamera module assembled thereby.

In the present fifth embodiment of the present invention, theencapsulation portion 11C is protruded to position surrounding the outerportion of the photosensitive area 1211C of the photosensitive sensor121C. Particularly, the encapsulation portion 11C integrally seals theelectrical connection, so as to achieve a good sealingness andtightness. Therefore, when the photosensitive unit 10C is used inassembling of camera module, the photosensitive sensor 121C is sealedinside and forms a sealed interior space.

Specifically, in production of the photosensitive unit 10C, aconventional circuit board can be selected to make the main circuitboard 122C. The photosensitive sensor 121C is deployed on the maincircuit board 122C and electrically connected by the connecting element124C. Then, after the main circuit board 122C and the photosensitivesensor 121C are initially assembled, they are processed by Surface MountTechnology (SMT) and molded by means of the insert molding technique,for example, by an injection molding machine, to form the encapsulationportion 11C, or by means of the pressing molding technique, which iscommonly used in semiconductor packaging, to form the encapsulationportion 11C. The main circuit board 122C can selectively be, for examplebut not limited to, rigid-flex board, ceramic substrate (withoutflexible board), or rigid PCB (without flexible board). Theencapsulation portion 11C can be made selectively by, for example butnot limited to, injection molding technique, pressing molding techniqueand etc. The material of the encapsulation portion 11C can be, forexample but not limited to, nylon, liquid crystal polymer (LCP), orpolypropylene (PP) for injection molding, or resin for pressing molding.Person skilled in the art should understand that the above availablemanufacture methods and available materials are examples to describeavailable implementations of the present invention, rather thanlimitations of the present invention.

The photosensitive unit 10C further includes an optical filter 20C,wherein the optical filter 20C is molded to overlappedly disposed on thephotosensitive sensor 121C. The edges of the optical filter 20C aremolded by the encapsulation portion 11C so as to affix the opticalfilter 20C in position. It is worth mentioning that the optical filter20C covers on the photosensitive sensor 121C and insulates thephotosensitive sensor 121C from the external environment to protect thephotosensitive sensor 121C from damage and prevent dusts from enteringtherein.

To produce the photosensitive unit 10C, the photosensitive sensor 121Cis firstly adhered on the main circuit board 122C and the connectingelement 124C is connected with the photosensitive sensor 121C and themain circuit board 122C. Then, the optical filter 20C is adhered on thephotosensitive sensor 121C. Thereafter, the main circuit board, thephotosensitive sensor 121C, and the optical filter 20C are molded toform the encapsulation portion 11C. During the molding process, sincethe optical filter 20C covers on top of the photosensitive sensor 121C,any damage caused by the molding mold to the photosensitive sensor 121Ccan be prevented. In addition, because the distance between the opticalfilter 20C and the photosensitive sensor 121C is shortened, the backfocal length of the camera module assembled thereby can also beshortened, so that the height of the camera module is reduced too. Onthe other hand, since there is no need to provide an additionalsupporting component for the optical filter 20C, the thickness of thecamera module can be further reduced.

It is worth mentioning that the inner walls of the encapsulation portion10C, which define the window 1100C, can be shaped according to therequired connection shape. For example, it can be in an inclined andslope shape, so that the window 1100C reduces its size gradually towardsits bottom and thus has a larger upper size and a smaller lower size.Therefore, the photosensitive sensor 121C is capable of receiving morelight while the connecting element 124C is encapsulated and wrapped upby the photosensitive portion 10C. Person skilled in the art shouldunderstand that specific shape of the encapsulation portion 11C shallnot limit the scope of the present invention.

Referring to FIGS. 17 to 19, the camera module according to the fifthpreferred embodiment of the present invention can be a fixed focusmodule, which includes one the photosensitive unit 10C and one thecamera lens 30C. The camera lens 30C is mounted on the photosensitiveunit 10C for assembling to form the camera module.

Especially, the camera lens 30C can be affixed on top of theencapsulation portion 11C of the photosensitive unit 10C by means ofadhering. In addition, taking advantage of the features of the moldingproduction in the molding technique, the top portion of theencapsulation portion 11C can have a better evenness and smoothness thatprovides an excellent installation condition for the camera lens 30C, soas to achieve a high quality camera module.

It is worth mentioning that the camera lens 30C is supported on top ofthe encapsulation portion 11C of the photosensitive unit 10C. Therefore,the encapsulation portion 11C itself functions as the independentmounting frame of a conventional camera module to provide supportive andholding site, but it is assembled by different technical process fromthe conventional COB technology. The independent mounting frame of acamera module based on the conventional COB technique is affixed on thecircuit board by means of adhering, but the encapsulation portion 11C ofthe present invention is affixed on the main circuit board 122C by meansof molding that does not require the process of adhering and affixing.Contrasting to the process of adhering and affixing, the process ofmolding provides better connection stability and technological processcontrollability. In addition, it does not have to reserve the adhesivespace between the encapsulation portion 11C and the main circuit board122C for AA adjustment. Therefore, it saves the adhesive space of AAadjustment of conventional camera module, and allows the thickness ofthe camera module to be further reduced. Meanwhile, the encapsulationportion 11C encapsulates and wraps the circuit elements 123C and theconnecting elements 124C, that enables the function of the conventionalmounting frame, the circuit elements 123C, and the connecting element124C can spatially overlap without the need to reserve a safety distancearound the circuit components as in the conventional camera module. As aresult, the height of the encapsulation portion 11C, which functions asthe independent mounting frame, can be arranged in a smaller range, soas to further provide room for reducing the thickness of the cameramodule. Besides, the encapsulation portion 11C substitutes theconventional independent mounting frame to avoid any tilt deviationoccurred during the attaching and assembling the mounting frame and toreduce the accumulated tolerance of the assembling of the camera module.In addition, the encapsulation portion 11C encapsulates and wraps up theconnecting element 124C and extends to the non-photosensitive area 1212Cof the photosensitive sensor 121C, that allows the encapsulation portion11C to shrink inwardly, so as to further decrease the lateral sizes inlength and width of the camera module. Also, the photosensitive unit 10Cmolds the optical filter 20C therein, so when assembling the cameramodule, it is not necessary to conduct one more optical filterattachment process. As a result, the assembling technological process ofthe camera module can be minimized while the efficiency can be enhanced.These are both superior to the traditional art.

Referring to FIGS. 17, 18, and 20, an alternative mode of the cameramodule according to the fifth preferred embodiment of the presentinvention is illustrated. The camera module can be an Automatic FocusCamera Module (AFCM), which includes one the photosensitive unit 10C,one the motor 40C, and one the camera lens 30C.

The camera lens 30C is installed on the motor unit 40C. The motor unit40C is installed on the photosensitive unit 10C, so as to allow focallength adjustment of the camera module through the motor unit 40C. Themotor unit 40C is mounted on top of the encapsulation portion 11C of thephotosensitive unit 10C.

Particularly, one or more carving lines 114C are provided toelectrically connect the motor unit 40C and the main circuit board 122Cof the photosensitive portion 12C, so that it does not require forsoldering connecting element(s) such as lead wire(s) for connecting themotor unit 40C with the main circuit board 122C of the photosensitiveportion 12C, that eliminates the technological process in motorsoldering.

Those skilled in the art should understand that the structures and formsof the camera module mentioned above are just examples to describe waysof implementing the camera module, rather than limitations of thepresent invention.

Referring to FIGS. 21 and 22, the photosensitive unit and camera moduleaccording to a sixth preferred embodiment of the present invention areillustrated. The photosensitive unit 10D is adapted for assembling andproducing camera module to achieve the molded camera module. Thephotosensitive unit 10D includes an encapsulation portion 11D and aphotosensitive portion 12D, wherein the encapsulation portion 11D ismolded to connect to the photosensitive portion 12D.

Especially, the encapsulation portion is molded to couple to thephotosensitive portion 12D with the method of MOC.

The photosensitive portion 12D includes a main circuit board 122D and aphotosensitive sensor 121D, wherein the photosensitive sensor 121D isdisposed on the main circuit board 122D. According to the present sixthembodiment of the present invention, the photosensitive sensor 121D ismolded to connect to the main circuit board 122D.

According to the present sixth embodiment of the present invention, thephotosensitive portion 12D includes a connecting circuit (not shown inthe figures) and at least a circuit element 123D. The connecting circuitis preinstalled in the main circuit board 122D. The circuit element 123Dis electrically connected to the connecting circuit and thephotosensitive sensor 121D to enables the photosensitive sensor 121D toperform the photosensing process thereof. The circuit element 123D isprotrudingly deployed on the main circuit board 122D. The circuitelement 123D can be, for example but not limited to, resistors,capacitors, diodes, triodes, potentiometers, electric relays, oractuators. It is worth mentioning that the encapsulation portion 11Dencapsulates and wraps up the circuit element 123D therein, so that thecircuit element 123D will not be directly exposed in the open space, andmore specifically, not be exposed in the environment that communicateswith the photosensitive sensor 121D. Therefore, during the assembling ofthe camera module, the circuit element 123D will not be contaminated bypollutants, such as dusts, or influence the photosensitive sensor 121D,which is different from the arrangement of the conventional cameramodule that the circuit element 123D, such as resistance-capacitancecomponents, is exposed outside. The use of the molding encapsulating andwrapping method prevents sundries and dusts from staying on the surfaceof the circuit element 123D and avoids the photosensitive sensor 121Dfrom being contaminated and causing dark spots and other defectives ofthe camera module.

The encapsulation portion 11D forms a window 1100D to provide aphotosensitive path for the photosensitive sensor 121D.

According to the present sixth preferred embodiment of the presentinvention, the photosensitive portion 12D includes at least oneconnecting element 124D for electrically connecting the photosensitivesensor 121D with the main circuit board 122D. Further, each of theconnecting elements 124D can be embodied as, specifically but notlimited to, gold wire, copper wire, aluminum wire, and/or silver wire.

It is worth mentioning that each connecting element 124D is molded to bein the encapsulation portion 11D, so as to utilize the encapsulationportion 11D to enclose, case and/or wrap up each of the connectingelement(s) 124D and keep them from direct exposure to the outside.Therefore, during the assembling of the camera module, the connectingelement(s) 124D will not suffer any collision or damage, that, at thesame time, reduces the impact due to the environmental factors, such astemperature, on the connecting element 124D and stabilizes thecommunication and connection between the photosensitive sensor 121D andthe main circuit board 122D. This is basically failed to be provided inthe traditional art.

It is worth mentioning that the encapsulation portion 11D encapsulatesand wraps up the circuit element 123D and the connecting element 124D,providing advantages in protecting the circuit element 123D and theconnecting element 124D as well as obtaining a higher performance cameramodule. However, those skilled in the art should understand that theencapsulation portion 11D shall not be limited in encapsulating andwrapping up the circuit elements 123D and/or the connecting element124D. In other words, in other embodiments of the present invention, theencapsulation portion 11D can be directly molded on the main circuitboard 122D without protruded circuit element 123D thereon or be moldedon various positions, such as the outer sides, periphery, and etc., ofthe circuit element 123D.

The photosensitive unit 10D further includes an optical filter 20D,wherein the optical filter 20D is molded to overlappedly disposed abovethe photosensitive sensor 121D. The edges of the optical filter 20D ismolded by the encapsulation portion 11D that holds the optical filter20D in position. It is worth mentioning that the optical filter 20Dcovers the photosensitive sensor 121D and insulates the photosensitivesensor 121D from the external environment to protect the photosensitivesensor 121D from damage and prevent dusts from entering therein.

In addition, the photosensitive sensor 121D has a photosensitive area1211D and a non-photosensitive area 1212D, wherein thenon-photosensitive area 1212D is positioned surrounding the periphery ofthe photosensitive area 1211D. The photosensitive area 1211D is adaptedfor conducting photosensitization. The connecting element 124D isconnected to the non-photosensitive area 1212D.

According to the sixth preferred embodiment of the present invention,the encapsulation portion 11D is extended to the non-photosensitive area1212D of the photosensitive sensor 121D, so as to overlappedly mount thephotosensitive sensor 121D on the main circuit board 122D by means ofmolding. In this manner, such as by the method of Molding on Chip (MOC),the moldable area of the encapsulation portion 11D can be extendedinwardly, such that the structural portion of the outer portion of theencapsulation portion 11D and the main circuit board 122D can bereduced, that further reduces the size in length and width of the moldedphotosensitive portion 12D and reduces the size in length and width ofthe camera module assembled thereby.

In the present sixth embodiment of the present invention, theencapsulation portion 11D is protruded to position surrounding theoutside of the photosensitive area 1211D of the photosensitive sensor121D. Particularly, the encapsulation portion 11D integrally enclosesall connection of the photosensitive sensor 121D and the circuitelements 123D with the main circuit board 122D, so as to provide a goodsealingness and tightness. Therefore, when the photosensitive unit 10Dis used in assembling the camera module, the photosensitive sensor 121Dhas been sealed inside to form a sealed inner space.

Particularly, in producing the photosensitive unit 10D, a conventionalcircuit board can be used to make the main circuit board 122D. Thephotosensitive sensor 121D is deployed on the main circuit board 122Dand electrically connected by the connecting elements 124D. Then, afterthe main circuit board 122D and the photosensitive sensor 121D areinitially assembled, they are processed by Surface Mount Technology(SMT) and then molded by the insert molding technique, for example bymeans of an injection molding machine, to form the encapsulation portion11D, or molded by the pressing molding technique, which is commonlyapplied in semiconductor packaging, to form the encapsulation portion11D. The main circuit board 122D can selectively be, for example but notlimited to, rigid-flex board, ceramic substrate (without flexibleboard), or rigid PCB (without flexible board). The formation of theencapsulation portion 11D can be selected by, for example but notlimited to, injection molding technique and pressing molding technique.The material of the encapsulation portion 11D can be, for example butnot limited to, nylon, liquid crystal polymer (LCP), or polypropylene(PP) for injection molding technique, or resin for pressing moldingtechnique. Person skilled in the art should understand that the aboveavailable manufacture methods and available materials are examples todescribe available implementations of the present invention, rather thanlimitations of the present invention.

Furthermore, the encapsulation portion 11D includes a covering section111D, an optical filter installing section 112D and a camera lensinstalling section 113D. The optical filter installing section 112D andthe camera lens installing section 113D are molded with the coveringsection 111D in order to form an integral body. The covering section111D is molded on the main circuit board 122D to wrap up and enclose thecircuit element 123D and the connecting element 124D. The optical filterinstalling section 112D of the encapsulation portion 11D extends toencapsulate and wrap up outer portion of the optical filter 20D tointegrally install the optical filter 20D on top of the photosensitivesensor 121D. The camera lens installing section 113D is integrally andextended from the optical filter installing section 112D to form atubular body for mounting a camera lens 30D therein. In other words,when the photosensitive unit 10D is used in assembling the cameramodule, the camera lens 30D is mounted within the camera lens installingsection 113D of the encapsulation portion 11D, which provides a stablemounting site for the camera lens 30D. The camera lens installingsection 113D defines a lens installing grooves 1131D. The lensinstalling groove 1131D is communicated with the window 1100D andprovides adequate installation space for the camera lens 30D. In otherwords, the encapsulation portion 11D provides an installing groove 1121Din the optical filter installing section 112D and the lens installinggroove 1131D in the camera lens installing section 113D. The opticalfilter 20D is molded in the installing groove 1121D. The camera lens 30Dis installed in the lens installing groove 1131D.

The camera lens installing section 113D is integrally extended upwardsas shown in FIGS. 21 and 22 to form a step structure therein, so as toprovide a supportive mounting site for the camera lens 30D, so that itdoes not require extra component for the installation of the camera lens30D. In other words, the encapsulation portion 11D is molded tointegrally extend from the main circuit board 122D and form an internalstep shape structure to encapsulate and to support the camera lens 30D.

The tubular camera lens installing section 113D has a camera lens innerwall 1132D. The camera lens inner wall 1132D is in close ring shape andadapted for providing an installation room for the camera lens 30D. Itis worth mentioning that the surface of the camera lens inner wall 1132Dof the camera lens installing section 113D is flat and smooth, which isadapted for installing the camera lens 30D that is thread less to form afixed focus module. Particularly, the camera lens 30D can be secured inthe camera lens installing section 113D by adhering.

It is worth mentioning that the inner wall of the covering section 111Dof the encapsulation portion 11D can be shaped according to the shape ofthe object to be connected. For example, it can be inclined and slopeshape, so that the encapsulation portion 11D not only encapsulates andwrap up the connecting elements 124D, but also ensure the photosensitivesensor 121D can receive more light through the window 1100D. Personskilled in the art should understand that specific shape of theencapsulation portion 11D shall not confine the present invention.

Referring to FIG. 22, the camera module according to the sixth preferredembodiment of the present invention can be a fixed focus module. Thecamera module includes one the photosensitive unit 10D and one thecamera lens 30D.

More specifically, the camera lens 30D is installed in the camera lensinstalling groove 1131D of the camera lens installing section 113D ofthe encapsulation portion 11D of the photosensitive unit 10D. Theoptical filter 20D is molded on the photosensitive unit 11D. Therefore,no additional independent optical filter is required and it isunnecessary to further separately install the optical filter whenassembling the camera module. Hence, the assembling processes can bereduced and the back focal length of the camera module can be decreaseddue to the molded optical filter arrangement of the present invention.

It is also worth mentioning that the camera lens 30D is supported in thecamera lens installing section 113D of the encapsulation portion 11D ofthe photosensitive unit 10D. Therefore, the encapsulation portion 11Dwould be functioned as the mounting frame or lens barrel of theconventional camera module to provide a supportive and holding site, butthe present invention is assembled by different technical process fromconventional COB technology. The mounting frame of the conventionalcamera module based on conventional COB technique is affixed on thecircuit board by adhesive, but the encapsulation portion 11D of thepresent invention is affixed on the main circuit board 122D by means ofmolding technique that does not require the adhering and affixingprocess. The molding method with respect to the conventional adheringand affixing method has better connection stability and technologicalprocess controllability. Besides, it does not have to reserve anyadhesive space between the encapsulation portion 11D and the maincircuit board 122D for AA adjustment, and thus saves the adhesive spaceof AA adjustment for conventional camera module, that allows thethickness of the camera module to be further reduced. Also, theencapsulation portion 11D according to the molding arrangement of thepresent invention has better smoothness and evenness, so that whenassembling the camera module, it is unnecessary to conduct AAadjustment. Furthermore, the encapsulation portion 11D, whichencapsulates and wraps the circuit elements 123D and the connectingelements 124D therein, allows the function of the conventional mountingframe, the circuit elements 123D and the connecting element 124D beingspatially overlapped by molding to fill all the space between thecomponents including the circuit elements 123D and the connectingelements 124D to form a solid body, that is distinctive from theconventional camera module that requires to reserve safety distancearound all the circuit components. As a result, the height of theencapsulation portion 11D that can be functioned as the mounting framecan be arranged in a smaller range, so as to further provide room forreducing the thickness of the camera module. Besides, the encapsulationportion 11D eliminates the conventional mounting frame but providesinstalling site for the camera lens 30D by itself, that avoids any tiltdeviation generally occurred in attaching and assembling theconventional mounting frame and reduces the accumulated tolerance duringthe assembling of the camera module. In addition, the encapsulationportion 11D, which encapsulates and wraps up the connecting element124D, extends to the non-photosensitive area 1212D of the photosensitivesensor 121D to allow the encapsulation portion 11D to shrink inwardly,so as to further decrease the lateral sizes in length and width of thecamera module.

Referring to FIGS. 23 and 24, a photosensitive unit according to aseventh preferred embodiment of the present invention is illustrated.The photosensitive unit 10F is used for assembling and producing ofcamera module, so as to achieve a molded camera module. Thephotosensitive unit 10F includes an encapsulation portion 11F and aphotosensitive portion 12F, wherein the encapsulation portion 11F ismolded with the photosensitive portion 12F to form an integral body.

The photosensitive portion 12F includes a main circuit board 122F and aphotosensitive sensor 121F, wherein the photosensitive sensor 121F isdisposed on the main circuit board 122F. According to the presentembodiment of the present invention, the photosensitive sensor 121F ismolded to connect to the main circuit board 122F.

According to the present seventh embodiment of the present invention,the photosensitive portion 12F includes a connecting circuit (not shownin the figures) and at least a circuit element 123F. The connectingcircuit is preinstalled in the main circuit board 122F. The circuitelement(s) 123F is electrically connected to the connecting circuit andthe photosensitive sensor 121F, so that the photosensitive sensor 121Fis capable of processing its photosensing processes. The circuit element123F is protrudingly deployed on the main circuit board 122F. Thecircuit element 123F can be, for example but not limited to, resistors,capacitors, diodes, triodes, potentiometers, electric relays, oractuators.

It is worth mentioning that the encapsulation portion 11F encapsulatesand wraps up the circuit elements 123F therein, so that the circuitelements 123F will not be directly exposed in the open space, and morespecifically, not be exposed in the environment that communicates withthe photosensitive sensor 121F. Therefore, during assembling of thecamera module, the circuit element 123F will not be contaminated bypollutants, such as dusts, or influence the photosensitive sensor 121F,that is different from the arrangement of the conventional camera modulethat the circuit elements 123F, such as resistance-capacitancecomponents, are exposed to the open space. The usage of the moldingmethod prevents sundries and dusts from staying on the surface of thecircuit element 123F and avoids the photosensitive sensor 121F frombeing contaminated and causing dark spots and other defectives of thecamera module.

The encapsulation portion 11F forms a window 1100F to provide aphotosensitive path for the photosensitive sensor 121F.

According to the present preferred embodiment of the present invention,the photosensitive portion 12F includes at least one connecting element124F for electrically connecting the photosensitive sensor 121F with themain circuit board 122F. Further, each of the connecting elements 124Fcan be embodied to be, specifically but not limited to, gold wire,copper wire, aluminum wire, and/or silver wire.

It is worth mentioning that each connecting element 124F is moldedinside the encapsulation portion 11F, so that the encapsulation portion11F encloses, encapsulates and/or wraps up each of the connectingelements 124F by filling all spaces between them and keeps them fromdirect exposure to the outside. Therefore, during the assembling of thecamera module, the connecting element(s) 124F will not suffer anycollision or damage, that, at the same time, reduces the impact from theenvironmental factors, such as temperature, on the connecting element124F and stabilizes the communication and connection between thephotosensitive sensor 121F and the main circuit board 122F. This is notbeing provided in the conventional art.

It is worth mentioning that the encapsulation portion 11F encapsulatesand wraps up the circuit element(s) 123F and the connecting element(s)124F, which advantages in protecting the circuit element(s) 123F and theconnecting element(s) 124F as well as obtaining a higher performancecamera module. However, those skilled in the art should understand thatthe encapsulation portion 11F shall not be limited in wrapping up thecircuit elements 123F and/or the connecting elements 124F. In otherwords, in other embodiments of the present invention, the encapsulationportion 11F can be directly molded on the main circuit board 122F thathas no circuit element 123F protruded thereon or be molded on variouspositions, such as the outer side, periphery, etc., of the circuitelement 123F.

In addition, the photosensitive sensor 121F has a photosensitive area1211F and a non-photosensitive area 1212F, wherein thenon-photosensitive area 1212F is positioned surrounding the periphery ofthe photosensitive area 1211F. The photosensitive area 1211F is adaptedfor conducting photosensitization. The connecting element 124F isconnected to the non-photosensitive area 1212F.

According to the seventh preferred embodiment of the present invention,the encapsulation portion 11F is extended to mold on thenon-photosensitive area 1212F of the photosensitive sensor 121F, so asto overlappedly install the photosensitive sensor 121F on the maincircuit board 122F by means of molding. In this manner, such as by themethod of Molding on Chip, the moldable area is extended towards theinside of the encapsulation portion 11F, such that the structuralportion outside of the encapsulation portion 11F and the main circuitboard 122F can be reduced, that further reduces the size in length andwidth of the molded photosensitive portion 12F and reduces the size inlength and width of the camera module assembled thereby.

In the present seventh embodiment of the present invention, theencapsulation portion 11F is protrudingly positioned surrounding theouter portion of the photosensitive area 1211F of the photosensitivesensor 121F. Particularly, the encapsulation portion 11F integrallyencloses the connection of the photosensitive sensor 121F and the mainelectric board 122F, so as to provide a good sealingness and tightnesstherefor. Therefore, when the photosensitive unit 10F is used inassembling of the camera module, the photosensitive sensor 121F will besealed inside to form a sealed inner space.

Specifically, the production of the photosensitive unit 10F may use aconventional circuit board to be the main circuit board 122F. Aphotosensitive sensor 121F is deployed on the main circuit board 122Fand electrically connected by the connecting element(s) 124F. Then,after the initial assembling of the main circuit board 122F and thephotosensitive sensor 121F by molding, the main circuit board 122F andthe photosensitive sensor 121F connected thereon are processed bySurface Mount Technology (SMT) and then molded, for example by means ofthe insert molding technique, by an injection molding machine to formthe encapsulation portion 11F, or by means of the pressing moldingtechnique, which is commonly used in semiconductor packaging, to formthe encapsulation portion 11F. The main circuit board 122F canselectively be, for example but not limited to, rigid-flex board,ceramic substrate (without flexible board), or rigid PCB (withoutflexible board). The method to form the encapsulation portion 11F can beselected from, for example but not limited to, injection moldingtechnique and pressing molding technique. The material of theencapsulation portion 11F can be, for example but not limited to, nylon,liquid crystal polymer (LCP), or polypropylene (PP) for injectionmolding technique, or resin for pressing molding technique. Thoseskilled in the art should understand that the above availablemanufacture methods and available materials are examples to describeavailable implementations of the present invention, rather thanlimitations of the present invention.

Furthermore, the encapsulation portion 11F includes a covering section111F and an optical filter installing section 112F. The optical filterinstalling section 112F and the covering section are molded integrallyto form an integral body. The covering section 111F is molded to coverand attach on the main circuit board 122F for encapsulating, wrapping upand covering the circuit element(s) 123F and the connecting element(s)124F. The optical filter installing section 112F is adapted forinstalling the optical filter 20F. In other words, when thephotosensitive unit 10F is used in assembling the camera module, theoptical filter 20F of the camera module is mounted at the optical filterinstalling section 112F, while ensuring the optical filter 20F bedeployed along the photosensitive path of the photosensitive sensor 121Fthat does not require any additional mounting frame for the opticalfilter 20F. In other words, the encapsulation portion 11F of the presentinvention itself also functions as a conventional mounting frame. Inaddition, taking advantage of the molding technique, the top of theoptical filter installing section 112F can be molded to have goodflatness and evenness, so as to allow the optical filter 20F to beevenly installed thereon. This feature is superior to the conventionalcamera modules.

Furthermore, the optical filter installing section 112F has aninstalling groove 1121F provided therein. The installing groove 1121Fcommunicates with the window 1100F to provide adequate installationspace for the optical filter 20F, such that the optical filter 20F willnot protrude from the top surface of the optical filter installingsection 112F. In other words, the top of the encapsulation portion 11Fwith the installing groove 1121F provided therein is adapted for theoptical filter 20F to be installed on the encapsulation portion 11Fwithout protruding out from the top of the encapsulation portion 11F.

It is worth mentioning that the inner wall of the encapsulation portion11F can be shaped with respect to the object such as the optical filterto be connected. For example, it can be in an inclined or slope shape,so that while the connecting elements 124F are encapsulated and wrapped,the photosensitive sensor 121F can still receive more light through thewindow 1100F and the installing groove 1121F. Those skilled in the artshould understand that specific shape of the encapsulation portion 11Fshall not confine the present invention.

The different between this seventh preferred embodiment with the otherpreferred embodiments of the present invention, one or more reinforcedholes 1221F are formed on top of the main circuit board 122F and thebottom of the encapsulation portion 11F is molded to extend into thereinforced holes 1221F, so as to enhance the structural strength of themain circuit board 122F and connection of the main circuit board 122Fand the encapsulation portion 11F. In other words, the combination oftwo different materials of the main circuit board 122F and theencapsulation portion 11F forms a combined composite structure that canenforce the structural strength of the main circuit board 122F as a basebody.

The positions of the reinforced holes 1221F can be determined based onpractical needs and arranged according to the need of the structuralstrength of the circuit board, for example a symmetrical arrangement. Byreinforcing the structural strength of the main circuit board 122F withsuch reinforced holes 1221F which are filled with the encapsulationportion 11F, the thickness of the main circuit board 122F and thethickness of the camera module assembled thereof can thus be reduced.Besides, the heat dissipative ability of the photosensitive unit 10F isenhanced as well.

It is worth mentioning that, according to the present seventh preferredembodiment of the present invention, the reinforced holes 1221F areindented slots that avoid the molding material of the encapsulationportion 11F from leaking through the reinforced holes 1221F when moldingto make the photosensitive unit 10F.

Similar to the above preferred embodiments, the photosensitive unit 10Fcan be assembled for a fixed focus module or zoom lens module. Thoseskilled in the art should understand that the assembling and applicationways of the photosensitive unit 10F shall not considered be limitationsof the present invention.

Referring to FIG. 25, a photosensitive unit according to a eighthpreferred embodiment of the present invention is illustrated. Thephotosensitive unit 10G is adapted for assembling and producing cameramodule, so as to obtain the molded camera module. The photosensitiveunit 10G includes an encapsulation portion 11G and a photosensitiveportion 12G, wherein the encapsulation portion 11G is molded to connectwith the photosensitive portion 12G.

The photosensitive portion 12G includes a main circuit board 122G and aphotosensitive sensor 121G, wherein the photosensitive sensor 121G isdisposed on the main circuit board 122G. According to the present eighthembodiment of the present invention, the photosensitive sensor 121G ismolded to connected to the main circuit board.

According to the present eighth embodiment of the present invention, thephotosensitive portion 12G includes a connecting circuit (not shown inthe figures) and at least a circuit element 123G. The connecting circuitis preinstalled in the main circuit board 122G. The circuit element(s)123G is electrically connected to the connecting circuit and thephotosensitive sensor 121G, wherein the photosensitive sensor 121G isarranged to process its photosensing processes. The circuit element 123Gis protrudingly deployed on the main circuit board 122G. The circuitelement 123G can be, for example but not limited to, resistors,capacitors, diodes, triodes, potentiometers, electric relays, oractuators.

It is worth mentioning that the encapsulation portion 11G encapsulatesand wraps up the circuit element(s) 123G therein, so that the circuitelement(s) 123G will not be directly exposed in the open space, and morespecifically, not be exposed in the environment that communicates withthe photosensitive sensor 121G. Therefore, during assembling the cameramodule, the circuit element 123G will not contaminated pollutants, suchas dusts, or influence the photosensitive sensor 121G, which isdifferent from the arrangement of conventional camera module that itscircuit elements 123G, such as resistance-capacitance components, areexposed to outside. The use of the molding method in the presentinvention prevents sundries and dusts from staying on the surface of thecircuit element(s) 123G and avoids the photosensitive sensor 121G frombeing contaminated and causing dark spots and other defectives of thecamera module.

The encapsulation portion 11G forms a window 1100G to provide aphotosensitive path for the photosensitive sensor 121G.

According to the present preferred embodiment of the present invention,the photosensitive portion 12G includes at least one connecting element124G for electrically connecting the photosensitive sensor 121G with themain circuit board 122G. Further, each of the connecting elements 124Gcan be embodied to be, specifically but not limited to, gold wire,copper wire, aluminum wire, and/or silver wire.

It is worth mentioning that each connecting element 124G is moldedinside the encapsulation portion 11G so that the encapsulation portion11G encloses, encapsulates and/or wraps up the connecting elements 124Gand keep them from direct exposure to the outside. Therefore, duringassembling the camera module, the connecting element(s) 124G will notsuffer any collision or damage, that, at the same time, reduces theimpact due to the environmental factors, such as temperature, on theconnecting elements 124G and stabilizes the communication and connectionbetween the photosensitive sensor 121G and the main circuit board 122G.This is generally failed to be provided in the conventional art.

It is worth mentioning that the encapsulation portion 11G encapsulatesand wraps up the circuit element(s) 123G and the connecting element(s)124G, that advantages in protecting the circuit element(s) 123G and theconnecting element(s) 124G as well as obtaining a better performancecamera module. However, those skilled in the art should understand thatthe encapsulation portion 11G shall not be limited in encapsulating andwrapping up the circuit element(s) 123G and/or the connecting element(s)124G. In other words, in other embodiments of the present invention, theencapsulation portion 11G can be directly molded on the main circuitboard 122G with no protruded circuit element 123G or be molded onvarious positions, such as the outer side, periphery, etc., of thecircuit element 123G.

In addition, the photosensitive sensor 121G has a photosensitive area1211G and a non-photosensitive area 1212G, wherein thenon-photosensitive area 1212G is positioned surrounding the periphery ofthe photosensitive area 1211G. The photosensitive area 1211G is adaptedfor conducting photosensitization. The connecting element 124G isconnected to the non-photosensitive area 1212G.

According to the eighth preferred embodiment of the present invention,the encapsulation portion 11G is extended to mold on thenon-photosensitive area 1212G of the photosensitive sensor 121G, so asto overlappedly mount the photosensitive sensor 121G on the main circuitboard 122G by means of molding. In this manner, such as by the method ofMolding on Chip, the moldable area of the encapsulation portion 11G canbe extended inwardly, such that the outer structural portion of theencapsulation portion 11G and the main circuit board 122G can bereduced, which further reduces the size in length and width of themolded photosensitive portion 12G and reduces the size in length andwidth of the camera module assembled thereby.

In the present eighth embodiment of the present invention, theencapsulation portion 11G is protrudingly positioned surrounding theouter portion of the photosensitive area 1211G of the photosensitivesensor 121G. Particularly, the encapsulation portion 11G integrallyencloses the connection of the photosensitive sensor 121G and the maincircuit board 122B, so as to achieve a good sealingness and tightness.Therefore, when the photosensitive unit 10G is used in assembling thecamera module, the photosensitive sensor 121G is sealed inside to form asealed inner space.

Specifically, the production of the photosensitive unit 10G may use aconventional circuit board to make the main circuit board 122G. Thephotosensitive sensor 121G is deployed on the main circuit board 122Gand electrically connected by the connecting element(s) 124G. Then,after the initial assembling of the main circuit board 122G and thephotosensitive sensor 121G, they are processed by Surface MountTechnology (SMT) and then molded, for example by means of the insertmolding technique by an injection molding machine, to form theencapsulation portion 11G, or by means of the pressing moldingtechnique, which is commonly applied in semiconductor packaging, to formthe encapsulation portion 11G. The main circuit board 122G canselectively be, for example but not limited to, rigid-flex board,ceramic substrate (without flexible board), or rigid PCB (withoutflexible board). The method to form the encapsulation portion 11G can beselected from, for example but not limited to, injection moldingtechnique and pressing molding technique. The material of theencapsulation portion 11G can be, for example but not limited to, nylon,liquid crystal polymer (LCP), or polypropylene (PP) for injectionmolding technique, or resin for pressing molding technique. Thoseskilled in the art should understand that the above availablemanufacture methods and available materials are examples to describeavailable implementations of the present invention, rather thanlimitations of the present invention.

Furthermore, the encapsulation portion 11G includes a covering section111G and an optical filter installing section 112G. The optical filterinstalling section 112G is molded on top of the covering section 111Gintegrally. The covering section 111G is molded to attach on the maincircuit board 122G for encapsulating, wrapping up and covering thecircuit element(s) 123G and the connecting element(s) 124G. The opticalfilter installing section 112G is arranged for mounting the opticalfilter 20G therein. In other words, when the photosensitive unit 10G isused in assembling the camera module, the optical filter 20G of thecamera module is mounted at the optical filter installing section 112G,which ensures the optical filter 20G to be deployed along thephotosensitive path of the photosensitive sensor 121G and does notrequire any additional mounting frame for the optical filter 20G. Inother words, the encapsulation portion 11G of the present inventionitself also functions as a conventional mounting frame, while takingadvantage of the molding technique, the top of the optical filterinstalling section 112G has a good flatness and smoothness by moldingthat allows the optical filter 20G to be evenly installed thereon. Thisis superior to the conventional camera modules.

In addition, the optical filter installing section 112G has aninstalling groove 1121G formed therein. The installing groove 1121Gcommunicates to the window 1100G to provide adequate installation spacefor installing the optical filter 20G, such that the optical filter 20Gwill not protrude from the top surface of the optical filter installingsection 112G. In other words, the top of the encapsulation portion 11Ghaving the installing groove 1121G provided therein, so that the opticalfilter 20G can be installed in the encapsulation portion 11G withoutprotruding out from the top of the encapsulation portion 11G.

It is worth mentioning that the inner walls of the encapsulation portion11G, including the inner wall of the window 1100G and the inner wall ofthe installing groove 1121G, can be shaped with respect to the size andshape of the object including the optical filter 20F to be connectedthereto. For example, the inner wall of each of the window 1100G and theinstalling groove 1121G can be in inclined or slope shape, having alarger upper size and a smaller lower size, so that the photosensitivesensor 121G can receive as much light as possible when the connectingelement(s) 124G is encapsulated and wrapped up in encapsulation portion11G. Those skilled in the art should understand that specific shape ofthe encapsulation portion 11G shall not limit the scope of the presentinvention.

The different of this eighth preferred embodiment with the otherpreferred embodiments, the main circuit board 122G has one or morereinforced holes 1221G and the encapsulation portion 11G is molded toextend into the reinforced holes 1221G, so as to enhance the structuralstrength of the main circuit board 122G. In other words, the combinationof two different materials forms a combined composite structure thatreinforces the structural strength of the main circuit board 122G, as abase.

The positions of the reinforced holes 1221G can be determined accordingto the practical needs and provided according to the need of thestructural strength of the main circuit board 122G. For example, thereinforced holes 1221G can be constructed in a symmetric manner. Thearrangement of the reinforced holes 1221G enables the encapsulationportion 11G filling therein to reinforce the structural strength of themain circuit board 122G, which allows the thickness of the main circuitboard 122G and the thickness of the camera module assembled thereofbeing reduced and enhances the heat dissipation ability of thephotosensitive unit 10G as well.

It is worth mentioning that, according to the present eighth preferredembodiment of the present invention, the reinforced holes 1221G arethrough holes penetrating through the main circuit board 122G tocommunicate both sides of the main circuit board 122G. Therefore, duringthe production of the photosensitive unit 10G, the molding material ofthe encapsulation portion 11G can be fully bonded with the main circuitboard 122G to form a more solid structure of combined compositematerial. Besides, the through hole type reinforced hole of this eighthpreferred embodiment would be more easy to make than the indention typereinforced hole in the above seventh preferred embodiment.

Similar to the above preferred embodiments, the photosensitive unit 10Gcan be assembled for a fixed focus module or zoom lens module. Thoseskilled in the art should understand that the assembling and applicationways of the photosensitive unit 10G shall not be limitations of thepresent invention.

Referring to FIG. 26, the camera module according to a ninth preferredembodiment of the present invention is illustrated. The camera modulecan be a fixed focus module (FFM). The camera module includes aphotosensitive unit 10H, a frame 50H, an optical filter 20H, and acamera lens 30H.

The frame 50H is mounted on the photosensitive unit 10H, wherein theoptical filter 20H is mounted on the frame 50H and the camera lens 30His mounted on the frame 50H.

The photosensitive unit 10H includes an encapsulation portion 11H and aphotosensitive portion 12H, wherein the encapsulation portion 11H ismolded to connect to the photosensitive portion 12H.

The photosensitive portion 12H includes a main circuit board 122H and aphotosensitive sensor 121H, wherein the photosensitive sensor 121H isdisposed on the main circuit board 122H. According to the present ninthembodiment of the present invention, the photosensitive sensor 121H ismolded to connect to the main circuit board 122H.

According to the present ninth embodiment of the present invention, thephotosensitive portion 12H includes a connecting circuit (not shown inthe figures) and at least a circuit element 123H. The connecting circuitis preinstalled in the main circuit board 122H. The circuit element 123His electrically connected to the connecting circuit and thephotosensitive sensor 121H, wherein the photosensitive sensor 121H wouldprocess its photosensing processes. The circuit element 123H isprotrudingly deployed on the main circuit board 122H. The circuitelement 123H can be, for example but not limited to, resistors,capacitors, diodes, triodes, potentiometers, electric relays, oractuators.

It is worth mentioning that the encapsulation portion 11H encapsulatesand wraps up the circuit element(s) 123H therein, so that the circuitelement(s) 123H will not be directly exposed in the open space, and morespecifically, not be exposed in the environment that communicates withthe photosensitive sensor 121H. Therefore, during assembling the cameramodule, the circuit element(s) 123H will not be contaminated bypollutants, such as dusts, or influence the photosensitive sensor 121H,that is different from the arrangement of conventional camera modulethat the circuit element(s) 123H, such as resistance-capacitancecomponents, are exposed to the outside. The use of the molding methodprevents sundries and dusts from staying on the surface of the circuitelement 123H and avoids the photosensitive sensor 121H from beingcontaminated and causing dark spots and other defectives of the cameramodule.

The encapsulation portion 11H forms a window 1100H to provide aphotosensitive path for the photosensitive sensor 121H.

According to the present ninth preferred embodiment of the presentinvention, the photosensitive portion 12H includes at least oneconnecting element 124H for electrically connecting the photosensitivesensor 121H with the main circuit board 122H. Further, each of theconnecting elements 124H can be embodied to be, specifically but notlimited to, gold wire, copper wire, aluminum wire, and/or silver wire.

It is worth mentioning that each connecting element 124H is moldedinside the encapsulation portion 11H, wherein the encapsulation portion11H encloses, encapsulates and/or wraps up the connecting element(s)124H and keep them from direct exposure to the outside. Therefore,during assembling the camera module, the connecting element(s) 124H willnot suffer any collision or damage, that, at the same time, reduces theimpact due to the environmental factors, such as temperature, on theconnecting element(s) 124H and stabilizes the communication andconnection between the photosensitive sensor 121H and the main circuitboard 122H. This is being not provided in the conventional art.

It is worth mentioning that the encapsulation portion 11H encapsulatesand wraps up the circuit element(s) 123H and the connecting element(s)124H, which advantages in protecting the circuit element(s) 123H and theconnecting element(s) 124H as well as achieving a higher performancecamera module. However, those skilled in the art should understand thatthe encapsulation portion 11H shall not be limited in encapsulating andwrapping up the circuit element(s) 123H and/or the connecting element(s)124H. In other words, in other embodiments of the present invention, theencapsulation portion 11H can be directly molded on the main circuitboard 122H without protruded circuit element(s) 123H or be molded onvarious positions, such as the outer side, periphery, and etc., of thecircuit element 123H.

In addition, the photosensitive sensor 121H has a photosensitive area1211H and a non-photosensitive area 1212H, wherein thenon-photosensitive area 1212H is positioned surrounding the periphery ofthe photosensitive area 1211H. The photosensitive area 1211H is adaptedfor conducting photosensitization. The connecting element 124H isconnected to the non-photosensitive area 1212H.

According to the preferred embodiment of the present invention, theencapsulation portion 11H is extended to the non-photosensitive area1212H of the photosensitive sensor 121H, so as to overlappedly mount thephotosensitive sensor 121H on the main circuit board 122H by means ofmolding. In this manner, such as by the method of Molding on Chip (MOC),the moldable area of the encapsulation portion 11H can be extendedinwardly, such that the outer structural portion of the encapsulationportion 11H and the main circuit board 122H can be reduced that furtherreduces the size in length and width of the molded photosensitiveportion 12H and reduces the size in length and width of the cameramodule assembled thereby.

In the present ninth embodiment of the present invention, theencapsulation portion 11H is protrudingly positioned surrounding theouter portion of the photosensitive area 1211H of the photosensitivesensor 121H. Particularly, the encapsulation portion 11H integrally theconnection of the photosensitive sensor 121H and the main circuit board122H, so as to provide a good sealingness and tightness. Therefore, whenthe photosensitive unit 10H is used in assembling the camera module, thephotosensitive sensor 121H will be sealed to form a sealed inner space.

Specifically, the production of the photosensitive unit 10H may use aconventional circuit board to be the main circuit board 122H. Thephotosensitive sensor 121H is deployed on the main circuit board 122Hand electrically connected by the connecting element 124H. Then, afterthe initial assembling the main circuit board 122H and thephotosensitive sensor 121H, they are processed by Surface MountTechnology (SMT) and molded, for example, by means of the insert moldingtechnique by an injection molding machine, to form the moldedencapsulation portion 11H, or by means of the pressing moldingtechnique, which is commonly used in semiconductor packaging, to formthe molded encapsulation portion 11H. The main circuit board 122H canselectively be, for example but not limited to, rigid-flex board,ceramic substrate (without flexible board), or rigid PCB (withoutflexible board). The method to form the encapsulation portion 11H can beselected from, for example but not limited to, injection moldingtechnique and pressing molding technique. The material of theencapsulation portion 11H can be, for example but not limited to, nylon,liquid crystal polymer (LCP), or polypropylene (PP) for injectionmolding technique, or resin for pressing molding technique. Thoseskilled in the art should understand that the above availablemanufacture methods and available materials are examples to describeavailable implementations of the present invention, rather thanlimitations of the present invention.

The encapsulation portion 11H provides an installation site for theframe 50H based on the advantage of the molding technology. Theencapsulation portion 11H can be molded to achieve good flatness andevenness, so as to allow the frame 50H to be evenly and levellyinstalled.

It is worth mentioning that the inner wall of the encapsulation portion11H, defining the window 1100H, can be shaped according to the need ofthe object, such as optical filter 20H, to be installed. For example,the inner wall can be in an inclined and slope shape, so that by thetime the connecting element(s) 124H is wrapped up by the encapsulationportion 11H, the photosensitive sensor 121H can receive as much light aspossible. Those skilled in the art should understand that specific shapeof the encapsulation portion 11H shall not limit the scope of thepresent invention.

In other embodiments of the present invention, the molded circuit unitcan also be assembled into an automatic focus camera module, so as tochange the focal length of the camera module. Therefore, person skilledin the art should understand that the type of the camera module shallnot limit the scope of the present invention.

Referring to FIG. 27, the photosensitive unit and camera moduleaccording to a tenth preferred embodiment of the present invention areillustrated. The different of this tenth preferred embodiment withrespect to the other preferred embodiments, the photosensitive unit 10includes a shielding layer 1261 that covers the main circuit board 122and the encapsulation portion 11, so as to not only reinforce thestructural strength of the main circuit board 122, but also enhance anelectromagnetic immunity ability of the photosensitive unit 10.

Furthermore, the shielding layer 1261 is a metal layer that can be madein form of plate structure or net structure.

FIGS. 28A and 28B illustrate schematic comparison views of the cameramodule according to the above preferred embodiment of the presentinvention and a conventional camera module. In FIG. 28A, theconventional camera module is illustrated in the left view, while thecamera module of the present invention is illustrated in the right view.In FIG. 28B, the left view refers the manufacturing of the conventionalcircuit board, and the right view refers the manufacturing of thephotosensitive unit of the present invention.

In view of above, it is apparent that the photosensitive unit and cameramodule of the present invention have the following advantages:

1. The size in length and width of the camera module can be reduced,wherein the encapsulation portion and the circuit elements, such asresistance-capacitances, can be spatially overlapped. However, themounting frame of the conventional camera module must be installed atthe outer side of the capacitors and reserve a predetermined safetydistance therebetween. The present invention can utilize the space ofthe capacitors to fill molding material around the capacitors directly.

2. The module tilt can be prevented. The encapsulation portion wouldsubstitute conventional plastic frame and decrease accumulatedtolerance/deviance.

3. The molding formation enhances structural strength of the circuitboard that, under the same structural strength, the circuit board can bemade thinner to reduce the height of the camera module because theencapsulation portion can also provide support and increase structuralstrength.

4. In view of the altitude space, a safety space for assembling must bereserved between capacitors and the base in the conventional cameramodule. However, the molding structure of the camera module of thepresent invention does not require to reserve any safety space forassembling that can reduce the height of the camera module. A safety gapmust also be reserved between the top of the capacitors and the frame inthe conventional camera module in order to prevent interferences, butthe present invention can directly fill molding material around thecapacitors.

5. The resistance-capacitance components can be encapsulated and wrappedby molding, so as to avoid dark spots and defectives of the cameramodule caused by solder resist or dust in the resistance-capacitancearea, and to increase the product yield rate.

6. The present invention is suitable for highly efficient massproduction. Photosensitive unit of the present invention is moresuitable for mass imposition process. According to the molding formationof the photosensitive unit of the present invention, the photosensitiveunit is more suitable for imposition process. In other words, only atmost 8 conventional circuit boards can be produced in one process, butmore photosensitive units, as many as 80 to 90 pieces, can be molded toproduce in each molding process.

Referring to FIGS. 30A, 31, and 32, an array camera module and itscircuit unit according to an eleventh preferred embodiment of thepresent invention are illustrated. The array camera module can beutilized in various electronic devices to help the users to captureimages of objects or people with the array camera module. For example,the array camera module can be used to shoot image information, such asimages or videos of objects or people. Preferably, the array cameramodule can be utilized in a mobile electronic device, for example butnot limited to, smart phone, tablet PCs, and etc.

Referring to FIGS. 30A, 31, and 32, the array camera module of thepresent invention in the following description is embodied as a duallens array camera module, which is an example to illustrate disclosuresand advantages of an eleventh preferred embodiment of the presentinvention. The array camera module includes a circuit unit 100, two ormore camera lenses 500 and two or more photosensitive sensors 300.

It is worth mentioning that, in order to better disclose the presentinvention, in the present embodiment, only the array camera module withtwo camera lenses 500 is used as an example for the description.Nevertheless, in other embodiments of the present invention, thequantity of the camera lens 500 and photosensitive sensor 300 can bemore, which, for example three or more. Person skilled in the art shouldunderstand that the lens quantity shall not be a limitation of the arraycamera module of the present invention.

Furthermore, the photosensitive sensors 300 are both mounted on thecircuit unit 100 and the two camera lenses 500 are also mounted on thecircuit unit 100, wherein the two camera lenses 500 are arranged at thecorresponding positions along the photosensitive paths of the twophotosensitive sensor 300 respectively. The circuit unit 100 can becoupled to the electronic device. Those skilled in the art shouldunderstand that one the camera lens 500 and one the photosensitivesensor 300 are coordinated with each other for capturing images.Specifically, the light reflected from the shooting target, such as anobject or person passes through the camera lens 500 and is received bythe photosensitive sensor 300 for photoelectric conversion. In otherwords, the photosensitive sensor 300 is able to convert light signalinto electrical signal and the electrical signal is able to betransmitted to the electronic device through the circuit unit 100, suchthat the electronic device can generate image corresponding to theshooting target accordingly.

The circuit unit 100 includes an integral conjoined encapsulationportion 101 and a circuit board portion 102, wherein the conjoinedencapsulation portion 101 is integrally encapsulated to connect to thecircuit board portion 12, such as being molded to connect to thephotosensitive portion 12. More specifically, the conjoinedencapsulation portion 101 is moldingly connected to the circuit boardportion 102 by means of the Molding On Board (MOB) technique.

The circuit board portion 102 includes a main circuit board 1022. Theconjoined encapsulation portion 101 has two windows 10100 providedtherein, wherein the conjoined encapsulation portion 101 is positionedsurrounding the outer sides of the two photosensitive sensors 300 whilethe two windows 10100 provide two light paths for the two camera lenses500 corresponding to the two photosensitive sensors 300 respectively.The two photosensitive sensors 300 are mounted on the main circuit board1022 at the positions with respect to the two windows 10100respectively.

The conjoined encapsulation portion 101 includes at least a connectingunit 1014 and two outer surrounding units 1015, as shown in FIG. 33C,wherein the connecting unit 1014 is molded to connected between the twoouter surrounding bodies 1015 integrally, that separates the two outersurrounding units 1015 into two neighboring portions each having one ofthe two windows 10100. The two photosensitive sensors 300 arerespectively positioned at two sides of the connecting unit 1014, so asto be adapted for assembling the array camera module. It is worthmentioning that the connecting unit 1014 is a common portion for the twocamera lenses 500, so that as the camera lenses 500 are installed, eachof the camera lenses 500 occupies the corresponding portion of theconnecting unit 1014.

The circuit board portion 102 includes a connecting circuit (not shownin the figures) and at least a circuit element 1023. The connectingcircuit is preinstalled in the main circuit board 1022. The circuitelement(s) 1023 is electrically connected to the connecting circuit andthe photosensitive sensor 300, wherein the photosensitive sensors 300are arranged to process their photosensing processes. The circuitelements 1023 can be, for example but not limited to, resistors,capacitors, diodes, triodes, potentiometers, electric relays, actuators,and etc.

In the present embodiment of the present invention, each circuit element1023 is arranged corresponding to each photosensitive sensor 300 tocoordinate with the functioning of the respective photosensitive sensor300.

It is worth mentioning that the conjoined encapsulation portion 101 canencapsulates and wraps up the circuit elements 1023 therein, so that thecircuit elements 1023 will not be directly exposed in the open space.More specifically, the circuit elements 1023 will not be exposed in theenvironment that communicates with the photosensitive sensor 300. It isdifferent to the circuit elements 1023, such as resistance-capacitancecomponents, of the conventional camera module that are exposed to theoutside. Therefore, the present invention is able to prevent sundriesand dusts from staying on the circuit elements 1023 and contaminatingthe photosensitive sensor 300. In the present embodiment, the circuitelement(s) 1023 is protruded on the main circuit board 1022 as anexample for the description, whereas in other embodiments of theinvention, the circuit element 1023 could be embedded in the maincircuit board 1022 without protruding from the main circuit board 1022.Person skilled in the art should understand that the structure, type,and mounting position of the circuit element 121 shall not belimitations of the present invention. Besides, when there are circuitelement(s) 1023 provided between two photosensitive sensors 300, theconnecting unit 1014 also encapsulates and wraps up these circuitelement(s) 1023, such that there is no need to provide extrainstallation space like what is usually provided for the two lensholders in a conventional array camera module. Therefore, the size ofthe array camera module of the present invention can be made smaller.

It is worth mentioning that the conjoined encapsulation portion 101which encloses, encapsulates and/or wraps up the circuit elements 1023advantages in protecting the circuit elements 1023 and the correspondingarray camera module. However, those skilled in the art should understandthat the conjoined encapsulation portion 101 shall not be limited inencapsulating and wrapping up the circuit element 1023. In other words,in other embodiments of the present invention, the conjoinedencapsulation portion 101 can be directly molded on a circuit boardwithout protruding circuit element 1023 or be molded on variouspositions, such as the outer side, periphery, and etc., of the circuitelement 1023.

It is worth mentioning that, in the preferred embodiment of the presentinvention, the conjoined encapsulation portion 101 is protrudinglypositioned surrounding the outer sides of the photosensitive sensors300. Particularly, the conjoined encapsulation portion 101 integrallyencloses the connections of the photosensitive sensors 300 and the maincircuit board 1022 to provide a good sealingness and tightness.Therefore, when the camera lenses 500 are installed on the conjoinedencapsulation portion 101, each of the photosensitive sensors 300 isrespectively sealed therein to form a corresponding sealed inner space.

Referring to FIGS. 31 and 32, in particular, a conventional circuitboard can also be used to be the main circuit board 1022 and to bemolded when producing the circuit unit 100. For instance, in thepreferred embodiment, a circuit board processed with Surface MountTechnology (SMT) can be integrally molded, for example by means of theinsert molding technique by injection molding machine to form theconjoined encapsulation portion 101 integrally, or by means of thepressing molding technology, that is commonly used in semiconductorpackaging, to form the conjoined encapsulation portion 101. Further,each photosensitive sensor 300 is attached on the main circuit board1022 and each photosensitive sensor 300 is electrically connected to themain circuit board 1022 with connecting element(s), for instance, suchas gold wire. The main circuit board 1022 can selectively be, forexample but not limited to, rigid-flex board, ceramic substrate (withoutflexible board), or rigid PCB (without flexible board). The method toform the conjoined encapsulation portion 11 can be selected from, forexample but not limited to, injection molding technique and pressingmolding technique. The material of the conjoined encapsulation portion11 can be, for example but not limited to, nylon, liquid crystal polymer(LCP), or polypropylene (PP) for injection molding technique, or epoxyresin for pressing molding technique. Those skilled in the art shouldunderstand that the above available manufacture methods and availablematerials are examples to describe available implementations of thepresent invention, rather than limitations of the present invention.

In other embodiments of the present invention, the manufacturing of thecircuit unit 100 may alternatively be as follows. Firstly, the circuitboard 1022 is processed with Surface Mount Technology (SMT). Then thephotosensitive sensors 300 are respectively attached on the main circuitboard 1022 and electrically connected with the main circuit board 1022with, for example, gold wire bonding. Thereafter, the main circuit board1022 is integrally encapsulated by, for example, molding packaging, toform the conjoined encapsulation portion 101 by means of insert moldingtechnology, or by pressing molding technology that is commonly used insemiconductor packaging. Those skilled in the art should understand thatspecific processing order for the circuit unit 100 shall not limit thescope of the present invention. It is also worth mentioning that boththe camera lens 500 are supported on the conjoined encapsulation portion101 of the circuit unit 100. Therefore, the conjoined encapsulationportion 101 would function as the mounting frame of the conventionalcamera module to provide a supportive and holding site for the cameralenses 500, but it is assembled by a different technical process fromconventional COB technology. Independent frame of a conventional cameramodule made based on the conventional COB technique is affixed on thecircuit board by adhering process, but the conjoined encapsulationportion 101 is affixed on the main circuit board 1022 by means of theprocess of Molding On Board (MOB) that does not require any adheringprocess. The molding process of the present invention with respect tothe adhering process of the conventional camera module provides betterconnection stability and technological process controllability. Inaddition, it does not have to reserve adhering space between theconjoined encapsulation portion 101 and the main circuit board 1022 forAA adjustment, so that the adhering space for AA adjustment of theconventional camera module is saved, which allows the thickness of thearray camera module to be further reduced. Besides, by wrapping up thecircuit element 1023 with the conjoined encapsulation portion 101, thetraditional frame function thereof can be spatially overlapped with thecircuit elements 1023. It is different to the conventional camera modulethat requires to reserve safety distance around the circuit components.As a result, the height of the conjoined encapsulation portion 101,which can function as a frame, can be arranged in a smaller range, so asto further provide room for reducing the thickness of the camera module.Besides, the conjoined encapsulation portion 101 substitutes theconventional frame to avoid the tilt deviation occurred in attaching andassembling the frame and to reduce the accumulated tolerance of thearray camera module during assembling.

Furthermore, the conjoined encapsulation portion 101 includes a coveringsection 1011 and an optical filter installing section 1012. The opticalfilter installing section 1012 is molded to attach to the coveringsection 1011 integrally. The covering section 1011 is molded to attachon the main circuit board 1022 for wrapping up and covering the circuitelement(s) 1023. The optical filter installing section 1012 is adaptedfor installing two optical filters 400. The optical filter 400 can beembodied as, but not limited to, an Infrared Cut Filter (IRCF).

In other words, when the circuit board unit is utilized for assemblingthe array camera module, each optical filter 400 of the array cameramodule is mounted at the respective optical filter installing section1012 that ensures each of the optical filters 400 be respectivelyarranged along the photosensitive path of the correspondingphotosensitive sensor 300 and does not require any additional mountingframe for the optical filter 400. In other words, the conjoinedencapsulation portion 101 of the present invention also functions as aconventional frame and that, based on the advantage of the moldingtechnique, the top of the optical filter installing section 1012 can bemolded to have good flatness and evenness, so as to allow the opticalfilters 400 to be evenly installed. This feature is also superior to theconventional multi-lens camera modules.

In addition, the optical filter installing section 1012 has twoinstalling grooves 10121 provided therein. The installing grooves 10121are communicated to the windows 10100 respectively to provide adequateinstallation spaces for the optical filters 400 to be installed thereinrespectively, such that the optical filters 400 will not protrude fromthe top surfaces of the optical filter installing sections 1012. Inother words, the top of the conjoined encapsulation portion 101 has thetwo installing grooves 10121 for the optical filters 400 to respectivelybe stably installed in the conjoined encapsulation portion 101 withoutprotruding out from the top of the conjoined encapsulation portion 101.

It is worth mentioning that in the present embodiment of the presentinvention, the installing grooves 10121 are used for the installation ofthe optical filters 400, whereas in other embodiments of the presentinvention, the installing grooves 10121 can also be used for theinstallations of other elements, such as the camera lens or motor unitsof the array camera module. Those skilled in the art should understandthat the use of the installing groove 1211 shall not be a limitation ofthe present invention.

According to the present embodiment of the present invention, each ofthe photosensitive sensors 300 is connected to the main circuit board1022 by electrically connecting to at least a connecting element 301.The connecting elements 301 can be embodied to be, for example but notlimited to, gold wires, copper wires, aluminum wires, and/or silverwires. Especially, the connecting elements 301 of the photosensitivesensors 300 can be connected with the main circuit board 1022 withtraditional COB method, for example but not limited to, soldering andwelding. That is the connection between the photosensitive sensors 300and the main circuit board 1022 can also use current well-developedconnecting technology to lower the improvement cost and to takeadvantage of conventional technique and equipment, avoiding the waste ofresources. Certainly, those skilled in the art should be able tounderstand that the connection between the photosensitive sensors 300and the main circuit board 1022 can also utilize any other connectingmethods that is able to achieve the object of the present invention,which means that the present invention shall not be limited thereby.

It is worth mentioning that in the present embodiment of the presentinvention, the photosensitive sensors 300 are mounted on the uppersurface of the main circuit board 1022 and the conjoined encapsulationportion 101 is positioned surrounding the outer sides of thephotosensitive sensors 300. When manufacturing the circuit unit 100,there are various possible processing orders to be selected. Forexample, but not limited to that, in a preferred embodiment, the twophotosensitive sensors 300 can firstly be installed on the main circuitboard 1022. Then, the conjoined encapsulation portion 101 is molded toform on the main circuit board 1022 surrounding the outer sides of thephotosensitive sensors 300, wherein the circuit elements 1023 protrudedfrom the main circuit board 1022 are enclosed, encapsulated and/orwrapped up in the conjoined encapsulation portion 101. In an alternativemode of the preferred embodiment of the present invention, the conjoinedencapsulation portion 101 can firstly be molded to form on the maincircuit board 1022 to cover and enclose, encapsulate, and/or wrap up thecircuit elements 1023 therein. Then, the photosensitive sensors 300 areinstalled on the main circuit board 1022 and positioned in the innersides of the conjoined encapsulation portion 101.

In this embodiment of the present invention, an array camera modulehaving two camera lenses 500 is utilized as an example to illustrate away to implement the array camera module. In which, taking advantage ofthe molding technique, a consistent installation environment is providedfor the two optical filters 400 and the two camera lenses 500, so thatthe array camera module can achieve a better optical performance. Inother embodiments of the present invention, the array camera module canalso comprise more than two camera modules and, correspondingly andrespectively, the circuit unit 100 forms more than two windows 10100.Therefore, those skilled in the art should understand that the quantityof the camera lens 500 shall not be a limitation of the presentinvention.

Referring to FIG. 34, in a preferred embodiment of the presentinvention, each camera lens 500 comprises an optical lens. Each opticallens can be directly mounted to the conjoined encapsulation portion 101of the circuit unit 100. In other words, in this embodiment, the cameralens 500 can be a fixed focus lens unit, which means that the focallength of the camera lens 500 cannot be freely adjusted. Hence, personskilled in the art should understand that the camera lens 500 disclosedin the present invention can be directly mounted to the conjoinedencapsulation portion 101, which also includes the camera lens 500 beingengaged with the conjoined encapsulation portion 101 through a shell. Inanother preferred embodiment of the present invention, referring to FIG.30A, the array camera module comprises two or more motor units 600,wherein the motor units 600 are mounted on the conjoined encapsulationportion 101. Each of the camera lenses 500 is connected to and driven bythe respective motor unit 600, such that each of the motor units 600 candrive the respective camera lens 500 to move along the photosensitivepath of the respective photosensitive sensor 300 for adjusting the focallength of the respective camera lens 500. In other words, in thisembodiment, the camera lens 500 is a zoom lens unit, which means thefocal length of the camera lens 500 can be adjusted. For example, whenthe user is taking picture with the array camera module with two cameralenses 500, he or she can adjust the result of the photography byadjusting focal length(s) of the camera lens(es) 500.

It is worth mentioning that, according to this preferred embodiment ofthe present invention, the conjoined encapsulation portion 101 can beused to support the installation of each of the optical filters 400, thecamera lenses 500, or the motors units 600. The conjoined encapsulationportion has the functions of a conventional frame. Taking advantage ofthe molding technology, the flatness, smoothness, evenness, andconsistency of the conjoined encapsulation portion can also becontrolled by the mold, that provides a flat, smooth, even andconsistent installation environment for each of the optical filters 400,the camera lenses 500, and the motor units 600 of the array cameramodule. Therefore, it is more likely to ensure the consistency of theoptical axises of the camera lenses, which is not likely to be achievedby the conventional array camera modules.

It is also worth mentioning that the conjoined encapsulation portion101, which is integrally and conjoinedly molded to form on the maincircuit board 1022, reinforces the structural strength of the maincircuit board, so that with respect to the array camera module made withthe conventional COB process, the main circuit board 1022 of the arraycamera module of the present invention can achieve a thinner thicknesswhile satisfying the strength requirements for the camera lenses andmotors unit. On the other hand, the conjoined encapsulation portion 101can reduce the distance between the camera lenses 500, so as to reducethe lateral size in length and width of the array camera module.

Furthermore, according to the present preferred embodiment of thepresent invention, the molded photosensitive unit 10 includes two motorconnecting structures 103 for connecting with two motor units 600 of thearray camera module. Each of the motor units 600 has at least one motorterminal 601. The motor connecting structure 103 includes at least oneconnecting element such as connecting element 1031, wherein theconnecting elements 1031 are used to connect the motor units 600 and themain circuit board 1022. Each of the connecting elements 1031 iselectrically connected to the main circuit board 1022. Further, each ofthe connecting elements 1031 is electrically connected to the connectingcircuit of the main circuit board 1022. The connecting elements 1031 aredeployed in the conjoined encapsulation portion 101 and extended to thetop of the conjoined encapsulation portion 101. Each of the connectingelements 1031 has a motor coupling end 10311 exposed on top of theconjoined encapsulation portion 101 for being electrically connected tothe motor terminal 601 of the respective motor unit 600. It is worthmentioning that the connecting element 1031 can be deployed by embeddingduring the molding formation of the conjoined encapsulation portion 101.In the conventional way of connection, component like driving motor isconnected to the circuit board through independent lead wires, whichinvolve relatively complicated manufacture technique. However, themolding method of the present invention that embeds the connectingelements 1031 in the molding process can not only substitute theconventional technological process, such as motor soldering, but alsomake the circuit connection being more stable. Particularly, in apreferred embodiment of the present invention, each of the connectingelements 1031 is a conductor being embedded inside of the conjoinedencapsulation portion 101. In another embodiment, each of the connectingelements 1031 can be embedded in the surface portion of the conjoinedencapsulation portion 101. The motor terminal 601 can be connected tothe respective motor coupling end 10311 with anisotropic conductive filmor by welding and soldering.

It is worth mentioning that the embedding positions of the connectingelements 1031 and the revealing positions of the motor coupling ends10311 of the connecting elements 1031 on the conjoined encapsulationportion 101 may be disposed based on the practical needs. For instance,in a preferred embodiment of the present invention, the motor couplingends 10311 of the connecting elements 1031 can be deployed on theperiphery of the conjoined encapsulation portion 101 which are the topsurface of the conjoined encapsulation portion 101 and the top surfaceof the optical filter installing section 1012. However, in anotherembodiment of the present invention, the motor coupling ends 10311 canbe deployed on the inner portion of the conjoined encapsulation portion101 which is the bottom sides of the installing grooves 10121 of theconjoined encapsulation portion 101. Therefore, there may be variousinstallation sites provided for the motor units 600. In other words,when the motor units 600 have to be installed on top of the conjoinedencapsulation portion, the motor coupling ends 10311 are provided on thetop surface of the outer portion of the conjoined encapsulation portion.When the motor units 600 have to be installed in the installing grooves10121 respectively, the motor coupling ends 10311 are provided on theinner portion of the conjoined encapsulation portion 101, which is thebottoms of the installing grooves 10121.

In other words, to produce the circuit unit 100, the photosensitivesensors 300 are firstly adhered to the main circuit board 1022. Then,the conjoined encapsulation portion 101 is molded to form on the maincircuit board 1022 by means of the MOB technology. At the same time, theconnecting elements 1031 can be embedded in the conjoined encapsulationportion 101 during the molding process and electrically connected to themain circuit board 1022. The motor coupling ends 10311 of the connectingelements 1031 are revealed on the top of the conjoined encapsulationportion for connecting with the motor terminals 601 of the motor unit600 respectively. For example, when the molded photosensitive unit 10 isto be installed on the array camera module, each motor terminal 41 ofthe motor unit 600 is connected to the motor coupling end 10311 of therespective connecting element 1031 by welding and soldering so as toelectrically connect the motor unit 600 with the main circuit board1022. An independent lead wire is required to be deployed to connect themotor unit 600 and the main circuit board 1022 to allow the length ofthe motor terminal 601 of the motor unit 600 to be shortened.

Referring to FIG. 33A, an equivalent embodiment of the motor connectingstructure of the above preferred embodiment of the present invention isillustrated. Each of the motor connecting structures 103 includes aterminal slot 1033. The terminal slot 1033 is for accommodating themotor terminal 601 of the respective motor unit 600 of the array cameramodule. The terminal slot 1033 is deployed on top of the conjoinedencapsulation portion 101. Each of the motor connecting structure 103includes at least one connecting element such as lead wire 1034, whereinthe connecting elements 1034 are arranged to connect the motor units 600and the main circuit board 1022. Each of connecting elements 1034 isdeployed in the conjoined encapsulation portion 101 and upwardlyextended to the bottom wall of the terminal slot 1033 of the conjoinedencapsulation portion 101. Each of the connecting elements 1034 includesa motor coupling end 10341 exposed on the bottom wall of the terminalslot 1033 of the conjoined encapsulation portion 101 for beingelectrically connected to the motor terminal 601 of the respective motorunit 600. Particularly, in an implementation, the motor coupling end10341 can be embodied to be a pad. The connecting element 1034 can beembodied as a conductor to be embedded inside the conjoinedencapsulation portion 101.

In other words, when producing the circuit unit 100, the photosensitivesensors 300 are firstly adhered on the main circuit board 122, and thenthe conjoined encapsulation portion 101 is molded on the main circuitboard 122, for example, by the MOB technology, with the photosensitivesensors 300 remain exposed to outside through windows formed in theconjoined capsulation portion 101. At the same time, the terminal slot1033 with predetermined length is preset and the connecting element 1034is arranged by being embedded during the molding, which electricallyconnects the connecting element 1034 with the main circuit board 122 andreveals the motor coupling end 10341 of the connecting element 1034 onthe bottom wall of the terminal slot 1033 of the conjoined encapsulationportion 101 for connecting with the motor terminal 41 of the motor unit600. For example, when the molded photosensitive unit 10 is installed onthe camera module, each motor terminal 601 of the motor unit 600 isinserted into the terminal slot 1033 and connected to the motor couplingend 10341 of the connecting element 1034 by welding and soldering so asto electrically connect the motor unit 600 with the main circuit board122. An independent wire is required to be deployed to connect the motorunit 600 and the main circuit board 122 to ensure stable connection forthe motor terminal 601 of the motor unit 600 and to keep unnecessarycontact from the motor terminal 601. Particularly, the connectingelement 1034 can be embodied as a conductor to be embedded inside of theconjoined encapsulation portion 101.

Referring to FIG. 33B, another equivalent embodiment of the motorconnecting structure of the above preferred embodiment of the presentinvention is illustrated, wherein each of the motor connectingstructures 103 has a terminal slot 1035. The terminal slot 1035 is foraccommodating the motor terminal 601 of the motor unit 600 of the arraycamera module. The terminal slot 1035 is deployed on the conjoinedencapsulation portion 101. The motor connecting structure 103 includesat least one circuit junction 1032, wherein the circuit junction 1032 ispreformed on the main circuit board 122 and electrically connected tothe connecting circuit in the main circuit board 122. Furthermore, eachof the terminal slots 1035 is extended from the top of the conjoinedencapsulation portion 101 to the main circuit board 122 to present thecircuit junction 1032. In a preferred embodiment, the motor terminal 601is adapted to insert into the terminal slot 1035 and can be connectedwith the circuit junction 1032 by soldering and welding.

In other words, when producing the molded photosensitive unit 10, eachcircuit junction 1032 is preformed on the main circuit board 122. Then,the photosensitive sensors 121 are attached thereon. Then, the conjoinedencapsulation portion 101 is molded on the main circuit board 122 bymeans of MOB technology. At the same time, the terminal slot 1035 withpredetermined length is preset and the circuit junction 1032 is revealedthrough the terminal slot 1035 for connecting with the motor terminal601 of the respective motor unit 600. For example, when the moldedphotosensitive unit 10 is to be assembled on the camera module, eachmotor terminal 601 of the motor unit 600 is inserted into the respectiveterminal slot 1035 and connected to the respective circuit junction 1032of the main circuit board 122 by welding and soldering so as toelectrically connect the respective motor unit 600 with the main circuitboard 122 and to ensure stable connection for the motor terminal 601 ofthe respective motor unit 600 and to keep unnecessary contact from themotor terminal 601.

Referring to FIG. 33C, another equivalent embodiment of the motorconnecting structure liner the above preferred embodiment of the presentinvention is illustrated. The motor connecting structure 103 includes atleast a carving line 1036. The carving line 1036 is adapted toelectrically connect the connecting elements, the photosensitive sensors300, and the motor units on the main circuit board 122. For example, butnot limited to that the carving line 1036 can be formed by means ofLaser Direct Structuring (LDS) during the forming of the conjoinedencapsulation portion 101. In the conventional way of connection,components like driving motor are connected to the circuit board throughindependent lead wires, which involve relatively complicated manufacturetechnique. However, the method of the present invention that arrangesthe carving line(s) 1036 in the molding process can not only substitutethe conventional technological processes, like motor soldering, but alsomake the circuit connection being more stable. More specifically,forming process of the carving line(s) 1036 can be carving on theconjoined encapsulation portion 101 and then laying the circuit byelectroplating in the carved grooves.

It is worth mentioning that in the eleventh embodiment and itsillustrating figures, the motor connecting structure 103 with theconnecting elements 1031 is embodied to illustrate that the circuit unitcan be electrically connected to the motor unit 600. However, in otherembodiments of the present invention, the circuit unit 100 can also beconnected to other motor connecting structure 103, for example but notlimited to, the terminal slot 1033 and the connecting element 1034, theterminal slot 1035 and the circuit junction 1032, the carving line 1036,and etc., so as to connect to the motor unit 600. Those skilled in theart should understand that the connection way with the motor connectingstructure 103 shall not be a limitation of the present invention.

In the eleventh embodiment of the present invention, how the motor units600 of the array camera module are connected with the conjoinedencapsulation portion 101 is described as an example to use the motorconnecting structure 103 for the connection, which includes, forexample, using the connecting element 1031 for the connection. However,in other embodiments of the present invention, the connecting method forthe motor units 600 may also combine with the connecting methodsreferred in FIGS. 35A, 35B, and 35C, such as utilizing the terminal slot1033 and the lead wire 1034, the terminal slot 1035 and the circuitjunction 1032, and etc. In another embodiments of the present invention,referring to FIG. 30B, the motor units 600 may be connected with thecircuit unit 100 with a traditional way, such as welding and soldering.Those skilled in the art should understand that specific way ofconnecting the motor 600 and the circuit unit 100 shall not limit thescope of the present invention.

Referring to FIG. 35, the array camera module and its circuit unit 100according to a twelfth preferred embodiment of the present invention areillustrated. The different between this twelfth preferred embodimentswith the above preferred embodiments is that the circuit unit 100comprises a main circuit board 1022A. The main circuit board 1022A hastwo inner grooves 10221A provided therein. The photosensitive sensors300 are arranged to be connected in the two inner grooves 10221Arespectively. The different of the circuit unit 100 between this twelfthpreferred embodiment with the above embodiments is that, thephotosensitive sensors 300 are completely installed and accommodated inthe inner grooves 10221A respectively, such that, preferably, thephotosensitive sensors 300 will not significantly protrude from the topsurface of the main circuit board 1022A. Accordingly, the relativeheight of the photosensitive sensor 300 with respect to the conjoinedencapsulation portion 101 is lowered, so as to reduce the height limitof the photosensitive sensors 300 relative to the conjoinedencapsulation portion 101 and provide potential room for furtherreduction of the height thereof.

In addition, the photosensitive sensors 300 are connected to the maincircuit board 1022 by electrically connecting with the connectingelements 301. The connecting element (lead wire) can be embodied to be,for example but not limited to, gold wire, copper wire, aluminum wire,and/or silver wire. In other words, the photosensitive sensors 300 andthe connecting elements 301 are all respectively positioned inside ofthe inner grooves 10221A of the main circuit board 1022A. According tothe preferred embodiment, when producing the circuit unit 100, the innergrooves 10221A have to be formed in the main circuit board 1022A first.In other words, the inner grooves 10221A can also be opened in aconventional circuit board to be adapted for accommodating andinstalling the photosensitive sensors 300.

Referring to FIG. 36, the array camera module and its circuit unitsaccording to a thirteenth preferred embodiment of the present inventionare illustrated.

The different between this thirteenth preferred embodiment and the abovepreferred embodiments include that the circuit unit 100 comprises a maincircuit board 1022B, which has two passages 10222B penetratedtherethrough, wherein the two photosensitive sensors 300 are installedat the lower portions of the two passages 10222B respectively. Each ofthe passages 10222B is extended between the top side and the bottom sideof the main circuit board 1022B, so that when the photosensitive sensors300 having their photosensitive areas facing upwards are installed atthe main circuit board 1022B from the bottom side of the main circuitboard 1022B, the photosensitive areas of the photosensitive sensors 300are adapted to receive the light entered from the camera lenses 500through the passages 10222B respectively.

Further, the main circuit board has two outer grooves 10223B, providedin the bottom side thereof, communicating with the passages 10222Brespectively, so as to provide the photosensitive sensors 300 twoinstallation sites therefor. Especially, when the photosensitive sensors300 are mounted in the outer grooves 10223B respectively, the outersurfaces of the photosensitive sensors 300 and the surface of the maincircuit board 1022B are evenly on the same plane, so as to ensure anevenness and smoothness top surface of the circuit unit 100.

In the present thirteenth embodiment of the present invention, thepassages 10222B are each in step shape so as to adapt for theinstallation of the photosensitive sensors 300 respectively, so as toprovide a stable installation site for each of the photosensitive sensor300 and to have the photosensitive area thereof to be revealed to aninternal space.

It is worth mentioning that the present embodiment of the presentinvention provides a Flip Chip (FC) style that is different fromconventional chip installation methods. That is, the photosensitivesensors 300 are mounted on the main circuit board 1022B from the backside of the main circuit board 1022B, which differs from what wasillustrated in the above embodiments that the photosensitive sensor 300is installed on the front side of the main circuit board 1022B, whichmeans that the photosensitive sensor 300 is installed from the top ofthe main circuit board 1022B while its photosensitive area facingupwards. Such structure and installation style allows the photosensitivesensors 300 and the conjoined encapsulation portion 101 to be relativelyindependent, wherein the installation of the photosensitive sensor 300will not be affected by the conjoined encapsulation portion 101 and theinfluence by the mold forming of the conjoined encapsulation portion 101on the photosensitive sensor 300 will be reduced as well. Moreover, thephotosensitive sensors 300 are embedded in the outer side of the maincircuit board 1022B without protruding from the inner side of the maincircuit board 1022B, such that more space is saved in the inner space ofthe inner side of the main circuit board 1022B. Therefore, the height ofthe conjoined encapsulation portion 101 will not be restricted by theheight of the photosensitive sensors 300, so as to allow the conjoinedencapsulation portion 101 to achieve a thinner thickness.

It is worth mentioning that in other embodiments of the presentinvention, each of the optical filters 400 is installed at a recessprovided at the respective surrounding unit 1015 of the conjoinedencapsulation portion 101 and positioned above the respective passage10222B. In other words, the optical filters 400 do not have to beinstalled in the conjoined encapsulation portion 101. Therefore, theback focal length of the array camera module can be decreased and theheight of the array camera module can be reduced as well. Particularly,the optical filters 400 can each be embodied as an Infrared-Cut Filter(IRCF).

Referring to FIG. 37, the array camera module and its circuit unit 100according to a fourteenth preferred embodiment of the present inventionare illustrated.

The circuit unit 100 further comprises a reinforced layer 1025Coverlappedly attached to the bottom of the main circuit board 1022, soas to reinforce the structural strength of the main circuit board 1022.In other words, the reinforced layer 1025C is adhered on the bottomportion of the main circuit board 1022 to overlap with the bottom areawhere the conjoined encapsulation portion 101 and the photosensitivesensor are located, so that the main circuit board 1022 can stably andreliably support the conjoined encapsulation portion 101 and thephotosensitive sensor 300.

Furthermore, the reinforced layer 1025C is a metal plate attaching onthe bottom of the main circuit board 1022 to increase the structuralstrength of the main circuit board 1022 as well as to enhance the heatdissipation of the molded photosensitive unit by effectively dissipatingheat generated by the photosensitive sensors 300.

It is worth mentioning that the main circuit board 1022 can be a FlexPrint Circuit (FPC). By enhancing the rigidity of the FPC with thereinforced layer 1025C, the FPC that has excellent flexural property canstill qualify for the load bearing requirement for the moldedphotosensitive unit. In other words, there are more available optionsfor the main circuit board 1022, such as PCB (Printed Circuit Board),FPC (Flexible Printed Circuit), and RG (Rigid Flex). By using thereinforced layer 1025B to enhance the structural strength and heatdissipation of the main circuit board 1022, the thickness of the maincircuit board 1022 can also be reduced, which helps to further reducethe height of the molded photosensitive unit as well. Hence, the heightof the camera module assembled thereby can be reduced.

Referring to FIG. 38, the array camera module with its circuit unit 100according to a fifteenth preferred embodiment of the present inventionis illustrated.

The different between this fifteenth preferred embodiment and the abovepreferred embodiments is that, the main circuit board 1022D has at leastone reinforced hole 10224D indented therein and the conjoinedencapsulation portion 101 is extended into the reinforced hole(s)10224D, so as to enhance the structural strength of the main circuitboard 1022D.

The positions of the reinforced holes 10224D can be determined based onpractical needs. Also, based on the need of the structural strength ofthe circuit board, the reinforced holes 10224D can be, for example,arranged in a symmetrical construction. The arrangement of thereinforced holes 10224D makes the structural strength of the maincircuit board 1022D being stronger, which allows the thickness of themain circuit board 1022D and the thickness of the camera moduleassembled thereof to be reduced. Besides, heat dissipation performanceof the molded photosensitive unit is enhanced as well.

It is worth mentioning that the reinforced holes 10224D are each inindented groove form, so that when manufacturing the moldedphotosensitive unit, the molding material of the conjoined encapsulationportion 101 will not leak off from the reinforced holes 10224D.

Referring to FIG. 39, the array camera module with its circuit unit 100according to a sixteenth preferred embodiment of the present inventionis illustrated.

The different between this sixteenth preferred embodiment and the abovepreferred embodiments is that, the main circuit board 1022E has at leastone reinforced hole 10224E formed therethrough and the conjoinedencapsulation portion 101 is extended to fill in the reinforced hole10224E, so as to enhance the structural strength of the main circuitboard 1022E.

The positions of the reinforced holes 10224E can be determined based onpractical needs. Also, based on the need of the structural strength ofthe circuit board, the reinforced holes 10224E can be, for example,arranged in a symmetrical construction.

The arrangement of the reinforced holes 10224E make the structuralstrength of the main circuit board 1022E being stronger, which allowsthe thickness of the main circuit board 1022E and the thickness of thecamera module assembled thereof to be reduced. Besides, heat dissipationperformance of the molded photosensitive unit is enhanced as well.

It is worth mentioning that each of the reinforced holes 10224E is athrough hole, which, in other words, penetrates through the main circuitboard 1022E, so as to communicate the top side and the bottom side ofthe main circuit board 1022E. Therefore, during the production of themolded photosensitive unit, the molding material of the conjoinedencapsulation portion 101 can fully fill and be bonded with the maincircuit board 1022E to form a more solid structure of combined compositematerial. Besides, in comparison with the groove shaped reinforced hole10224D of the above fifteenth preferred embodiment, the through holeform reinforced hole 10224E of this sixteenth preferred embodiment iseasier to be made and processed.

Referring to FIGS. 40 and 41, the array camera module with its circuitunit according to a seventeenth preferred embodiment of the presentinvention is illustrated.

The different between this seventeenth preferred embodiment with theabove preferred embodiments is that, the conjoined encapsulation portion101F comprises a covering section 1011F, an optical filter installingsection 1012F, and a camera lens installing section 1013F. The opticalfilter installing section 1012F and the camera lens installing section1013F are molded integrally and upwardly to extend from the coveringsection 1011F orderly. The covering section 1011F is molded to attach onthe main circuit board 1022 for encapsulating, wrapping up and coveringthe circuit elements 1023 and the connecting elements 301. The opticalfilter installing section 1012F is integrally extended upwardly from thecovering section 1011F for mounting the optical filters 400. In otherwords, when the molded photosensitive unit is utilized for assemblingthe array camera module, the optical filters 400 of the array cameramodule are mounted at the optical filter installing sections 1012F,while the optical filters 400 are deployed along the photosensitivepaths of the photosensitive sensors 300 respectively without the need ofany additional mounting frame for installation of the optical filters400. In other words, the conjoined encapsulation portion 101F accordingto the preferred embodiment also functions as the conventional mountingframe. Taking advantage of the molding technique, the top portion of theoptical filter installing section 1012F can be molded to have goodflatness, smoothness and evenness, so as to allow the optical filters400 to be evenly installed, wherein such feature is superior to theconventional camera modules.

The camera lens installing section 1013F is molded to extend upwardlyfrom the optical filter installing section 1012F for mounting the cameralenses 500 therein. In other words, when the molded photosensitive unitis utilized in assembling the array camera module, the camera lenses 500are mounted at the inner side of the camera lens installing section 11F3of the conjoined encapsulation portion 101F, which provides a stablemounting position for the camera lenses 500.

Furthermore, the optical filter installing section 1012F has twoinstalling grooves 10121F formed therein. The installing grooves 10121Fare aligned and communicated with the two corresponding windows 10100Frespectively to provide adequate installation spaces for the two opticalfilters 400 respectively, such that the optical filters 400 can bestably mounted. The camera lens installing section 1013F has two lensinstalling grooves 10131F formed therein. The two lens installinggrooves 10131F are aligned and communicated with the two correspondinginstalling grooves 10121F and the two corresponding windows 10100F, soas to respectively provide adequate installation spaces for the twocamera lenses 500 respectively.

In other words, the optical filter installing section 1012F and thecamera lens installing section 1013F are integrally extended upwardly toform a step structure internally, which respectively provide supportingand affixing positions to the optical filters 400 and the camera lenses500, without the need of any extra parts for the installation of theoptical filters 400 and the camera lenses 500.

The camera lens installing section 1013F has two camera lens inner walls10132F defining the two lens installing grooves 10131F respectively.Each of the camera lens inner wall 10132F is in round shape, which isadapted for providing installation chamber for the respective cameralens 500. It is worth mentioning that the surface of each camera lensinner wall 10132F of the camera lens installing section 10132F ispreferred to be smooth, which is adapted for installing the threadlesscamera lens 500 to form a fixed focus module. Particularly, the cameralens 500 can be secured in the camera lens installing section 1013F byadhering.

Referring to FIG. 42, an array camera module with its circuit unitaccording to an eighteenth preferred embodiment of the present inventionis illustrated. The different between this eighteenth preferredembodiment and the above preferred embodiments is that, the circuit unit100 includes a shielding layer 1026 arranged to cover the main circuitboard 1022 and the conjoined encapsulation portion 101, so as to notonly reinforce the structural strength of the main circuit board 1022,but also enhance the electromagnetic immunity ability of the circuitunit 100.

Referring to FIG. 43, the array camera module with its circuit unitaccording to a nineteenth preferred embodiment of the present inventionis illustrated. The different between this nineteenth preferredembodiment with the above embodiments is that, the camera moduleincludes at least a frame 70 arranged for installing the optical filters400, the camera lenses 500, or the motor units 600. According to thepresent nineteenth embodiment of the present invention, the frame 700 ismounted on the conjoined encapsulation portion 101. Two optical filters400 are mounted on the frame 700. The motor units 600 are also mountedon the frame 700. Specific shape and structure of the frame 700 can bearranged based on the needs, wherein, for example, the frame 700 can beconstructed as a platform, having two windows provided therein, adaptedto install the optical filters thereon while enabling light passingthrough the windows to reach the photosensitive sensors 300respectively. The frame 700 can be a conjoined frame, which, in otherwords, can have a plurality of the optical filters 400 installedthereon. It can also be a single frame, which can have only one opticalfilter 400 installed thereon. In the present nineteenth embodiment ofthe present invention, the frame 70 is preferably a conjoined frameoverlappedly attached on the encapsulation portion 1014 by for exampleadhering, as shown in FIG. 43. Those skilled in the art shouldunderstand that specific shape of the frame 700 shall not confine thepresent invention.

Referring to FIGS. 44 to 48A, the array camera module with itsphotosensitive unit according to a twentieth preferred embodiment of thepresent invention is illustrated. The photosensitive unit 200 is adaptedfor assembling and producing the array camera module. The photosensitiveunit 200 includes a conjoined encapsulation portion 201 and aphotosensitive portion 202.

The conjoined encapsulation portion 201 is integrally encapsulated toconnect to the photosensitive portion 202, such as being molded toconnect to the photosensitive portion 202.

The photosensitive portion 202 includes a main circuit board 2022 andtwo photosensitive sensors 2021, wherein the photosensitive sensors 2021are respectively disposed on the main circuit board 2022. According tothe present twentieth embodiment of the present invention, thephotosensitive sensors 2021 are molded to connect to the main circuitboard 2022. More specifically, the conjoined encapsulation portion 201is moldingly coupled to the photosensitive portion 202 by means of, forexample, the method of Molding on Chip (MOC).

The conjoined encapsulation portion 201 forms two windows 20100, whereinthe conjoined encapsulation portion 201 is positioned surrounding theouter sides of the two photosensitive sensors 2021 respectively andprovides light paths for the two camera lenses 500 and the twophotosensitive sensors 2021 respectively through the windows 20100. Thephotosensitive sensors 2021 are disposed at the position alignedcorresponding to the two windows 20100 respectively on the main circuitboard 2022.

The conjoined encapsulation portion 201 includes a connecting unit 2014and two ring shaped outer surrounding units 2015. The connecting unit2014 is molded to connect between the two outer surrounding units 2015integrally to form an integral body. The connecting unit 2014 alsoseparates the two ring shaped outer surrounding units 2015 into twoneighboring portions, wherein two windows 20100 are defined in the twosurrounding units 2015 respectively. Two photosensitive sensors 2021 arerespectively positioned at two sides of the connecting unit 2014, thatis aligned with the windows 20100 of the two surrounding units 2015respectively, so as to be adapted for assembling the array cameramodule. It is worth mentioning that the connecting unit 2014 is a commonsegment for the two camera lenses 500, which means that as the cameralenses 500 are installed, each of the camera lenses 500 occupies and issupported by a corresponding portion of the connecting unit 2014, asshown in FIG. 48A.

According to the present twentieth embodiment of the present invention,the photosensitive portion 202 includes a connecting circuit (not shownin the figures) and at least two circuit elements 2023. The connectingcircuit is preinstalled in the main circuit board 2022. The circuitelements 2023 are electrically connected to the connecting circuit andthe photosensitive sensors 2021 respectively, so that the twophotosensitive sensors 2021 would process their photosensing processesaccordingly. The circuit elements 2023 are protrudingly deployed on themain circuit board 2022. The circuit elements 2023 can be, for examplebut not limited to, resistors, capacitors, diodes, triodes,potentiometers, electric relays, or actuators.

It is worth mentioning that the conjoined encapsulation portion 201 ismolded to encapsulate and wrap up the circuit elements 2023 therein, sothat the circuit elements 2023 will not be directly exposed in the openspace, and more specifically, not be exposed in the environment thatcommunicates with the photosensitive sensors 2021. Therefore, during theassembling of the array camera module, the circuit elements 2023 willnot be contaminated by pollutants, such as dusts, or influence thephotosensitive sensor 2021, which is different from the arrangement ofthe conventional camera module that the circuit elements 2023, such asresistance-capacitance components, are exposed to the outside. The useof the molding method in the present invention prevents sundries anddusts from staying on the surface of the circuit elements 2023 andavoids the photosensitive sensors 2021 from being contaminated andcausing dark spots and other defectives of the array camera module.

It is worth mentioning that the present twentieth embodiment the circuitelements 2023 protruded on the main circuit board 2022 is used as anexample for the description, whereas in other embodiments of theinvention, the circuit elements 2023 can be embedded in the main circuitboard 2022 without protruding from the main circuit board 2022. Personskilled in the art should understand that the structures, types, andmounting positions of the circuit element 2023 shall not limit the scopeof the present invention.

According to the present twentieth preferred embodiment of the presentinvention, the photosensitive portion 202 includes a plurality ofconnecting elements 2024 for respectively electrically connecting thephotosensitive sensors 2021 with the main circuit board 2022. Further,each of the connecting elements (lead wires) 2024 can be embodied to be,specifically but not limited to, gold wire, copper wire, aluminum wire,and/or silver wire.

It is worth mentioning that the connecting elements 2024 are preferredto be molded inside the conjoined encapsulation portion 201, so that theconjoined encapsulation portion 201 substantially enclose, encapsulateand/or wrap up the connecting elements 2024 and keep them from directexposure to the outside. Therefore, during assembling the array cameramodule, the connecting elements 2024 will not suffer any collision ordamage, which, at the same time, reduces the impact due to theenvironmental factors, such as temperature, on the connecting elements2024 and stabilizes the communication and connection between thephotosensitive sensors 2021 and the main circuit board 2022. This is notbeing provide in the traditional art.

From the bottom of each of the windows 20100 of the conjoinedencapsulation portion 201, the size of the window 20100 is graduallyenlarged to the top thereof to form a slope shape in order to adapt tothe shape of the connecting elements 2024 and to facilitate the moldunloading and releasing in the molding process.

It is worth mentioning that the conjoined encapsulation portion 201which substantially enclose, encapsulate and/or wrap up the circuitelements 2023 and the connecting elements 2024 advantages in protectingthe circuit elements 2023 and the connecting elements 2024 as well as inachieving a higher performance array camera module. However, personskilled in the art should understand that the conjoined encapsulationportion 201 shall not be limited in wrapping up the circuit elements2023 and/or the connecting elements 2024. In other words, in otherembodiments of the present invention, the conjoined encapsulationportion 201 can be directly molded on the main circuit board 2022without protruded circuit elements 2023 or be molded on variouspositions, such as the outer side, periphery, etc., of the circuitelements.

In addition, the photosensitive sensor 2021 has a photosensitive area20211 and a non-photosensitive area 20212, wherein thenon-photosensitive area 20212 is positioned surrounding the periphery ofthe photosensitive area 20211. The photosensitive area 20211 is adaptedfor conducting photosensitization. The connecting element 2024 isconnected to the non-photosensitive area 20212.

According to the twentieth preferred embodiment of the presentinvention, the conjoined encapsulation portion 201 is extended on thenon-photosensitive areas 20212 of the two photosensitive sensors 2021,so as to overlappedly mount the photosensitive sensors 2021 on the maincircuit board 2022 side by side by molding. In this manner, such as bymeans of the method of Molding On Chip (MOC), the moldable area of theconjoined encapsulation portion 201 can be extended inwardly, such thatthe structural portion of the outer portion of the conjoinedencapsulation portion 201 and the main circuit board 2022 can bereduced, which further reduces the size in length and width of themolded photosensitive portion 202 and reduces the size in length andwidth of the array camera module assembled thereby.

In the present twentieth embodiment of the present invention, theconjoined encapsulation portion 201 is protrudingly positionedsurrounding the outside of the photosensitive areas 20211 of the twophotosensitive sensors 2021. Particularly, the conjoined encapsulationportion 201 integrally encapsulates and encloses the connection ofphotosensitive sensors 2021 and the main circuit board 2022, so as toprovide a good sealingness and tightness. Therefore, when thephotosensitive unit 200 is used in assembling the array camera module,photosensitive sensors 2021 will each be respectively sealed inside toform a sealed inner space.

Specifically, a conventional circuit board may be used to produce themain circuit board 2022 of the photosensitive unit 200. Twophotosensitive sensors 2021 are installed on the main circuit board 2022and electrically connected with the connecting elements 2024. Then,after the initial assembling of the main circuit board 2022 and thephotosensitive sensor 2021, they are processed by Surface MountTechnology (SMT) and molded, for example by means of the insert moldingtechnique by an injection molding machine, to form the conjoinedencapsulation portion 201, or by means of the pressing moldingtechnique, which is commonly used in semiconductor packaging, to formthe conjoined encapsulation portion 201. The main circuit board 2022 canselectively be, for example but not limited to, rigid-flex board,ceramic substrate (without flexible board), or rigid PCB (withoutflexible board). The method to form the conjoined encapsulation portion201 can be selected from, for example but not limited to, injectionmolding technique and pressing molding technique. The material of theconjoined encapsulation portion 201 can be, for example but not limitedto, nylon, liquid crystal polymer (LCP), or polypropylene (PP) forinjection molding technique, or resin for pressing molding technique.Those skilled in the art should understand that the above availablemanufacture methods and available materials are examples to describeavailable implementations of the present invention, rather thanlimitations of the present invention.

Furthermore, the conjoined encapsulation portion 201 includes a coveringsection 2011 and an optical filter installing section 2012. The opticalfilter installing section 2012 is molded to connect with the coveringsection 2011 integrally to form an integral body. The covering section2011 is molded to connect on the main circuit board 2022 forencapsulating, wrapping up and covering the circuit elements 2023 andthe connecting elements 2024. The optical filter installing section 2012is adapted for mounting the optical filters 400. In other words, whenthe photosensitive unit 200 is utilized for assembling the array cameramodule, the optical filters 400 of the array camera module are mountedat the optical filter installing section 2012 and deployed along thephotosensitive paths of the photosensitive sensors 2021 respectivelywithout the need of any additional mounting frame for installation ofthe optical filters 400. In other words, the conjoined encapsulationportion 201 itself can function as a conventional frame. Takingadvantage of the molding technique, the top of the optical filterinstalling section 2012 can be molded to have good flatness, smoothnessand evenness, so as to allow the optical filters 400 to be evenlyinstalled, wherein this feature is superior to the conventional cameramodules.

In addition, the optical filter installing section 2012 has twoinstalling grooves 20121 provided therein. The installing grooves 20121are respectively communicated to the two windows 20100 respectively soas to provide adequate installation space for the two optical filters400 installed therein, such that the optical filters 400 will notprotrude on the top surface of the optical filter installing section2012. In other words, the conjoined encapsulation portion 201 has twoinstalling grooves 2121 indented therein for respectively installing theoptical filters 400 on the conjoined encapsulation portion 201 withoutprotruding out from the top of the conjoined encapsulation portion 201.Particularly, each of the optical filters 400 can be an Infrared-CutFilter (IRCF).

It is worth mentioning that, in the present twentieth embodiment of thepresent invention, the installing grooves 20121 can be used for theinstallation of the optical filters 20, whereas in other embodiments ofthe present invention, each of the installing grooves 20121 can be usedfor the installation of other element, such as the camera lens or motorunit of the array camera module. Those skilled in the art shouldunderstand that the use and/or shape of the installing groove 20121shall not be a limitation of the present invention.

It is worth mentioning that the inner walls of the windows 20100 of theconjoined encapsulation portion 201 can be shaped according to the shapeof the object such as the optical filter to be connected thereto. Forexample, it can be in an inclined or slope shape, so that the time theconnecting element 2024 is wrapped, the photosensitive sensor 2021 canreceive more light while the connecting elements 2024 are encapsulatedand wrapped up by the encapsulation portion 201. Those skilled in theart should understand that specific shape of the conjoined encapsulationportion 201 shall not limit the scope the present invention.

Furthermore, according to the present twentieth preferred embodiment ofthe present invention, the photosensitive unit 200 includes two motorconnecting structures 203 for respectively connecting to two motor units600 of the array camera module. Each of the motor units 600 has at leastone motor terminal 601. Each of the motor connecting structure 203includes at least one connecting element such as lead wire 2031, whereineach of the connecting elements 2031 is connected to the motor unit 600and the main circuit board 2022. Each of the connecting elements 2031 iselectrically connected to the main circuit board 2022. Further, each ofthe connecting elements 2031 is electrically connected to the connectingcircuit of the main circuit board 2022. The connecting element 2031 isdeployed in the conjoined encapsulation portion 201 and extended to thetop of the conjoined encapsulation portion 201. Each of the connectingelements 2031 includes a motor coupling end 20311 exposed on the topportion of the conjoined encapsulation portion 201 for beingelectrically connected to the motor terminal 601 of the respective motorunit 600. It is worth mentioning that the connecting elements 2031 canbe deployed by embedding during the molding formation of the conjoinedencapsulation portion 201. In the conventional way of connection,components like driving motors are connected to the circuit boardthrough independent lead wires, which involve relatively complicatedmanufacture technique. However, according to the molding method of thepresent invention, the connecting elements 2031 are embedded in themolding process which not only can substitute the conventionaltechnological processes, like motor soldering, but also make the circuitconnection more stable. Particularly, in the twentieth preferredembodiment of the present invention, each of the connecting elements2031 is embodied as a conductor embedded inside the conjoinedencapsulation portion 201. For example, the motor terminal 601 can beconnected to the motor coupling end 20311 with anisotropic conductivefilm or by welding and soldering.

It is worth mentioning that the embedding positions of the connectingelements 2031 and the revealing positions of the motor coupling ends20311 of the connecting elements 2031 on the conjoined encapsulationportion 201 may be disposed based on the user's needs. For instance, inone preferred embodiment of the present invention, the motor couplingends 20311 of the connecting elements 2031 can be deployed on theperiphery of the conjoined encapsulation portion 201 which are the topsurface of the conjoined encapsulation portion 201 and the top surfaceof the optical filter installing section 2012. However, in anotherembodiments of the present invention, the motor coupling ends 20311 canbe deployed on the inner sides of the conjoined encapsulation portion201 which are the bottom sides of the installing grooves 20121 of theconjoined encapsulation portion 201. Therefore, there may be variousinstallation sites provided for the motor units 600. In other words,when the motor units 600 have to be installed on the top of theconjoined encapsulation portion 201, the motor coupling ends 20311 willbe provided on the top surface of the outer side of the conjoinedencapsulation portion 201. When the motor units 600 have to be installedin the installing grooves 20121 respectively, the motor coupling ends20311 are provided on the inner sides of the conjoined encapsulationportion 201, which are the bottoms of the installing grooves 20121.

In other words, when producing the photosensitive unit 200, thephotosensitive sensors 221 are firstly adhered on the main circuit board2022 and then the conjoined encapsulation portion 201 is molded on themain circuit board 2022 and the photosensitive sensor 2021 by means ofthe MOC technology. At the same time, the connecting elements 2031 canbe embedded in the conjoined encapsulation portion 201 during themolding, which electrically connects the connecting elements 2031 withthe main circuit board 2022 and reveals the motor coupling ends 20311 ofthe connecting elements 2031 on the top of the conjoined encapsulationportion for connecting with the motor terminals 601 of the motor units600 respectively. For example, when the photosensitive unit 200 is to beinstalled on the array camera module, motor terminals 601 of the motorunits 600 are connected to the motor coupling ends 20311 of theconnecting elements 2031 by welding and soldering so as to electricallyconnect the motor units 600 with the main circuit board 2022. Anindependent connecting element such as lead wire is required to bedeployed to connect the motor unit 600 and the main circuit board 2022to allow the length of the motor terminal 601 of the motor unit 600 tobe shortened.

Referring to FIGS. 44 to 48A, the array camera module according to thetwentieth preferred embodiment of the present invention is illustrated,which can be embodied as an Automatic Focus Camera Module (AFCM), whichincludes one the photosensitive unit 200, two the optical filters 400,two the motor units 600, and two the camera lenses 500.

The optical filters 400 are mounted in the photosensitive unit 200,while the camera lenses 500 are mounted in the motor units 600respectively. The motor units 600 are mounted on the photosensitive unit200.

Furthermore, the optical filters 400 are mounted at the installinggrooves 20121 of the optical filter installing section 2012 of theconjoined encapsulation portion 201 of the photosensitive unit 200. Themotor units 600 are mounted on the top of the optical filter installingsection of the conjoined encapsulation portion 21 of the photosensitiveunit 200.

Furthermore, the motor terminals 601 of the motor units 600 areelectrically connected with the motor coupling ends 20311 of the motorconnecting structures 203 respectively, so as to electrically connect tothe main circuit board 2022 through the motor connecting structures 203.

Those skilled in the art should understand that the structures and formsof the camera module mentioned above array are just examples to describeways of implementing the array camera module, rather than limitations ofthe present invention.

Referring to FIG. 49A, an alternative mode of the motor connectingstructure of the above twentieth preferred embodiment of the presentinvention is illustrated. Each of the motor connecting structures 203includes a terminal slot 2033. The terminal slot 2033 is foraccommodating the motor terminal 601 of the respective motor unit 600 ofthe array camera module. The terminal slot 2033 is deployed on the topof the conjoined encapsulation portion 201. The motor connectingstructure 203 includes at least one connecting element such as lead wire2034, wherein the connecting elements 2034 are connected to the motorunits 600 and the main circuit board 2022. The connecting elements 2034are deployed in the conjoined encapsulation portion 201 and upwardlyextended to the bottom walls of the terminal slots 2033 of the conjoinedencapsulation portion 201. Each of the connecting elements 2034 includesa motor coupling end 20341 exposed on the bottom wall of the respectiveterminal slot 2033 of the conjoined encapsulation portion 201 for beingelectrically connected to the motor terminal 601 of the respective motorunit 600. Particularly, in an implementation, the motor coupling ends20341 can each be embodied to be a pad. The connecting elements 2034 caneach be embodied as a conductor to be embedded inside of the conjoinedencapsulation portion 201.

In other words, in producing the photosensitive unit 200, thephotosensitive sensors 221 are firstly adhered on the main circuit board2022. Then, the conjoined encapsulation portion 201 is molded on themain circuit board 2022 and the photosensitive sensors 2021 by means ofthe MOC technology, wherein, at the same time, the terminal slots 2033with predetermined length are preset and the connecting elements 2034are arranged to be embedded therein during the molding, wherein theconnecting elements 2034 are electrically connected with the maincircuit board 2022 and reveal the motor coupling ends 20341 of theconnecting elements 2034 on the bottom walls of the terminal slots 2033of the conjoined encapsulation portion 201 for connecting with the motorterminals 601 of the motor units 600 respectively. For example, when thephotosensitive unit 200 is to be installed on the array camera module,the motor terminals 601 of the motor units 600 are inserted into theterminal slots 2033 and connected to the motor coupling ends 20341 ofthe connecting elements 2034 respectively by welding and soldering so asto electrically connect the motor units 600 with the main circuit board2022. An independent connecting element such as lead wire is required tobe deployed to connect each of the motor units 600 and the main circuitboard 2022 to ensure stable connection for the motor terminal 601 of themotor unit 600 and to keep unnecessary contact from the motor terminal601. Particularly, the connecting elements 2034 can each be embodied asa conductor to be embedded inside of the conjoined encapsulation portion201.

Referring to FIG. 49B, another alternative mode of the motor connectingstructure of the above twentieth preferred embodiment of the presentinvention is illustrated. Each of the motor connecting structures 203includes a terminal slot 2035. The terminal slots 2035 are adapted foraccommodating the motor terminals 601 of the motor units 600 of thearray camera module. The terminal slots 2035 are deployed on theconjoined encapsulation portion 201. Each of the motor connectingstructures 203 includes at least one circuit junction 2032, wherein thecircuit junction 2032 is preset on the main circuit board 2022 andelectrically connected to the connecting circuit in the main circuitboard 222. Furthermore, each of the terminal slots 2035 is extended fromthe top of the conjoined encapsulation portion 201 to the main circuitboard 2022 to show the circuit junction 2032. In one preferredembodiment, the motor terminals 601 are adapted to insert into theterminal slots 2035 and can be solderingly and weldingly connected thecircuit junctions 2032 respectively.

In other words, when producing the photosensitive unit 200, each of thecircuit junctions 2032 is preset on the main circuit board 2022. Then,the photosensitive sensors 221 are attached on the main circuit board2022. Then, the conjoined encapsulation portion 201 is molded on themain circuit board 2022 and the photosensitive sensors 2021 by means ofthe MOC technology. At the same time, each of the terminal slots 2035with predetermined length is preset and the respective circuit junction2032 is revealed through the terminal slot 2035 for connecting with themotor terminal 601 of the respective motor unit 600. For example, whenthe photosensitive unit 200 is to be assembled on the array cameramodule, the motor terminals 601 of the motor units 600 are inserted intothe terminal slots 2035 and connected to the circuit junctions 2032 ofthe main circuit board 2022 by welding and soldering respectively so asto electrically connect the motor units 600 with the main circuit board2022 and to ensure stable connection for the motor terminals 601 of themotor units 600 and to keep unnecessary contact from the motor terminals601.

Referring to FIG. 49C, another alternative mode of the motor connectingstructure of the above twentieth preferred embodiment of the presentinvention is illustrated. Each of the motor connecting structures 203includes a carving line 2036. The carving lines 2036 are adapted toelectrically connect the connecting elements, the photosensitive sensors2021, and the motor units 600 on the main circuit board 2022. Forexample, but not limited to, the carving lines 2036 can be deployed byelectronic carving or Laser Direct Structuring (LDS) during the formingof the conjoined encapsulation portion 201. In the conventional way ofconnection, components like driving motors are connected to the circuitboard through independent lead wires, which involve relativelycomplicated manufacture technique. However, according to the moldingmethod of the present invention, the arrangement of the carving lines2036 in the molding process can not only substitute the conventionaltechnological processes, like motor soldering, but also make the circuitconnection more stable. More specifically, the formation process of thecarving line 2036 can be carving on the conjoined encapsulation portion201 and then laying the circuit by electroplating in the carved grooves.

In one embodiment of the present invention, the motor units 600 of thearray camera module which are connected with the photosensitive unit 200is described as an example that uses the motor connecting structure 203for the connection, which includes, for example, using the connectingelement 2031 for the connection. However, in other embodiments of thepresent invention, the connecting method for the motor unit 600 may alsocombine with the connecting methods as shown in FIGS. 49A, 49B, and 49C,such as utilizing the terminal slot 2033 and the lead wire 2034, theterminal slot 2035 and the circuit junction 2032, and etc. In anotherembodiments of the present invention, referring to FIG. 48B, the motorunit 600 may be connected with the photosensitive unit 200 with atraditional method, such as welding and soldering. Those skilled in theart should understand that specific way of connecting the motor 600 andthe photosensitive unit 200 shall not limit the scope of the presentinvention.

Referring to FIG. 50, another alternative mode of the array cameramodule according to the twentieth preferred embodiment of the presentinvention is illustrated, which can be a fixed focus array camera moduleincluding one the photosensitive unit 200, two the optical filters 400and two the camera lenses 500.

The optical filters 400 are mounted above the photosensitive unit 200,while the camera lenses 500 are mounted on the photosensitive unit 200.

More specifically, the optical filters 400 are respectively mounted atthe installing grooves 20121 of the optical filter installing section2012 of the conjoined encapsulation portion 201 of the photosensitiveunit 200. The camera lenses 500 are mounted on the top of conjoinedencapsulation portion 201 of the photosensitive unit 200.

It is also worth mentioning that the camera lenses 500 are supported onthe top of the conjoined encapsulation portion 201 of the photosensitiveunit 200. Therefore, the conjoined encapsulation portion 201 canfunction as the independent mounting frame of a conventional cameramodule to provide a supportive and holding site, but the presentinvention is assembled by different technical process from theconventional COB technology. The mounting frame of a conventional cameramodule based on conventional COB technique is affixed on the circuitboard by adhesive. However, the conjoined encapsulation portion 201 ofthe present invention is affixed on the main circuit board 2022 by meansof the molding technique that does not require such adhering andaffixing process. Contrasting to the conventional adhering and fixatingprocess, the molding process of the present invention provides betterconnection stability and technological process controllability. Besides,it does not have to reserve any adhering space between the conjoinedencapsulation portion 201 and the main circuit board 2022 for AAadjustment, which, therefore, saves the adhering space of AA adjustmentof conventional camera module, and allows the thickness of the cameramodule to be further reduced. Meanwhile, the conjoined encapsulationportion 201 encapsulates and wraps the circuit elements 2023 and theconnecting elements 2024, so that the frame function of conventionalmounting frame, the circuit elements 2023 and the connecting elements2024 can be spatially overlapped. It is different to the conventionalcamera module that requires to reserve safety distance around thecircuit components. Accordingly, the height of the conjoinedencapsulation portion 201, which has the function of the conventionalindependent frame, can be arranged in a smaller range, so as to furtherprovide room for reducing the thickness of the array camera module ofthe present invention. Besides, the conjoined encapsulation portion 201substitutes the conventional independent frame to avoid the tiltdeviation occurred in attaching and assembling the conventionalindependent frame and to reduce the accumulated tolerance in theassembling of the camera module. In addition, the conjoinedencapsulation portion 201 encapsulates and wraps up the connectingelements 2024 and extends to the non-photosensitive area 20212 of thephotosensitive sensor 2021, which allows the conjoined encapsulationportion 201 to shrink inwards, so as to further reduce the lateral sizesin length and width of the array camera module.

Referring to FIG. 51, the array camera module with its photosensitiveunit according to a twenty-first preferred embodiment of the presentinvention is illustrated.

The different between this twenty-first preferred embodiment and theabove preferred embodiments is that, the main circuit board 2022H hastwo inner grooves 20222H indented therein. The photosensitive sensors2021 are respectively in in the inner grooves 20222H, so as to reducethe relative total height of the photosensitive sensors 2021 and themain circuit board 2022H. Therefore, when the conjoined encapsulationportion 201 covers and wraps up the photosensitive sensors 2021, a lowerheight demand of the conjoined encapsulation portion 201 can beachieved, and thus the height of the array camera module assembled withthe photosensitive unit 200 can be further reduced.

Referring to FIG. 52, the array camera module with its photosensitiveunit according to a twenty-second preferred embodiment of the presentinvention is illustrated.

The different between this twenty-second preferred embodiment and theabove preferred embodiments is that, in the present embodiment of thepresent invention, the photosensitive portion 202 of the photosensitiveunit 200 includes a reinforced layer 20251 overlappedly attached to thebottom of the main circuit board 2022, so as to reinforce the structuralstrength of the main circuit board 2022. In other words, the reinforcedlayer 20251 is adhered on the relative areas of the bottom portion ofthe main circuit board 2022 where the conjoined encapsulation portion201 and the photosensitive sensors 2021 are located, so that the maincircuit board 2022 reinforced by the reinforced layer 20251 can stablyand reliably support the conjoined encapsulation portion 201 and thephotosensitive sensors 2021.

Furthermore, the reinforced layer 20251 is embodied as a metal plateattaching on the bottom of the main circuit board 2022 to increase thestructural strength of the main circuit board 2022 as well as to enhancethe heat dissipation of the photosensitive unit 200 by effectivelydissipating heat generated by the photosensitive sensors 2021.

It is worth mentioning that the main circuit board 2022 can be a FlexPrint Circuit (FPC). By enhancing the rigidity of the FPC with thereinforced layer, the FPC that has excellent flexural property can stillqualify for the load bearing requirement for the photosensitive unit200. In other words, there are more available options for the maincircuit board 2022, such as PCB (Printed Circuit Board), FPC (FlexiblePrinted Circuit), and RF (Rigid Flex). By using the reinforced layer20251 to enhance the structural strength and heat dissipation of themain circuit board 2022, the thickness of the main circuit board 2022can also be reduced, which helps to further reduce the height of thephotosensitive unit 200 as well. Hence, the total height of the arraycamera module assembled thereby can be reduced.

Referring to FIG. 53, the array camera module with its photosensitiveunit according to a twenty-third preferred embodiment of the presentinvention is illustrated.

The different between this twenty-third preferred embodiment and theabove preferred embodiments is that, the main circuit board 2022J hasone or more reinforced holes 20221J indented therein and the conjoinedencapsulation portion is extended into the reinforced holes 20221J, soas to enhance the structural strength of the main circuit board 2022J.

The positions of the reinforced holes 20221J can be determined based onthe practical needs. Also, it can be arranged based on the need of thestructural strength of the circuit board, which can be, for example,arranged in a symmetrical construction. The arrangement of thereinforced holes 20221J makes the structural strength of the maincircuit board 2022J being stronger, which allows the thickness of themain circuit board 2022J and the thickness of the camera moduleassembled thereof to be reduced. Besides, heat dissipation performanceof the photosensitive unit 200 is enhanced as well.

It is worth mentioning that each of the reinforced holes 20221J is ingroove shape, so that when manufacturing the photosensitive unit 200,the molding material of the conjoined encapsulation portion will notleak off from the reinforced holes 20221J.

Referring to FIG. 54, the array camera module with its photosensitiveunit 200 according to a twenty-fourth preferred embodiment of thepresent invention is illustrated.

The different between this twenty-fourth preferred embodiment and theabove preferred embodiments is that, the main circuit board 2022K hasone or more reinforced holes 20221K provided therethrough and theconjoined encapsulation portion is extended to fill in the reinforcedholes 20221K, so as to enhance the structural strength of the maincircuit board 2022K.

The positions of the reinforced holes 20221K can be determined based onthe practical needs. Also, they can be arranged based on the need of thestructural strength of the circuit board, which can be, for example,arranged in a symmetrical construction. The arrangement of thereinforced holes 20221K makes the structural strength of the maincircuit board 2022K being stronger, which allows the thickness of themain circuit board 2022K and the thickness of the camera moduleassembled thereof to be further reduced. Besides, heat dissipationperformance of the photosensitive unit 200 is enhanced as well.

It is worth mentioning that the reinforced holes 20221K are throughholes, which, in other words, penetrate through the main circuit board2022K, so as to communicate the top side and the bottom side of the maincircuit board 2022K. Therefore, during the production of thephotosensitive unit 200, the molding material of the conjoinedencapsulation portion can fill into reinforced holes 20221K and be fullybonded with the main circuit board 2022K and form a more solid structureof combined composite material. Besides, in comparison to the indentedreinforced holes 20221J of the above twenty-third embodiment, thethrough hole type reinforced holes 20221K are is easier to be made andprocessed.

Referring to FIG. 55, the array camera module with its photosensitiveunit according to a twenty-fifth preferred embodiment of the presentinvention is illustrated.

The conjoined encapsulation portion 201L includes a covering section2011L, an optical filter installing section 2012L and a camera lensinstalling section 2013L. The optical filter installing section 2012Land the camera lens installing section 2013L are integrally molded toextend upwardly from the covering section 2011L orderly to form anintegral body. The covering section 2011L is molded to attach on themain circuit board 2022 for wrapping up and covering the circuitelements 2023 and the connecting elements 2024. The optical filterinstalling section 2012L is integrally molded to extend upwards from thecovering section 2011L for mounting the optical filters 400. In otherwords, when the photosensitive unit 200 is utilized for assembling thearray camera module, the optical filters 400 of the array camera modulewill be mounted at the optical filter installing section 2012L, whereinthe optical filters 400 are deployed and aligned along thephotosensitive paths of the photosensitive sensors 2021 respectivelywithout the need of any additional mounting frame for installing theoptical filter 400. In other words, the conjoined encapsulation portion201L itself can function as a conventional mounting frame. Takingadvantage of the molding technique, the top of the optical filterinstalling section 2012L can be modeled to have good flatness,smoothness and evenness, so as to allow the optical filters 400 to beevenly installed, wherein such feature is more superior to conventionalcamera modules. The camera lens installing section 2013L is integrallymolded to extend upwards from the optical filter installing section2012L for mounting the camera lenses 500. In other words, when thephotosensitive unit 200 is utilized in the assembling the array cameramodule, the camera lenses 500 are mounted at the inner portion of thecamera lens installing section 2013L of the conjoined encapsulationportion 201L, which provides stable mounting positions for the cameralenses 500.

The conjoined encapsulation portion 201L includes a connecting unit2014L and two outer surrounding units 2015L. The connecting unit 2014Lis integrally molded to connect between the two outer surrounding units2015L, wherein the connecting unit 2014L also separates the two outersurrounding units 2015L into two neighboring portions, wherein each ofthe outer surrounding units 2015L forms a window 20100L. Twophotosensitive sensors 2021 are respectively located at two sides of theconnecting unit 2014L and aligned with the two outer surrounding units2015L, the two windows 20100L and the two photosensitive sensors 2021respectively, so as to be adapted for assembling the array cameramodule. It is worth mentioning that the connecting unit 2014L is acommon segment for the two camera lenses 500 to share for installation,which means that as the two camera lenses 500 are installed, each of thecamera lenses 500 occupies a corresponding portion of the connectingunit 2014L.

In addition, the optical filter installing section 2012L has twoinstalling grooves 20121L formed therein. The installing grooves 20121Lare respectively communicated to the windows 20100L respectively toprovide adequate installation space for the optical filters 400, suchthat the optical filters 400 will not protrude from the top surface ofthe optical filter installing section. The camera lens installingsection 2013L has two lens installing grooves 20131L provided therein.The two lens installing grooves 20131L are communicated with the twowindows 20100L respectively, so as to provide adequate installationspace for installing the two camera lenses 500.

In other words, the optical filter installing section 2012L and thecamera lens installing section 2013L are integrally extended upwardly toform an internal step shape structure, which respectively providesupporting and affixing positions to the optical filters 400 and thecamera lenses 500, which, therefore, does not require any extra part forthe installation of the optical filters 400 and the camera lenses 500.

The integral camera lens installing section 2013L has two camera lensinner walls 20132L defining two installation chambers. Each of thecamera lens inner walls 20132L has a close ring shape, which is adaptedfor providing the installation chamber for the respective camera lens500. It is worth mentioning that the surfaces of the camera lens innerwalls 20132L of the camera lens installing section 2013L are smooth forinstalling the threadless camera lenses 500 respectively to form a fixedfocus array camera module. Particularly, the camera lenses 500 can besecured in the camera lens installing section 2013L by adhering.

Referring to FIG. 56, the array camera module with its photosensitiveunit according to a twenty-sixth preferred embodiment of the presentinvention is illustrated. The different between this twenty-sixthpreferred embodiment and the above preferred embodiments is that, thephotosensitive unit 200 includes a shielding layer 227 that covers themain circuit board 2022 and the conjoined encapsulation portion 21, soas to not only reinforce the structural strength of the main circuitboard 2022, but also enhance the electromagnetic immunity ability of thephotosensitive unit 200.

Referring to FIG. 57, the array camera module with its circuit unitaccording to a twenty-seventh preferred embodiment of the presentinvention is illustrated. The different between this twenty-seventhpreferred embodiment and the above embodiment is that, the array cameramodule includes a frame 700M, for installing the optical filters 400,the camera lenses 500, and/or the motor units 600. According to thepresent twenty-seventh preferred embodiment of the present invention,the frame 700M is mounted on the conjoined encapsulation portion 201.The two optical filters 40 are mounted on the frame 700M. The two motorunits 600 are mounted on the frame 700M. Specific shape of the frame700M can be arranged based on the practical needs, wherein, for example,the frame 700M can be embodied as a platform to install the opticalfilters and the motor units 600. The frame 700M can be a conjoinedframe, which, in other words, can have a plurality of the opticalfilters 400 installed thereon. Alternatively, the frame 700M can also bea single frame, which can have only one optical filter 400 installedthereon and two independent frames are mounted on the conjoinedencapsulation portion 201 to install the two optical filters 400. In thepresent twenty-seventh preferred embodiment of the present invention,the frame 700M is preferably, a conjoined frame. Those skilled in theart should understand that specific shape of the frame 700M shall notlimit the scope the present invention.

Referring to FIG. 58, the array camera module with its photosensitiveunit according to a twenty-eighth preferred embodiment of the presentinvention is illustrated. The array camera module includes aphotosensitive unit 200N. The two camera lenses 500 are mounted on thephotosensitive unit 200N for assembling and forming the array cameramodule.

Specifically, the camera lenses 500 can be affixed on top of theconjoined encapsulation portion 201N of the photosensitive unit 200N bymeans of adhering. In addition, taking advantage of the moldingtechnique, the top of the conjoined encapsulation portion 201N can havea better flatness, evenness and smoothness, which provides an excellentinstallation condition for the camera lenses 500, so as to achieve ahigh quality array camera module. The photosensitive unit 200N is forassembling and producing the array camera module, so as to obtain themolded array camera modules.

The photosensitive unit 200N includes a conjoined encapsulation portion201N and a photosensitive portion 202N, wherein the conjoinedencapsulation portion 202N is integrally encapsulated to thephotosensitive portion 202N, such that the conjoined encapsulationportion 201N is molded to connect to the photosensitive portion 202N.

The circuit board portion includes a main circuit board 2022N. Theconjoined encapsulation portion 201N forms two windows 20100N therein,so that the conjoined encapsulation portion 201N is respectivelypositioned surrounding the outer portion of the photosensitive sensors2021N and provides light paths from the camera lenses 500 to thephotosensitive sensors 2021N through the windows 20100N respectively.The photosensitive sensors 2021N are installed at the positionscorresponding to the windows 20100N on the main circuit board 2022N.

The conjoined encapsulation portion 201N includes a connecting unit2014N and two outer surrounding units 2015N. The connecting unit 2014Nis integrally molded to connect between the two outer surrounding units2015N to form an integral body. The connecting unit 2014N separates theouter surrounding units 2015N into two neighboring portions. The twoouter surrounding units 2015N form two windows 20100N respectively. Thetwo photosensitive sensors 2021 are respectively located at two sides ofthe connecting unit 2014N and aligned with the two windows 20100N, so asto be adapted for assembling the array camera module. It is worthmentioning that the connecting unit 2014N is a common segment for thetwo camera lenses 500, which means that as the camera lenses 500 areinstalled, each of the camera lenses 500 respectively occupies acorresponding portion of the connecting unit 2014N.

The photosensitive portion 202N includes a main circuit board 2022N andthe two photosensitive sensors 2021N, wherein the photosensitive sensors2021N are respectively disposed on the main circuit board 2022N.According to the present twenty-eighth preferred embodiment of thepresent invention, the photosensitive sensors 2021N are molded toconnect to the main circuit board 2022N.

According to the present twenty-eighth preferred embodiment of thepresent invention, the photosensitive portion 202N includes a connectingcircuit (not shown in the figures) and one or more circuit elements2023N. The connecting circuit is preinstalled in the main circuit board2022N. The circuit elements 2023N are electrically connected to theconnecting circuit and the photosensitive sensors 2021N, wherein thephotosensitive sensors 2021N would process their photosensing processes.The circuit element 2023N is protrudingly deployed on the main circuitboard 2022N. The circuit element 2023N can be, for example but notlimited to, resistors, capacitors, diodes, triodes, potentiometers,electric relays, or actuators.

It is worth mentioning that the conjoined encapsulation portion 201Nencapsulates and wraps up the circuit elements 2023N therein, so thatthe circuit elements 2023N will not be directly exposed in the openspace, and more specifically, not be exposed in the environment thatcommunicates with the photosensitive sensors 2021N. Therefore, duringthe assembling of the array camera module, the circuit elements 2023Nwill not be contaminated by pollutants, such as dusts, or influence thephotosensitive sensor 2021N, which is different from the arrangement ofconventional camera module that the circuit elements 2023N, such asresistance-capacitance components, are exposed to outside. The use ofthe molding method prevents sundries and dusts from staying on thesurface of the circuit elements 2023N and avoids the photosensitivesensors 2021N from being contaminated and causing dark spots and otherdefectives of the array camera module.

According to the present twenty-eighth preferred embodiment of thepresent invention, the photosensitive portion 202N includes a pluralityof connecting elements 2024N for respectively electrically connectingthe photosensitive sensors 2021N with the main circuit board 2022N.Further, the connecting elements 2024N can each be embodied to be,specifically but not limited to, gold wire, copper wire, aluminum wire,and/or silver wire.

It is worth mentioning that the connecting elements 2024N are moldedinside the conjoined encapsulation portion 201N, so that the conjoinedencapsulation portion 201N substantially encloses, encapsulates and/orwraps up the connecting elements 2024N and keeps them from directexposure to the outside. Therefore, during assembling the array cameramodule, the connecting elements 2024N will not suffer any collision ordamage, which, at the same time, reduces the impact due to theenvironmental factors, such as temperature, on the connecting element2024N and stabilizes the communication and connection between thephotosensitive sensors 2021N and the main circuit board 2022N. This isnot provided in the conventional art.

It is worth mentioning that the conjoined encapsulation portion 201Nencapsulates and wraps up the circuit elements 2023N and the connectingelements 2024N, which advantages in protecting the circuit elements2023N and the connecting elements 2024N as well as achieving a higherperformance array camera module. However, those skilled in the artshould understand that the conjoined encapsulation portion 201N shallnot be limited in wrapping up the circuit elements 2023N and/or theconnecting elements 2024N. In other words, in other embodiments of thepresent invention, the conjoined encapsulation portion 201N can bedirectly molded on the main circuit board 2022N without protrudedcircuit elements 2023N or be molded on various positions, such as theouter side, periphery, and etc., of the circuit elements.

In addition, each of the photosensitive sensors 2021N has aphotosensitive area 20211N and a non-photosensitive area 20212N, whereinthe non-photosensitive area 20212N is positioned surrounding theperiphery of the photosensitive area 20211N. The photosensitive area20211N is adapted for conducting photosensitization. The connectingelements 2024N are connected to the non-photosensitive area 20212N.

According to the twenty-eighth preferred embodiment of the presentinvention, the conjoined encapsulation portion 201N is extended on thenon-photosensitive area 20212N of the photosensitive sensor 2021N, so asto overlappedly mount the photosensitive sensor 2021N on the maincircuit board 2022N by molding. In this manner, such as by means of theprocess of Molding On Chip, the moldable area of the conjoinedencapsulation portion 201N can be extended inwardly, such that thestructural portion of the outer portion of the conjoined encapsulationportion 201N and the main circuit board 2022N can be reduced, whichfurther reduces the size in length and width of the moldedphotosensitive portion 202N and reduces the size in length and width ofthe array camera module assembled thereby.

The photosensitive unit 200N further includes two optical filters 226N,wherein the optical filters 226N are molded to overlappedly mount on thephotosensitive sensors 2021N respectively. The edges of the two opticalfilters 226N are encapsulated by the conjoined encapsulation portion201N, so as to hold the optical filters 226N in position. It is worthmentioning that the optical filters 226N cover the two photosensitivesensors 2021N respectively and insulate the photosensitive sensors 2021Nfrom the external environment to protect the photosensitive sensors2021N from damages.

To produce the molded photosensitive unit, the photosensitive sensors2021N are firstly adhered on the main circuit board 2022N and then theconnecting elements 2024 connect the photosensitive sensors 2021N to themain circuit board 2022N. Then, the optical filters 226N are attached onthe photosensitive sensors 2021N respectively. Thereafter, the maincircuit board 2022N, the photosensitive sensors 2021N, and the opticalfilters 226N are molded to form the conjoined encapsulation portion201N. During the molding process, because the optical filters 226N areattached on top of the photosensitive sensors 2021N, damages caused bythe molding mould to the photosensitive sensors 2021N can be avoided.Besides, because the distance between the optical filters 226N and thephotosensitive sensors 2021N is shortened, the back focal length of thearray camera module assembled thereby can be shortened, which is able toreduce the height of the array camera module. Furthermore, because theoptical filters 226N do not require any additional supportive component,the thickness of the array camera module can further be reduced to acertain extend.

In the present twenty-eighth preferred embodiment of the presentinvention, the conjoined encapsulation portion 201N is protrudinglypositioned surrounding the outer portion of the photosensitive area20211N of each photosensitive sensor 2021N. Particularly, the conjoinedencapsulation portion 201N integrally encapsulates and encloses theconnection of the photosensitive sensors 2021N and the main circuitboard 2022N, so as to provide a good sealingness and tightness.Therefore, when the photosensitive unit 200N is used in assembling thearray camera module, each photosensitive sensors 2021N is sealed to forma sealed inner space.

Specifically, to produce the photosensitive unit 200N, a conventionalcircuit board may be used to form the main circuit board 2022N. Then,the photosensitive sensors 2021N are arranged to install on the maincircuit board 2022N and electrically connected with the connectingelements 2024N. Further, the optical filters 226N are overlappinglyattached on the photosensitive sensors 2021N respectively. Then, afterthe initial assemble of main circuit board 2022N, the photosensitivesensors 2021N and the optical filters 226N are processed by SurfaceMount Technology (SMT) and then molded, for example, by means of theinsert molding technique by an injection molding machine, to form theconjoined encapsulation portion 201N, or by means of the pressingmolding technique, which is commonly used in semiconductor packaging, toform the conjoined encapsulation portion 201N. The main circuit board2022N can selectively be, for example but not limited to, rigid-flexboard, ceramic substrate (without flexible board), or rigid PCB (withoutflexible board). The method to form the conjoined encapsulation portion201N can be selected from, for example but not limited to, injectionmolding technique and pressing molding technique. The material of theconjoined encapsulation portion 201N can be, for example but not limitedto, nylon, liquid crystal polymer (LCP), or polypropylene (PP) forinjection molding technique, or resin for pressing molding technique.Those skilled in the art should understand that the above availablemanufacture methods and available materials are examples to describeavailable implementations of the present invention, rather thanlimitations of the present invention.

FIGS. 60A and 60B illustrate the comparison of the array camera moduleaccording to the above preferred embodiment of the present invention anda conventional multi-lens camera module. The left view of FIG. 60Arefers to a conventional multi-lens camera module, while the right viewof FIG. 60A refers to the array camera module of the present invention.The left view of FIG. 60B illustrates the manufacturing a conventionalcircuit board, while the right view of FIG. 60B illustrates theimposition process of the present invention. In view of above, the arraycamera module of the present invention has the following advantages:

1. The conjoined encapsulation portion of the array camera module of thepresent invention provides consistent installation condition for all ofthe camera lenses or motor units, such that the consistency among theoptic axises of the camera lenses can be increased. This installationcondition for camera lenses or motor units is better than what could beprovided by the conventional independent frames and the frames adheredby means of the COB technique.

2. The conjoined encapsulation portion of the array camera module of thepresent invention provides all camera lenses or motor units installationpositions. The manufacturing method according to the present inventioncan reduce the installation spacing among the camera lenses, which fullyutilizes the space and reduces the lateral size of the array cameramodule.

3. It can decrease the size in length and width of the array cameramodule, wherein the encapsulation portion and circuit elements, such asresistance-capacitances, can be spatially overlapped. However, the frameof conventional solution has to be installed at the outer side of thecapacitors and reserve a certain safety distance. The present inventioncan utilize the space of the capacitors directly to fill with moldingmaterial around the capacitors directly.

4. The tilt of the array module can be reduced. The encapsulationportion can substitute the conventional plastic frame to reduce theaccumulated tolerance/deviance and eliminate the AA adjustment process.

5. The molding structure enhances the structural strength of the circuitboard that, under the same structural strength, the circuit board can bethinner to reduce the overall height of the array camera module becausethe encapsulation portion can provide support and increase strength.

6. For the altitude space, a reserved safety space for assembling isrequired between capacitors and the base in the conventional cameramodule. However, the molding technique of the present invention does notrequire such safety space for assembling, that reduces the height of thearray camera module. A safety gap between the top of the capacitors andthe frame is required in the conventional camera module in order toprevent interferences, but the present invention can directly fillmolding material around the capacitors.

7. The resistance-capacitance components can be wrapped by molding, soas to avoid dark spots and defectives of the camera module brought bysolder resist or dust in the resistance-capacitance area, and toincrease the product yield rate.

8. It is suitable for highly efficient mass production. Photosensitiveunit of the present invention is more suitable for mass impositionprocess. According to the molding method of forming the photosensitiveunit of the present invention, the photosensitive unit is more suitableby imposition process. In other words, only at most 8 conventionalcircuit boards can be produced in one conventional process, but more ofthe photosensitive units, as much as 80 to 90 pieces, can be finished atonce by the present invention.

One skilled in the art will understand that the embodiment of thepresent invention as shown in the drawings and described above isexemplary only and not intended to be limiting.

It will thus be seen that the objects of the present invention have beenfully and effectively accomplished. The embodiments have been shown anddescribed for the purposes of illustrating the functional and structuralprinciples of the present invention and is subject to change withoutdeparture from such principles. Therefore, this invention includes allmodifications encompassed within the spirit and scope of the followingclaims.

What is claimed is:
 1. A photosensitive unit for an array camera modulecomprising two or more camera lenses, comprising: a photosensitiveportion which comprises a circuit board including at least a maincircuit board with one or more circuit elements provided thereon, andtwo or more photosensitive sensors which are provided on said circuitboard, wherein each of said photosensitive sensors has a photosensitivearea and a non-photosensitive area positioned around a periphery of saidphotosensitive area, wherein said photosensitive portion furthercomprises connecting elements electrically connecting said main circuitboard to said non-photosensitive areas of said photosensitive sensors;and an encapsulation portion which is integrally molded to form asupport on said main circuit board and extended to saidnon-photosensitive areas of said photosensitive sensors so as tooverlappedly affix said photosensitive sensors on said main circuitboard by means of molding, said encapsulation portion being protrudinglyformed on said non-photosensitive areas and surrounding saidphotosensitive areas of said photosensitive sensors to form a lowercovering section, an upper installing section and two or more annularinclined inner walls upwardly and outwardly extending from saidnon-photosensitive areas of said photosensitive sensors to saidinstallation sections respectively to define two or more windows abovesaid photosensitive areas of said photosensitive sensors respectively,wherein each of said windows gradually reduces a size thereof from topto bottom to define a larger upper size and a smaller lower size so asto enable said photosensitive sensors receiving more light, wherein saidcovering section of said encapsulation portion is molded to have anintegral enclosure connection with said main circuit board and to cover,encapsulate and warp up said circuit elements and said connectingelements, wherein said installation section is adapted for enabling thecamera lenses to be installed thereon and aligned at two or morephotosensitive paths of said photosensitive sensors respectively andpositioned above said windows respectively and for installing one ormore optical filters above said respective windows of said encapsulationportion respectively to ensure said optical filters being deployed alongsaid photosensitive paths of said photosensitive sensors respectively,wherein a top surface of said installing section is molded to an evenand flat manner for facilitating the installing of the camera lenses andensuring one or more lenses of each of the camera lenses being parallelto said photosensitive area of said respective photosensitive sensor. 2.The photosensitive unit, as recited in claim 1, wherein said installingsection of said encapsulation portion has one or more annular installinggrooves provided on top of said encapsulation portion and communicatedwith said respective windows respectively to provide installation spacesfor the optical filters respectively, wherein said encapsulation portionis molded on said main circuit board while encapsulating and wrapping upsaid circuit elements and connecting elements without a need to provideany adhering and affixing space, and thus a thickness of theencapsulation portion is able to be minimized to just wrapping up saidcircuit elements and said connecting elements, and that said installingsection of said encapsulation portion enables the optical filters to bemounted on said installing section which enables a shorter back focallength of each of the camera lenses and further reduces a thickness ofthe camera module.
 3. The photosensitive unit, as recited in claim 1,further comprising one or more motor connecting structures forconnecting with one or more motor units, each having at least one motorterminal, for the one or more camera lenses, wherein each of said motorconnection structure includes at least one connecting element forconnecting said motor units and said main circuit board, whereinconnecting elements are deployed to be embedded in said encapsulationportion during the molding formation of said encapsulation portion,wherein each of said connecting elements has one end electricallyconnected to said main circuit board and another motor coupling endextended to exposed on top of said encapsulation portion for beingelectrically connected to the motor terminal of the respective motorunit.
 4. The photosensitive unit, as recited in claim 2, furthercomprising one or more motor connecting structures for connecting withone or more motor units, each having at least one motor terminal, forthe one or more camera lenses, wherein each of said motor connectionstructure includes at least one connecting element for connecting saidmotor units and said main circuit board, wherein connecting elements aredeployed to be embedded in said encapsulation portion during the moldingformation of said encapsulation portion, wherein each of said connectingelements has one end electrically connected to said main circuit boardand another motor coupling end extended to exposed on top of saidencapsulation portion for being electrically connected to the motorterminal of the respective motor unit.
 5. The photosensitive unit, asrecited in claim 1, further comprising one or more motor connectingstructures for connecting with one or more motor units, each having atleast one motor terminal, for the one or more camera lenses, whereineach of said motor connection structure has a terminal slot foraccommodating the motor terminal of the respective motor unit, whereinsaid terminal slot is deployed in said encapsulation portion, whereineach of said motor connecting structures includes at least one circuitjunction which is performed on said main circuit board and electricallyconnected to said circuit board, wherein each of said terminal slots isextended from the top of said encapsulation portion to said main circuitboard to present a circuit junction for enabling the motor terminalbeing inserted therein and being connected with said circuit junction.6. The photosensitive unit, as recited in claim 2, further comprisingone or more motor connecting structures for connecting with one or moremotor units, each having at least one motor terminal, for the one ormore camera lenses, wherein each of said motor connection structure hasa terminal slot for accommodating the motor terminal of the respectivemotor unit, wherein said terminal slot is deployed in said encapsulationportion, wherein each of said motor connecting structures includes atleast one circuit junction which is performed on said main circuit boardand electrically connected to said circuit board, wherein each of saidterminal slots is extended from the top of said encapsulation portion tosaid main circuit board to present a circuit junction for enabling themotor terminal being inserted therein and being connected with saidcircuit junction.
 7. The photosensitive unit, as recited in claim 1,wherein said main circuit board has one or more reinforced holes formedin said main circuit board and a bottom of said encapsulation portion ismolded to extend into said reinforced holes so as to enhance astructural strength of said main circuit board and the connection ofsaid main circuit board and said encapsulation portion.
 8. Thephotosensitive unit, as recited in claim 2, wherein said main circuitboard has one or more reinforced holes formed in said main circuit boardand a bottom of said encapsulation portion is molded to extend into saidreinforced holes so as to enhance a structural strength of said maincircuit board and the connection of said main circuit board and saidencapsulation portion.
 9. The photosensitive unit, as recited in claim4, wherein said main circuit board has one or more reinforced holesformed in said main circuit board and a bottom of said encapsulationportion is molded to extend into said reinforced holes so as to enhancea structural strength of said main circuit board and the connection ofsaid main circuit board and said encapsulation portion.
 10. Thephotosensitive unit, as recited in claim 6, wherein said main circuitboard has one or more reinforced holes formed in said main circuit boardand a bottom of said encapsulation portion is molded to extend into saidreinforced holes so as to enhance a structural strength of said maincircuit board and the connection of said main circuit board and saidencapsulation portion.
 11. The photosensitive unit, as recited in claim1, wherein said photosensitive portion further includes a reinforcedlayer overlappedly attached to a bottom of said main circuit board so asto reinforce a structural strength of said main circuit board andenhance a heat dissipation of said photosensitive unit.
 12. Thephotosensitive unit, as recited in claim 2, wherein said photosensitiveportion further includes a reinforced layer overlappedly attached to abottom of said main circuit board so as to reinforce a structuralstrength of said main circuit board and enhance a heat dissipation ofsaid photosensitive unit.
 13. The photosensitive unit, as recited inclaim 4, wherein said photosensitive portion further includes areinforced layer overlappedly attached to a bottom of said main circuitboard so as to reinforce a structural strength of said main circuitboard and enhance a heat dissipation of said photosensitive unit. 14.The photosensitive unit, as recited in claim 6, wherein saidphotosensitive portion further includes a reinforced layer overlappedlyattached to a bottom of said main circuit board so as to reinforce astructural strength of said main circuit board and enhance a heatdissipation of said photosensitive unit.
 15. The photosensitive unit, asrecited in claim 1, wherein said main circuit board has one or moreinner grooves provided therein, said photosensitive sensors are receivedand connected in said inner grooves respectively adapted for reducing athickness of said photosensitive unit.
 16. The photosensitive unit, asrecited in claim 2, wherein said main circuit board has one or moreinner grooves provided therein, said photosensitive sensors are receivedand connected in said inner grooves respectively adapted for reducing athickness of said photosensitive unit.
 17. The photosensitive unit, asrecited in claim 4, wherein said main circuit board has one or moreinner grooves provided therein, said photosensitive sensors are receivedand connected in said inner grooves respectively adapted for reducing athickness of said photosensitive unit.
 18. The photosensitive unit, asrecited in claim 6, wherein said main circuit board has one or moreinner grooves provided therein, said photosensitive sensors are receivedand connected in said inner grooves respectively adapted for reducing athickness of said photosensitive unit.
 19. The photosensitive unit, asrecited in claim 1, wherein said main circuit board has one or morepassages penetrated therethrough, wherein each of said passages isextended between a top side and a bottom side of said main circuitboard, wherein said photosensitive sensors are installed at a bottomside of said main circuit board and at lower portions of said passagesrespectively while said photosensitive areas of said photosensitivesensors are facing upwards for receiving light entering from the cameralenses through said windows and said passages respectively.
 20. Thephotosensitive unit, as recited in claim 2, wherein said main circuitboard has one or more passages penetrated therethrough, wherein each ofsaid passages is extended between a top side and a bottom side of saidmain circuit board, wherein said photosensitive sensors are installed ata bottom side of said main circuit board and at lower portions of saidpassages respectively while said photosensitive areas of saidphotosensitive sensors are facing upwards for receiving light enteringfrom the camera lenses through said windows and said passagesrespectively.
 21. The photosensitive unit, as recited in claim 4,wherein said main circuit board has one or more passages penetratedtherethrough, wherein each of said passages is extended between a topside and a bottom side of said main circuit board, wherein saidphotosensitive sensors are installed at a bottom side of said maincircuit board and at lower portions of said passages respectively whilesaid photosensitive areas of said photosensitive sensors are facingupwards for receiving light entering from the camera lenses through saidwindows and said passages respectively.
 22. The photosensitive unit, asrecited in claim 6, wherein said main circuit board has one or morepassages penetrated therethrough, wherein each of said passages isextended between a top side and a bottom side of said main circuitboard, wherein said photosensitive sensors are installed at a bottomside of said main circuit board and at lower portions of said passagesrespectively while said photosensitive areas of said photosensitivesensors are facing upwards for receiving light entering from the cameralenses through said windows and said passages respectively.
 23. Thephotosensitive unit, as recited in claim 19, wherein said main circuitboard further has one or more outer grooves provided at said bottom sideof said main circuit board communicating with said passagesrespectively, wherein said photosensitive sensors are mounted in saidouter grooves respectively.
 24. The photosensitive unit, as recited inclaim 20, wherein said main circuit board further has one or more outergrooves provided at said bottom side of said main circuit boardcommunicating with said passages respectively, wherein saidphotosensitive sensors are mounted in said outer grooves respectively.25. The photosensitive unit, as recited in claim 21, wherein said maincircuit board further has one or more outer grooves provided at saidbottom side of said main circuit board communicating with said passagesrespectively, wherein said photosensitive sensors are mounted in saidouter grooves respectively.
 26. The photosensitive unit, as recited inclaim 22, wherein said main circuit board further has one or more outergrooves provided at said bottom side of said main circuit boardcommunicating with said passages respectively, wherein saidphotosensitive sensors are mounted in said outer grooves respectively.27. The photosensitive unit, as recited in claim 1, wherein saidencapsulation portion further comprises a camera lens installing sectionintegrally molded to extend upwardly from said installing sectiondefining one or more receiving chambers right above said windowsrespectively for installing the camera lenses therein along saidphotosensitive paths of said photosensitive sensors respectively. 28.The photosensitive unit, as recited in claim 2, wherein saidencapsulation portion further comprises a camera lens installing sectionintegrally molded to extend upwardly from said installing sectiondefining one or more receiving chambers right above said windowsrespectively for installing the camera lenses therein along saidphotosensitive paths of said photosensitive sensors respectively. 29.The photosensitive unit, as recited in claim 15, wherein saidencapsulation portion further comprises a camera lens installing sectionintegrally molded to extend upwardly from said installing sectiondefining one or more receiving chambers right above said windowsrespectively for installing the camera lenses therein along saidphotosensitive paths of said photosensitive sensors respectively. 30.The photosensitive unit, as recited in claim 19, wherein saidencapsulation portion further comprises a camera lens installing sectionintegrally molded to extend upwardly from said installing sectiondefining one or more receiving chambers right above said windowsrespectively for installing the camera lenses therein along saidphotosensitive paths of said photosensitive sensors respectively.